Electrostatic carrier for die bonding applications

Patent metadata

Field	Value
Publication number	US-2018374736-A1
Application number	US-201816008569-A
Country	US
Kind code	A1
Filing date	Jun 14, 2018
Priority date	Jun 22, 2017
Publication date	Dec 27, 2018
Grant date	—

Abstract

Embodiments of the disclosure relate to the use of an electrostatic carrier for securing, transporting and assembling dies on a substrate. In one embodiment, an electrostatic carrier includes a body having a top surface and a bottom surface, at least a first bipolar chucking electrode disposed within the body, at least two contact pads disposed on the bottom surface of the body and connected to the first bipolar chucking electrode, and a floating electrode disposed between the first bipolar chucking electrode and the bottom surface. In another embodiment, a die-assembling system includes the electrostatic carrier configured to electrostatically secure a plurality of dies, a carrier-holding platform configured to hold the electrostatic carrier, a die input platform and a loading robot having a range of motion configured to pick the plurality of dies from the die input platform and place them on the electrostatic carrier.

First claim

What is claimed is:

1 . An electrostatic carrier comprising:
a body having a top surface and a bottom surface; at least a first bipolar chucking electrode disposed within the body; at least two contact pads disposed on the bottom surface of the body and connected to the first bipolar chucking electrode; and a floating electrode disposed between the first bipolar chucking electrode and the bottom surface.

2 . The electrostatic carrier of claim 1 , further comprising:
a second bipolar chucking electrode disposed within the body, the second bipolar chucking electrode independently controllable relative to the first bipolar chucking electrode.

3 . The electrostatic carrier of claim 1 , wherein the body has three or more layers.

4 . The electrostatic carrier of claim 3 , wherein the body further comprises:
a dielectric top layer disposed on top of a core layer wherein the first bipolar chucking electrode is disposed therein; and a dielectric bottom layer disposed below the core layer wherein the floating electrode is disposed therein.

5 . The electrostatic carrier of claim 4 , wherein the dielectric top layer and the dielectric bottom layer are formed from a silicon based ceramic material and the core layer is formed from an aluminum based ceramic material.

6 . The electrostatic carrier of claim 4 , further comprising:
a top hydrophobic layer on the dielectric top layer and a bottom hydrophobic layer disposed below the dielectric bottom layer.

7 . A die-assembling system, comprising:
an electrostatic carrier configured to electrostatically secure a plurality of dies, the electrostatic carrier comprising:
a body having a top surface and a bottom surface;
at least a first bipolar chucking electrode disposed within the body;
at least two contact pads disposed on the bottom surface of the body and connected to the first bipolar chucking electrode; and
a floating electrode disposed between the first bipolar chucking electrode and the bottom surface;
a carrier-holding platform configured to hold the electrostatic carrier; a die input platform; and a loading robot having a range of motion configured to pick the plurality of dies from the die input platform and place them on the electrostatic carrier.

8 . The die-assembling system of claim 7 wherein the electrostatic carrier further comprises:
a second bipolar chucking electrode disposed within the body, the second bipolar chucking electrode independently controllable relative to the first bipolar chucking electrode.

9 . The die-assembling system of claim 7 wherein the electrostatic carrier further comprises:
a hydrophobic coating disposed on the top surface and the bottom surface of the body.

10 . The die-assembling system of claim 7 , wherein the body of the electrostatic carrier has three or more layers.

11 . The die-assembling system of claim 10 , wherein the body of the electrostatic carrier further comprises:
a dielectric top layer disposed on top of a core layer wherein the first bipolar chucking electrode is disposed therein; and a dielectric bottom layer disposed below the core layer wherein the floating electrode is disposed therein.

12 . The die-assembling system of claim 11 , further comprising:
a top hydrophobic layer on the dielectric top layer and a bottom hydrophobic layer disposed below the dielectric bottom layer.

13 . The die-assembling system of claim 11 , wherein the dielectric top layer and the dielectric bottom layer are formed from a silicon based ceramic material.

14 . The die-assembling system of claim 13 , wherein the core layer is formed from an aluminum based ceramic material.

15 . The die-assembling system of claim 7 further comprising:
a second carrier-holding platform configured to receive the electrostatic carrier;
a first robot configured to move a substrate towards and away from the plurality of dies electrostatically chucked to the electrostatic carrier disposed in the second carrier-holding platform; and
a second robot configured to dispense a liquid on the plurality of dies.

16 . The die-assembling system of claim 7 , wherein the electrostatic carrier holding platform further comprising:
at least two pins configured to deliver electrical power to the first bipolar chucking electrode when the pin is in contact with the contact pads.

17 . A method of assembling a plurality of dies on a substrate, the method comprising:
placing the plurality of dies from a die input platform on to an electrostatic carrier; electrostatically chucking the plurality of dies to the electrostatic carrier; moving the electrostatic carrier to a carrier-holding platform of a die-assembling system; applying a liquid on the plurality of dies; moving a substrate to engage with the plurality of dies; and de-chucking the plurality of dies from the electrostatic carrier.

18 . The method of claim 17 further comprising:
pre-charging the electrostatic carrier on a carrier holding platform prior to placing the plurality of dies thereon.

19 . The method of claim 17 wherein the electrostatic carrier is charged after the plurality of dies are placed thereon.

20 . The method of claim 17 wherein the substrate engages with the plurality of dies is electrostatically chucked to a second carrier.

Assignees

• Applied Materials Inc

Inventors

• Kumar Niranjan
• Vellore Kim Ramkumar
• Burns Douglas H
• Pisharody Gautam
• Ramaswami Seshadri
• Buchberger Jr Douglas A

Classifications

• H10P72/7428

  used to support diced chips prior to mounting · CPC title

• H10P72/7402

  Wafer tapes, e.g. grinding or dicing support tapes · CPC title

• H10P72/0446

  Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates · CPC title

• H10P72/0411

  for wet cleaning or washing · CPC title

• H10P72/74

  using temporarily an auxiliary support · CPC title