High-side gate over-voltage stress testing

US2022260627A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2022260627-A1
Application numberUS-202217739911-A
CountryUS
Kind codeA1
Filing dateMay 9, 2022
Priority dateDec 22, 2016
Publication dateAug 18, 2022
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A field effect transistor (FET) engager, for example, includes electrically coupling a gate driver to a gate of a FET for testing the FET. The FET engager further includes providing a probe pad for test instrument measurement of the FET without test instrument capacitance impacting operation of the FET. The FET engager can electrically couple to the gate of the FET hold the gate of the FET at a low voltage while the source and drains are stress tested. The FET engager provides fail-safe mechanisms against accidental turn-on of the FET during operation. The FET engager can provide a second probe pad for selective test instrument turn-on of a second FET. The FET engager can allow test instrument measurement of gate current of the FET without test instrument capacitance impacting operation of the FET.

First claim

Opening claim text (preview).

What is claimed is: 1 . A circuit comprising: a substrate having a probe pad, a supply input, and an electrical ground input; a driver circuit having an output; a first transistor having a first control terminal coupled to the output of the driver circuit and having another terminal coupled to the supply input; and probe pad coupling circuitry including: a second transistor having a second control terminal and first and second terminals, the first terminal coupled to the output of the driver circuit and to the first control terminal, the second terminal coupled to the probe pad; and a diode having respective first and second terminals, the first terminal of the diode coupled to the second terminal of the second transistor and to the probe pad, the second terminal of the diode coupled to the electrical ground input. 2 . The circuit of claim 1 , wherein the first and second transistors are field effect transistors. 3 . The circuit of claim 1 , wherein the first and second transistors are n-type metal-oxide-semiconductor field-effect transistors. 4 . The circuit of claim 1 , wherein the probe pad coupling circuitry includes a resistor having respective first and second terminals, the first terminal of the resistor coupled to the second control terminal, the second terminal of the resistor coupled to the electrical ground input and to the second terminal of the diode. 5 . The circuit of claim 1 , wherein the substrate has a second probe pad coupled to the second control terminal. 6 . The circuit of claim 1 , wherein the substrate includes a controller having a respective output coupled to the second control terminal. 7 . The circuit of claim 1 , wherein the first terminal of the diode is an anode, and the second terminal is a cathode. 8 . A circuit comprising: a substrate having a probe pad, a supply input, and an electrical ground input; a driver circuit having an output; a field effect transistor (FET) having a gate coupled to the output of the driver circuit and having another terminal coupled to the supply input; and probe pad coupling circuitry including: a transistor having a control terminal and first and second terminals, the first terminal coupled to the output of the driver circuit and to the gate, the second terminal coupled to the probe pad; a diode having respective first and second terminals, the first terminal of the diode coupled to the second terminal of the transistor and to the probe pad, the second terminal of the diode coupled to the electrical ground input; and a resistor having respective first and second terminals, the first terminal of the resistor coupled to the control terminal, the second terminal of the resistor coupled to the electrical ground input and to the second terminal of the diode. 9 . The circuit of claim 8 , wherein the FET is a first FET, and the transistor is a second FET. 10 . The circuit of claim 8 , wherein the FET and the transistor are n-type metal-oxide-semiconductor field-effect transistors. 11 . The circuit of claim 8 , wherein the substrate has a second probe pad coupled to the control terminal. 12 . The circuit of claim 8 , wherein the substrate includes a controller having a respective output coupled to the control terminal. 13 . The circuit of claim 1 , wherein the first terminal of the diode is an anode, and the second terminal is a cathode. 14 . A system comprising: a test instrument having a probe; a substrate having a probe pad electrically coupled to the probe, having a supply input, and having an electrical ground input, the substrate including; a driver circuit having an output; a first field effect transistor (FET) having a first gate coupled to the output of the driver circuit and having another terminal coupled to the supply input; and probe pad coupling circuitry including: a second FET having a second gate and first and second terminals, the first terminal coupled to the output of the driver circuit and to the first gate, the second terminal coupled to the probe pad; a diode having respective first and second terminals, the first terminal of the diode coupled to the second terminal of the second FET and to the probe pad, the second terminal of the diode coupled to the electrical ground input. 15 . The system of claim 14 , wherein the first and second FETs are n-type metal-oxide-semiconductor field-effect transistors. 16 . The system of claim 14 , wherein the probe pad coupling circuitry includes a resistor having respective first and second terminals, the first terminal of the resistor coupled to the second gate, the second terminal of the resistor coupled to the electrical ground input and to the second terminal of the diode. 17 . The system of claim 14 , wherein the substrate has a second probe pad coupled to the second gate, and the system further comprising a second test instrument having a respective probe electrically coupled to the second probe pad. 18 . The system of claim 14 , wherein the substrate includes a controller having a respective output coupled to the second gate. 19 . The system of claim 14 , wherein the first terminal of the diode is an anode, and the second terminal is a cathode.

Assignees

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Classifications

  • for measuring break-down voltage therefor · CPC title

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Frequently asked questions

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What does patent US2022260627A1 cover?
A field effect transistor (FET) engager, for example, includes electrically coupling a gate driver to a gate of a FET for testing the FET. The FET engager further includes providing a probe pad for test instrument measurement of the FET without test instrument capacitance impacting operation of the FET. The FET engager can electrically couple to the gate of the FET hold the gate of the FET at a…
Who is the assignee on this patent?
Texas Instruments Inc
What technology area does this patent fall under?
Primary CPC classification G01R31/2623. Mapped technology areas include Physics.
When was this patent published?
Publication date Thu Aug 18 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).