Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit board
US-11769607-B2 · Sep 26, 2023 · US
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Tomizawa Katsuya patents
Tomizawa Katsuya is listed as an inventor on 30 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Tomizawa Katsuya |
| Total patents | 30 |
| First publication | Sep 24, 2015 |
| Latest publication | Sep 26, 2023 |
Notable patents
Publications ranked by popularity score, then publication date.
Curable composition, prepreg, resin sheet, metal foil-clad laminate and printed wiring board
US-11718708-B2 · Aug 8, 2023 · US
Resin composition for printed wiring board, prepreg, laminate, metal foil-clad laminate, printed wiring board, and multilayer printed wiring board
US-11702504-B2 · Jul 18, 2023 · US
Curable composition, prepreg, resin sheet, metal foil-clad laminate and printed wiring board
US-11499005-B2 · Nov 15, 2022 · US
Curable composition, prepreg, resin sheet, metal foil-clad laminate and printed wiring board
US-2022325034-A1 · Oct 13, 2022 · US
Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit board
US-2022076859-A1 · Mar 10, 2022 · US
Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit board
US-11195638-B2 · Dec 7, 2021 · US
Resin composition for printed wiring board, prepreg, laminate, metal foil-clad laminate, printed wiring board, and multilayer printed wiring board
US-2021301071-A1 · Sep 30, 2021 · US
Curable composition, prepreg, resin sheet, metal foil-clad laminate and printed wiring board
US-2021261722-A1 · Aug 26, 2021 · US
Thermosetting composition, prepreg, laminate, metal foil-clad laminate, printed wiring board, and multilayer printed wiring board
US-2021147614-A1 · May 20, 2021 · US
Recent patents
Latest publications not already listed above.
Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit board
US-10815349-B2 · Oct 27, 2020 · US
Resin composition and prepreg, resin sheet, laminate, and printed circuit board comprising same
US-10717837-B2 · Jul 21, 2020 · US
Resin composition, prepreg or resin sheet comprising the resin composition, and laminate and printed circuit board comprising them
US-10703874-B2 · Jul 7, 2020 · US
Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit board
US-10676579-B2 · Jun 9, 2020 · US
Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit board
US-2020152349-A1 · May 14, 2020 · US
Resin composition and prepreg, resin sheet, laminate, and printed circuit board
US-10563029-B2 · Feb 18, 2020 · US
Resin composition, prepreg, metal foil-clad laminate, and printed circuit board
US-10550228-B2 · Feb 4, 2020 · US
Insulating layer for printed circuit board and printed circuit board
US-10292260-B2 · May 14, 2019 · US
Resin composition, prepreg, laminate, metal foil-clad laminate, and printed-wiring board
US-10138393-B2 · Nov 27, 2018 · US
Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit board
US-2018197655-A1 · Jul 12, 2018 · US
Resin composition and prepreg, resin sheet, laminate, and printed circuit board
US-2018186952-A1 · Jul 5, 2018 · US
Resin composition, prepreg, metal foil-clad laminate, and printed circuit board
US-2018186933-A1 · Jul 5, 2018 · US
Resin composition and prepreg, resin sheet, laminate, and printed circuit board comprising same
US-2018179354-A1 · Jun 28, 2018 · US
Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit board
US-2018179355-A1 · Jun 28, 2018 · US
Resin composition, prepreg or resin sheet comprising the resin composition, and laminate and printed circuit board comprising them
US-2018179353-A1 · Jun 28, 2018 · US
Method for producing printed circuit board, and resin composition
US-2018163048-A1 · Jun 14, 2018 · US
Resin composition, prepreg, laminate, and printed wiring board
US-9902851-B2 · Feb 27, 2018 · US
Insulating layer for printed circuit board, and printed circuit board
US-2016309582-A1 · Oct 20, 2016 · US
Resin composition, prepreg, laminate, metal foil-clad laminate, and printed-wiring board
US-2015344733-A1 · Dec 3, 2015 · US
Resin composition, prepreg, laminate, and printed wiring board
US-2015267047-A1 · Sep 24, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Mitsubishi Gas Chemical Co | 30 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| C08J5/244 | 30 |
| C08J5/24 | 27 |
| H05K1/0373 | 26 |
| C08J5/249 | 22 |
| C08K3/36 | 20 |