Polishing pad for chemical mechanical polishing, chemical mechanical polishing apparatus inluding the same, and method of fabricating semiconductor device using the chemical mechanical polishing apparatus

Patent metadata

Field	Value
Publication number	US-2023211456-A1
Application number	US-202218066510-A
Country	US
Kind code	A1
Filing date	Dec 15, 2022
Priority date	Dec 30, 2021
Publication date	Jul 6, 2023
Grant date	—

Abstract

A polishing pad for chemical mechanical polishing includes a polymer matrix and a temperature sensitive agent dispersed in the polymer matrix and constituting 1 to 40% by volume of the polishing pad, wherein the temperature sensitive agent includes a two-dimensional (2D) sheet material having a thermal conductivity of 1 W/(m·K) or more.

First claim

What is claimed is:

1 . A polishing pad for chemical mechanical polishing, the polishing pad comprising:
a polymer matrix; and a temperature sensitive agent dispersed in the polymer matrix and constituting 1 to 40% by volume of the polishing pad, wherein the temperature sensitive agent comprises a two-dimensional (2D) sheet material having a thermal conductivity of 1 W/(m·K) or more.

2 . The polishing pad of claim 1 , wherein the 2D sheet material comprises at least one of graphene, graphene oxide, hexagonal boron nitride, graphitic carbon nitride, amorphous vanadium pentoxide, black phosphorous, silicene, and arsenene.

3 . The polishing pad of claim 2 , wherein the 2D sheet material comprises at least one of graphene and hexagonal boron nitride.

4 . The polishing pad of claim 1 , wherein the polymer matrix comprises at least one of polyurethane, polyolefin, and polycarbonate.

5 . The polishing pad of claim 4 , wherein the polymer matrix comprises polyurethane.

6 . The polishing pad of claim 1 , wherein the polishing pad has a thermal conductivity of 0.1 W/(m·K) or more.

7 . The polishing pad of claim 1 , wherein the polishing pad is a polishing pad for polishing a metal layer.

8 . A polishing pad for chemical mechanical polishing, the polishing pad comprising:
a polymer matrix; and a temperature sensitive agent dispersed in the polymer matrix, wherein the temperature sensitive agent comprises at least one of graphene, graphene oxide, hexagonal boron nitride, graphitic carbon nitride, amorphous vanadium pentoxide, black phosphorous, silicene, and arsenene.

9 . The polishing pad of claim 8 , comprising 1 to 40% by volume of the temperature sensitive agent based on 100% by volume of the polishing pad for chemical mechanical polishing.

10 . The polishing pad of claim 8 , wherein the temperature sensitive agent comprises hexagonal boron nitride.

11 . The polishing pad of claim 10 , wherein the polishing pad has a thermal conductivity of 1 W/(m·K) or more.

12 . The polishing pad of claim 8 , wherein the temperature sensitive agent comprises graphene.

13 . The polishing pad of claim 12 , wherein the polishing pad has a thermal conductivity of 0.1 W/(m·K) or more.

14 . The polishing pad of claim 8 , wherein the polishing pad is configured to polish a metal layer.

15 . A chemical mechanical polishing apparatus comprising:
a rotatable platen; a polishing pad on the platen; a polishing head assembly configured to provide a wafer onto the polishing pad; a slurry supply unit configured to provide a slurry for chemical mechanical polishing onto the polishing pad; and a temperature controller configured to control a polishing temperature for the wafer, wherein the polishing pad comprises a polymer matrix and a temperature sensitive agent dispersed in the polymer matrix, and the temperature sensitive agent comprises a 2D sheet material having a thermal conductivity of 1 W/(m·K) or more.

16 . The polishing apparatus of claim 15 , wherein the wafer comprises a semiconductor substrate and a metal layer on the semiconductor substrate, and the polishing pad is configured to perform a polishing process on the metal layer.

17 . The polishing apparatus of claim 15 , wherein the temperature controller is configured to control the polishing temperature by controlling the temperature of the polishing pad.

18 . The polishing apparatus of claim 15 , wherein the temperature controller is configured to control the polishing temperature by controlling the temperature of the slurry for chemical mechanical polishing.

19 . The polishing apparatus of claim 15 , wherein the 2D sheet material comprises at least one of graphene, graphene oxide, hexagonal boron nitride, graphitic carbon nitride, amorphous vanadium pentoxide, black phosphorous, silicene, and arsenene.

20 . The polishing apparatus of claim 15 , wherein the polishing pad comprises 1 to 40% by volume of the temperature sensitive agent based on 100% by volume of the polishing pad.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Byun Yea Rin
• Kim In Kwon
• Kim Bo Yun
• Kim Sang Kyun
• Yoon Bo Un
• Lee Hyo San
• Hwang Byung Keun

Classifications

• B24B37/24 Primary

  characterised by the composition or properties of the pad materials · CPC title

• H10P72/0428

  Apparatus for mechanical treatment or grinding or cutting · CPC title

• B24B37/015

  Temperature control · CPC title

• B24B57/02

  for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents · CPC title

• B24B49/14

  taking regard of the temperature during grinding · CPC title