Multiple bonding layers for thin-wafer handling
US-9263314-B2 · Feb 16, 2016 · US
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Zhong Xing-Fu patents
Zhong Xing-Fu holds 2 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 2 |
| Recent patents | 0 |
| First publication | Jan 27, 2015 |
| Latest publication | Feb 16, 2016 |
Filing trend
Year-over-year patent counts for this assignee.
Recent patents
Latest publications where this party is an assignee.
Cleaning composition for temporary wafer bonding materials
US-8940104-B2 · Jan 27, 2015 · US
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
Multiple bonding layers for thin-wafer handling
US-9263314-B2 · Feb 16, 2016 · US
Cleaning composition for temporary wafer bonding materials
US-8940104-B2 · Jan 27, 2015 · US
Top CPC classifications
Most common classification codes in this portfolio.
| CPC | Patents |
|---|---|
| H10P72/7448 | 1 |
| Y10T156/11 | 1 |
| Y10T428/31938 | 1 |
| Y10T428/31725 | 1 |
| Y10T428/24942 | 1 |
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Operations & Transport | 2 |
| Cross-Sectional Technologies | 2 |
| Chemistry & Metallurgy | 1 |
| Electricity | 1 |