Apparatus for polishing a wafer and method for fabricating a semiconductor device using the same
US-12341015-B2 · Jun 24, 2025 · US
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Yoon Bo Un patents
Yoon Bo Un is listed as an inventor on 21 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Yoon Bo Un |
| Total patents | 21 |
| First publication | Dec 1, 2016 |
| Latest publication | Jun 24, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Wafer chuck apparatus with air member and method of fabricating a semiconductor device using the same
US-2024063044-A1 · Feb 22, 2024 · US
Substrate cleaning equipment, substrate treatment system including the same, and method of fabricating semiconductor device using the substrate cleaning equipment
US-11791173-B2 · Oct 17, 2023 · US
Polishing pad for chemical mechanical polishing, chemical mechanical polishing apparatus inluding the same, and method of fabricating semiconductor device using the chemical mechanical polishing apparatus
US-2023211456-A1 · Jul 6, 2023 · US
Apparatus for polishing a wafer and method for fabricating a semiconductor device using the same
US-2023170222-A1 · Jun 1, 2023 · US
Methods of manufacturing semiconductor devices
US-11581318-B2 · Feb 14, 2023 · US
Methods of manufacturing semiconductor devices
US-2021242215-A1 · Aug 5, 2021 · US
Methods of manufacturing semiconductor devices
US-11011526-B2 · May 18, 2021 · US
Semiconductor device having plural dummy memory cells
US-10964751-B2 · Mar 30, 2021 · US
Method of forming semiconductor device
US-10943908-B2 · Mar 9, 2021 · US
Recent patents
Latest publications not already listed above.
Substrate cleaning equipment, substrate treatment system including the same, and method of fabricating semiconductor device using the substrate cleaning equipment
US-2020303218-A1 · Sep 24, 2020 · US
Method of manufacturing a semiconductor device
US-10741409-B2 · Aug 11, 2020 · US
Semiconductor device
US-2020235165-A1 · Jul 23, 2020 · US
Methods of manufacturing semiconductor devices
US-2020227315-A1 · Jul 16, 2020 · US
Method of forming semiconductor device
US-2020098763-A1 · Mar 26, 2020 · US
Method of forming semiconductor device using polishing resistance pattern
US-2019341358-A1 · Nov 7, 2019 · US
Semiconductor devices including insulating capping structures
US-10403640-B2 · Sep 3, 2019 · US
Semiconductor devices including insulating capping structures
US-2019074289-A1 · Mar 7, 2019 · US
Semiconductor devices including varied depth recesses for contacts
US-2018197861-A1 · Jul 12, 2018 · US
Method of manufacturing a semiconductor device
US-2018130672-A1 · May 10, 2018 · US
Semiconductor devices including varied depth recesses for contacts
US-2016351570-A1 · Dec 1, 2016 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Samsung Electronics Co Ltd | 22 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P52/00 | 9 |
| H10W20/069 | 6 |
| H10W20/098 | 6 |
| H10P95/06 | 6 |
| H10B12/09 | 6 |