Methods of transferring device wafers or layers between carrier substrates and other surfaces
US-9827757-B2 · Nov 28, 2017 · US
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Flaim Tony D patents
Flaim Tony D holds 5 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 5 |
| Recent patents | 0 |
| First publication | Aug 4, 2015 |
| Latest publication | Nov 28, 2017 |
Filing trend
Year-over-year patent counts for this assignee.
Recent patents
Latest publications where this party is an assignee.
Multiple bonding layers for thin-wafer handling
US-9263314-B2 · Feb 16, 2016 · US
Development of high-viscosity bonding layer through in-situ polymer chain extension
US-9127126-B2 · Sep 8, 2015 · US
Method for reversibly mounting a device wafer to a carrier substrate
US-9111981-B2 · Aug 18, 2015 · US
Article including a device wafer reversibly mountable to a carrier substrate
US-9099512-B2 · Aug 4, 2015 · US
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
Methods of transferring device wafers or layers between carrier substrates and other surfaces
US-9827757-B2 · Nov 28, 2017 · US
Multiple bonding layers for thin-wafer handling
US-9263314-B2 · Feb 16, 2016 · US
Development of high-viscosity bonding layer through in-situ polymer chain extension
US-9127126-B2 · Sep 8, 2015 · US
Method for reversibly mounting a device wafer to a carrier substrate
US-9111981-B2 · Aug 18, 2015 · US
Article including a device wafer reversibly mountable to a carrier substrate
US-9099512-B2 · Aug 4, 2015 · US
Top CPC classifications
Most common classification codes in this portfolio.
| CPC | Patents |
|---|---|
| H10P72/7422 | 5 |
| H10P72/7416 | 5 |
| H10P72/7412 | 5 |
| H10P72/74 | 5 |
| H01L21/6835 | 5 |
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Electricity | 5 |
| Cross-Sectional Technologies | 5 |
| Operations & Transport | 3 |
| Chemistry & Metallurgy | 1 |