Logic power module with a thick-film paste mediated substrate bonded with metal or metal hybrid foils
US-2020199029-A1 · Jun 25, 2020 · US
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Miric Anton patents
Miric Anton is listed as an inventor on 4 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Miric Anton |
| Total patents | 4 |
| First publication | Oct 4, 2018 |
| Latest publication | Jun 25, 2020 |
Notable patents
Publications ranked by popularity score, then publication date.
Method for producing a substrate arrangement, substrate arrangement, and method for connecting a substrate arrangement to an electronic component
US-10622331-B2 · Apr 14, 2020 · US
Thick-film paste mediated ceramics bonded with metal or metal hybrid foils
US-2019002359-A1 · Jan 3, 2019 · US
Method for producing a substrate arrangement, substrate arrangement, and method for connecting a substrate arrangement to an electronic component
US-2018286831-A1 · Oct 4, 2018 · US
Recent patents
Latest publications not already listed above.
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Heraeus Deutschland Gmbh & Co Kg | 4 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H01L24/27 | 3 |
| H01L2224/2732 | 3 |
| H01L24/29 | 3 |
| H01L2224/8384 | 3 |
| H01L24/83 | 3 |