Copper-ceramic composite
US-11584696-B2 · Feb 21, 2023 · US
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Herbst Kai patents
Herbst Kai is listed as an inventor on 12 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Herbst Kai |
| Total patents | 12 |
| First publication | Jan 3, 2019 |
| Latest publication | Feb 21, 2023 |
Notable patents
Publications ranked by popularity score, then publication date.
Copper-ceramic composite
US-11498878-B2 · Nov 15, 2022 · US
Copper-ceramic composite
US-2021188718-A1 · Jun 24, 2021 · US
Copper/ceramic composite
US-11021407-B2 · Jun 1, 2021 · US
Copper-ceramic composite
US-11021406-B2 · Jun 1, 2021 · US
Copper/ceramic composite
US-2020308072-A1 · Oct 1, 2020 · US
Logic power module with a thick-film paste mediated substrate bonded with metal or metal hybrid foils
US-2020199029-A1 · Jun 25, 2020 · US
Copper-ceramic composite
US-2019084893-A1 · Mar 21, 2019 · US
Copper-ceramic composite
US-2019055166-A1 · Feb 21, 2019 · US
Copper-ceramic composite
US-2019055167-A1 · Feb 21, 2019 · US
Recent patents
Latest publications not already listed above.
Copper-ceramic composite
US-2019023619-A1 · Jan 24, 2019 · US
Thick-film paste mediated ceramics bonded with metal or metal hybrid foils
US-2019002359-A1 · Jan 3, 2019 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Heraeus Deutschland Gmbh & Co Kg | 12 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W70/692 | 11 |
| C04B2237/407 | 11 |
| C04B2237/343 | 11 |
| H10W40/255 | 10 |
| C04B37/021 | 10 |