Method of fabricating semiconductor device including organic and silicon oxide layers
US-12588478-B2 · Mar 24, 2026 · US
Hwang Byung Keun is listed as an inventor on 10 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Hwang Byung Keun |
| Total patents | 10 |
| First publication | May 11, 2023 |
| Latest publication | Mar 24, 2026 |
Publications ranked by popularity score, then publication date.
US-12588478-B2 · Mar 24, 2026 · US
US-12557370-B2 · Feb 17, 2026 · US
US-12500079-B2 · Dec 16, 2025 · US
US-2024093360-A1 · Mar 21, 2024 · US
US-2024071810-A1 · Feb 29, 2024 · US
US-2023282475-A1 · Sep 7, 2023 · US
US-2023264963-A1 · Aug 24, 2023 · US
US-2023211456-A1 · Jul 6, 2023 · US
US-2023193080-A1 · Jun 22, 2023 · US
US-2023142732-A1 · May 11, 2023 · US
Latest publications not already listed above.
No data yet.
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Samsung Electronics Co Ltd | 9 |
| Versum Mat Us Llc | 1 |
| Wonik Mat Co Ltd | 1 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10D84/038 | 7 |
| H10P50/71 | 6 |
| H10D84/0128 | 6 |
| H10D30/6757 | 6 |
| H10D30/43 | 6 |