Polishing pad for chemical mechanical polishing, chemical mechanical polishing apparatus inluding the same, and method of fabricating semiconductor device using the chemical mechanical polishing apparatus
US-2023211456-A1 · Jul 6, 2023 · US
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Patent family 86992982
This patent family groups 1 related publication across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 86992982 |
| Family type | — |
| Earliest priority | Dec 30, 2021 |
| First filing country | US |
| Member publications | 1 |
| Countries | US |
| Representative publication | US2023211456A1 — Polishing pad for chemical mechanical polishing, chemical mechanical polishing apparatus inluding the same, and method of fabricating semiconductor device using the chemical mechanical polishing apparatus |
Representative publication
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US2023211456A1 — Polishing pad for chemical mechanical polishing, chemical mechanical polishing apparatus inluding the same, and method of fabricating semiconductor device using the chemical mechanical polishing apparatus (published Jul 6, 2023)
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