Resin composition, cured object, sheet, layered product, and printed wiring board
US-2025109250-A1 · Apr 3, 2025 · US
Unsaturated polyimide precursors
Unsaturated polyimide precursors · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C09D179/085 |
| Official title | {Unsaturated polyimide precursors} |
| Display label | Unsaturated polyimide precursors |
| Total patents | 67 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 8 |
| 2016 | 2 |
| 2017 | 7 |
| 2018 | 5 |
| 2019 | 6 |
| 2020 | 4 |
| 2021 | 13 |
| 2022 | 6 |
| 2023 | 2 |
| 2024 | 6 |
| 2025 | 6 |
| 2026 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Photoimagable dielectrics
US-2024317940-A1 · Sep 26, 2024 · US
Curable maleimide resin composition, adhesive, primer, chip coating agent, and semiconductor device
US-2024247128-A1 · Jul 25, 2024 · US
Bismaleimide compound, resin varnish, and production method thereof
US-2024182646-A1 · Jun 6, 2024 · US
Curable composition
US-11952462-B2 · Apr 9, 2024 · US
Heat-curable bismaleimide resin composition
US-2024084075-A1 · Mar 14, 2024 · US
Polyimide, laminate, and electronic device including same
US-11898009-B2 · Feb 13, 2024 · US
Fixing film and method of producing same, fixing device, and electrophotographic image forming apparatus
US-2023393506-A1 · Dec 7, 2023 · US
Method for producing cured product of heat-curable maleimide resin composition
US-2023340299-A1 · Oct 26, 2023 · US
Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device
US-11447658-B2 · Sep 20, 2022 · US
Method for producing aqueous polyimide precursor solution composition
US-11407857-B2 · Aug 9, 2022 · US
Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device
US-2022204810-A1 · Jun 30, 2022 · US
High temperature, conductive thermosetting resin compositions
US-2022064352-A1 · Mar 3, 2022 · US
Film forming material for lithography, composition for film formation for lithography, underlayer film for lithography, and method for forming pattern
US-2022019146-A1 · Jan 20, 2022 · US
Dielectric Film Forming Compositions
US-2022017673-A1 · Jan 20, 2022 · US
Film forming material for lithography, composition for film formation for lithography, underlayer film for lithography, and method for forming pattern
US-2021405529-A1 · Dec 30, 2021 · US
Heat-curable maleimide resin composition and adhesive agent, substrate material, primer, coating material and semiconductor device using same
US-2021371594-A1 · Dec 2, 2021 · US
Imide oligomer, varnish, cured products thereof, and prepreg and fiber-reinforced composite material using these
US-2021340327-A1 · Nov 4, 2021 · US
Curable composition
US-2021269593-A1 · Sep 2, 2021 · US
Vinyl-modified maleimide, composition and article made thereby
US-11066520-B2 · Jul 20, 2021 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C09D179/085?
- CPC C09D179/085 is the Cooperative Patent Classification code for “Unsaturated polyimide precursors.”
- How many patents are filed under CPC C09D179/085 (Unsaturated polyimide precursors)?
- Our database includes 67 publications tagged with this CPC code.
- Is patent activity under CPC C09D179/085 growing?
- Publication counts under this code: 6 in 2024 vs 6 in 2025 (latest complete years).