Semiconductor package using a coreless signal distribution structure
US-11869879-B2 · Jan 9, 2024 · US
Applying pastes or inks, e.g. screen printing (H10W70/095 takes precedence)
Applying pastes or inks, e.g. screen printing (H10W70/095 takes precedence) · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10W70/098 |
| Official title | {Applying pastes or inks, e.g. screen printing (H10W70/095 takes precedence)} |
| Display label | Applying pastes or inks, e.g. screen printing (H10W70/095 takes precedence) |
| Total patents | 565 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 37 |
| 2016 | 44 |
| 2017 | 62 |
| 2018 | 74 |
| 2019 | 69 |
| 2020 | 66 |
| 2021 | 47 |
| 2022 | 51 |
| 2023 | 35 |
| 2024 | 36 |
| 2025 | 33 |
| 2026 | 11 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Method of Flip-Chip Assembly of Two Electronic Components by UV Annealing, and Assembly Obtained
US-2016372443-A1 · Dec 22, 2016 · US
Fabricating pillar solder bump
US-9508594-B2 · Nov 29, 2016 · US
Formation of solder and copper interconnect structures and associated techniques and configurations
US-9508667-B2 · Nov 29, 2016 · US
Methods of forming conductive jumper traces
US-9508635-B2 · Nov 29, 2016 · US
Semiconductor device packages
US-2016293508-A1 · Oct 6, 2016 · US
Packaging substrate having a through-holed interposer
US-9460992-B2 · Oct 4, 2016 · US
Solder on trace technology for interconnect attachment
US-9461008-B2 · Oct 4, 2016 · US
Integrated circuit packaging system with insulated trace and method of manufacture thereof
US-9406642-B1 · Aug 2, 2016 · US
Self-aligned capillarity-assisted microfabrication
US-9401306-B2 · Jul 26, 2016 · US
Semiconductor device manufacturing method and semiconductor device
US-2016197024-A1 · Jul 7, 2016 · US
Method for making high density substrate interconnect using inkjet printing
US-9349703-B2 · May 24, 2016 · US
Flip-chip hybridisation of two microelectronic components using a UV anneal
US-9318453-B2 · Apr 19, 2016 · US
Method for producing a conversion lamina and conversion lamina
US-9312452-B2 · Apr 12, 2016 · US
Method and apparatus for high temperature semiconductor device packages and structures using a low temperature process
US-9312231-B2 · Apr 12, 2016 · US
Intermetallic compound filled vias
US-9305866-B2 · Apr 5, 2016 · US
Packaged device with additive substrate surface modification
US-2016093558-A1 · Mar 31, 2016 · US
Fabricating pillar solder bump
US-9299606-B2 · Mar 29, 2016 · US
Fabricating pillar solder bump
US-2016056116-A1 · Feb 25, 2016 · US
Multilayer wiring substrate, manufacturing method therefor, and substrate for probe card
US-2016044782-A1 · Feb 11, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10W70/098?
- CPC H10W70/098 is the Cooperative Patent Classification code for “Applying pastes or inks, e.g. screen printing (H10W70/095 takes precedence).”
- How many patents are filed under CPC H10W70/098 (Applying pastes or inks, e.g. screen printing (H10W70/095 takes precedence))?
- Our database includes 565 publications tagged with this CPC code.
- Is patent activity under CPC H10W70/098 growing?
- Publication counts under this code: 36 in 2024 vs 33 in 2025 (latest complete years).