Substrate liquid processing apparatus and substrate liquid processing method

Patent metadata

Field	Value
Publication number	US-2022074052-A1
Application number	US-201917415887-A
Country	US
Kind code	A1
Filing date	Dec 16, 2019
Priority date	Dec 28, 2018
Publication date	Mar 10, 2022
Grant date	—

Abstract

A substrate liquid processing apparatus configured to supply a plating liquid to a substrate includes a substrate holder configured to hold the substrate; a plating liquid sending device configured to send the plating liquid to a first flow path; a temperature controller connected to the plating liquid sending device via the first flow path and configured to control a temperature of a fluid supplied through the first flow path; an extrusion fluid sending device configured to send an extrusion fluid different from the plating liquid to the first flow path; and a discharge device connected to the temperature controller and configured to discharge a fluid supplied from the temperature controller.

First claim

1 . A substrate liquid processing apparatus configured to supply a plating liquid to a substrate, comprising:
a substrate holder configured to hold the substrate; a plating liquid sending device configured to send the plating liquid to a first flow path; a temperature controller connected to the plating liquid sending device via the first flow path and configured to control a temperature of a fluid supplied through the first flow path; an extrusion fluid sending device configured to send an extrusion fluid different from the plating liquid to the first flow path; and a discharge device connected to the temperature controller and configured to discharge a fluid supplied from the temperature controller.

2 . The substrate liquid processing apparatus of claim 1 , further comprising:
a controller configured to control the plating liquid sending device and the extrusion fluid sending device such that a timing of sending the plating liquid from the plating liquid sending device to the first flow path is different from a timing of sending the extrusion fluid from the extrusion fluid sending device to the first flow path.

3 . The substrate liquid processing apparatus of claim 1 ,
wherein the discharge device discharges the plating liquid sent from the temperature controller as the extrusion fluid is sent from the extrusion fluid sending device to the first flow path.

4 . The substrate liquid processing apparatus of claim 1 ,
wherein the discharge device has an opening through which the fluid is discharged, the discharge device is configured to be moved to be located at a discharge position where the opening faces the substrate held by the substrate holder and a retreat position where the opening does not face the substrate held by the substrate holder, and the discharge device discharges the extrusion fluid at the retreat position.

5 . The substrate liquid processing apparatus of claim 1 ,
wherein the substrate holder includes multiple substrate holders and the substrate includes multiple substrates, and the multiple substrates are held by the multiple substrate holders, respectively, and a supply of the plating liquid from the plating liquid sending device to the temperature controller through the first flow path and a sending of the extrusion fluid from the extrusion fluid sending device to the first flow path are repeated every one or every two or more of the multiple substrates.

6 . The substrate liquid processing apparatus of claim 1 ,
wherein the extrusion fluid includes an extrusion liquid.

7 . The substrate liquid processing apparatus of claim 6 ,
wherein the extrusion fluid includes an extrusion gas, and the extrusion fluid sending device includes an extrusion liquid supply configured to send the extrusion liquid to the first flow path and an extrusion gas supply configured to send the extrusion gas to the first flow path.

8 . The substrate liquid processing apparatus of claim 7 ,
wherein the extrusion gas is supplied into the temperature controller through the first flow path after the plating liquid is supplied into the temperature controller through the first flow path, and the extrusion liquid is supplied into the temperature controller through the first flow path after the extrusion gas is supplied into the temperature controller through the first flow path.

9 . The substrate liquid processing apparatus of claim 1 , further comprising:
a second flow path configured to connect the temperature controller to the discharge device; and a drain flow path connected to the second flow path and configured to drain a fluid inside the second flow path.

10 . A substrate liquid processing method of supplying a plating liquid to a substrate, comprising:
sending the plating liquid from a plating liquid sending device to a temperature controller through a first flow path; controlling, by the temperature controller, a temperature of the plating liquid supplied through the first flow path; and sending the plating liquid from the temperature controller to a discharge device by sending an extrusion fluid different from the plating liquid from an extrusion fluid sending device to the temperature controller through the first flow path, and discharging the plating liquid from the discharge device toward the substrate.

Assignees

• Tokyo Electron Ltd

Inventors

• Inatomi Yuichiro
• Esaki Tomonori

Classifications

• C23C18/48

  Coating with alloys · CPC title

• C23C18/44

  using reducing agents · CPC title

• C23C18/40

  using reducing agents · CPC title

• C23C18/1628 Primary

  Specific elements or parts of the apparatus · CPC title

• C23C18/1619

  Apparatus for electroless plating · CPC title