Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit board
US-2018155514-A1 · Jun 7, 2018 · US
Shiga Eisuke is listed as an inventor on 2 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Shiga Eisuke |
| Total patents | 2 |
| First publication | Jul 28, 2016 |
| Latest publication | Jun 7, 2018 |
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Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Mitsubishi Gas Chemical Co | 2 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H05K1/0373 | 2 |
| C08J5/24 | 2 |
| C08J5/249 | 2 |
| C08J5/244 | 2 |
| H05K1/0366 | 2 |