Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of pyrazole compounds and bisepoxides
US-10508349-B2 · Dec 17, 2019 · US
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Patent family 59091406
This patent family groups 2 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 59091406 |
| Family type | — |
| Earliest priority | Jun 27, 2016 |
| First filing country | US |
| Member publications | 2 |
| Countries | US |
| Representative publication | US10508349B2 — Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of pyrazole compounds and bisepoxides |
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US10508349B2 — Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of pyrazole compounds and bisepoxides (published Dec 17, 2019)
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