Multi-Column Scanning Electron Microscopy System

Patent metadata

Field	Value
Publication number	US-2018358200-A1
Application number	US-201715616749-A
Country	US
Kind code	A1
Filing date	Jun 7, 2017
Priority date	Jun 7, 2017
Publication date	Dec 13, 2018
Grant date	—

Abstract

A multi-column scanning electron microscopy (SEM) system is disclosed. The SEM system includes a source assembly. The source assembly includes two or more electron beam sources configured to generate a plurality of electron beams. The source assembly also includes two or more sets of positioners configured to actuate the two or more electron beam sources. The SEM system also includes a column assembly. The column assembly includes a plurality of substrate arrays. The column assembly also includes two or more electron-optical columns formed by a set of column electron-optical elements bonded to the plurality of substrate arrays. The SEM system also includes a stage configured to secure a sample that at least one of emits or scatters electrons in response to the plurality of electron beams directed by the two or more electron-optical columns to the sample.

First claim

1 . A multi-column scanning electron microscopy (SEM) system comprising:
a source assembly comprising:
two or more electron beam sources configured to generate a plurality of electron beams, wherein a particular electron beam source of the two or more electron beam sources is configured to generate an electron beam of the plurality of electron beams; and
two or more sets of positioners coupled to the two or more electron beam sources, wherein at least some of the two or more sets of positioners are configured to individually translate an electron beam source of the two or more electron beam sources;
a column assembly comprising:
a plurality of substrate arrays; and
two or more electron-optical columns, wherein at least some of the two or more electron-optical columns are formed by a set of column electron-optical elements bonded to the plurality of substrate arrays; and
a stage configured to secure a sample, wherein at least some of the two or more electron-optical columns are configured to direct at least a portion of an electron beam of the plurality of electron beams to a surface of the sample, wherein the sample emits or scatters electrons in response to the at least a portion of an electron beam of the plurality of electron beams.

2 . The system in claim 1 , wherein the source assembly comprises:
two or more sets of source electron-optical elements, wherein at least some of the two or more sets of source electron-optical elements are configured to direct at least a portion of an electron beam of the plurality of electron beams to an electron-optical column of the two or more electron-optical columns.

3 . The system in claim 1 , wherein at least some of the two or more electron beam sources include:
at least one of a Schottky emitter device, a carbon nanotube (CNT) emitter, a nanostructured carbon film emitter, or a Muller-type emitter.

4 . The system in claim 1 , wherein at least some of the two or more sets of positioners include one or more positioners configured to individually translate an electron beam source of the two or more electron beam sources in at least one of an x-direction, a y-direction, or a z-direction.

5 . The system in claim 4 , wherein at least some of the two or more sets of positioners include three positioners configured to individually translate an electron beam source of the two or more electron beam sources in an x-direction, a y-direction, and a z-direction.

6 . The system in claim 4 , where at least some of the one or more positioners are individually adjustable.

7 . The system in claim 1 , wherein the plurality of substrate arrays are arranged within a plurality of substrate array assemblies, wherein a substrate array assembly of the plurality of substrate array assemblies includes one or more substrate arrays of the plurality of substrate arrays.

8 . The system in claim 7 , wherein at least one shielding element is positioned between the one or more substrate arrays.

9 . The system in claim 1 , wherein a substrate array of the plurality of substrate arrays comprise:
a composite substrate formed from a plurality of substrate layers, wherein the composite substrate includes a plurality of holes; a plurality of electrical components embedded within the plurality of substrate layers; and one or more metal layers coupled to at least one surface of the composite substrate.

10 . The system in claim 9 , wherein a column electron-optical element of the set of column-electron optical elements is positioned over a particular hole of the plurality of holes in the composite substrate.

11 . The system in claim 10 , wherein a column electron-optical element of the set of column-electron optical elements is partially inserted within the particular hole of the plurality of holes in the composite substrate.

12 . The system in claim 10 , wherein a portion of the particular hole of the plurality of holes includes at least one of a coating formed via a thin film metallization process, a fabricated shield, or unprotected substrate.

13 . The system in claim 9 , wherein a column electron-optical element of the set of column-electron optical elements is bonded to a particular metal layer of the one or more metal layers.

14 . The system in claim 9 , wherein at least some of the plurality of electrical components embedded within the plurality of substrate layers include one of one or more electrical traces and one or more electrical vias.

15 . The system in claim 14 , wherein the one or more electrical traces are electrically coupled to one or more bonding pads in the one or more metal layers with the one or more electrical vias.

16 . The system in claim 14 , wherein the one or more electrical traces are electrically coupled to one or more connector contact pads coupled to at least one surface of the composite layer.

17 . The system in claim 9 , wherein the one or more metal layers are formed via at least one of a thin-film or a thick-film metallization process.

18 . The system in claim 1 , wherein at least some of the two or more electron-optical columns include one or more identical column electron-optical elements, wherein at least some of the one or more identical electron-optical elements is bonded to a same surface of a particular substrate array of the plurality of substrate arrays.

19 . The system in claim 1 , wherein the set of column electron-optical elements within an electron-optical column includes one or more extractors.

20 . The system in claim 1 , wherein the set of column electron-optical elements within an electron-optical column includes one or more beam limiting apertures.

21 . The system in claim 1 , wherein the set of column electron-optical elements within an electron-optical column includes one or more magnetic lens assemblies.

22 . The system in claim 21 , wherein the one or more magnetic lens assemblies include at least one of one or more magnetic condenser lenses or one or more magnetic focus lenses.

23 . The system in claim 1 , wherein the set of column electron-optical elements within an electron-optical column includes one or more gun multipole beam deflectors.

24 . The system in claim 23 , wherein the one or more multipole beam deflectors include at least one of one or more gun quadrupole beam deflectors or one or more gun octupole beam deflectors.

25 . The system in claim 1 , wherein the set of column electron-optical elements within an electron-optical column includes one or more gun condensers.

26 . The system in claim 1 , wherein the set of column electron-optical elements within an electron-optical column includes one or more anodes.

27 . The system in claim 1 , wherein the set of column electron-optical elements within an electron-optical column includes one or more electron detector assemblies.

28 . The system in claim 27 , wherein an electron detector assembly of the one or more electron detector assemblies comprises:
a detector diode; and a detector shield.

29 . The system in claim 27 , wherein the one or more electron detector assemblies are bonded to a particular substrate array of the plurality of substrate arrays, wherein the particular substrate array includes amplifier circuitry electrically coupled to at least some of the one or more electron detector assemblies.

30 . The system in claim 1 , wherein the s

Assignees

• Kla Tencor Corp

Inventors

• Haynes Robert
• Gerling John
• Welk Aron
• Sears Christopher
• Fuks Felipe
• Nasser-Ghodsi Mehran
• Plettner Tomas

Classifications

• H01J37/1471

  for centering, aligning or positioning of ray or beam · CPC title

• H01J37/18

  Vacuum locks {; Means for obtaining or maintaining the desired pressure within the vessel} · CPC title

• H01J37/285

  Emission microscopes, e.g. field-emission microscopes · CPC title

• H01J37/14

  magnetic · CPC title

• H01J37/1474 Primary

  Scanning means · CPC title