Silver-plated product
US-2016273120-A1 · Sep 22, 2016 · US
Ni-plated copper or copper alloy material, connector terminal, connector and electronic component using the same
US10361501B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10361501-B2 |
| Application number | US-201616082622-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 29, 2016 |
| Priority date | Mar 9, 2016 |
| Publication date | Jul 23, 2019 |
| Grant date | Jul 23, 2019 |
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- Title
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Abstract
Official abstract text for this publication.
In the Ni-plated copper or copper alloy material having, an area ratio of a crystal having <001> plane orientation in a crystal plane parallel to a surface of a Ni plating, measured by an electron backscatter diffraction, is 15 to 35%.
First claim
Opening claim text (preview).
What is claimed is: 1. A Ni-plated copper or copper alloy material, wherein an area ratio of a crystal having <001> plane orientation in a crystal plane parallel to a surface of a Ni plating, measured by an electron backscatter diffraction, is 15 to 35%. 2. The Ni-plated copper or copper alloy material according to claim 1 , wherein the area ratio of the crystal having <001> plane orientation in the crystal plane parallel to the surface of the Ni plating is 15 to 20%. 3. The Ni-plated copper or copper alloy material according to claim 1 , wherein an ultrafine indentation hardness of the surface of the Ni plating is 4500N/mm 2 or more. 4. The Ni-plated copper or copper alloy material according to claim 3 , wherein the ultrafine indentation hardness of the surface of the Ni plating is 4800N/mm 2 or more. 5. A connector terminal comprising a contact part consisting of the Ni-plated copper or copper alloy material according to claim 1 . 6. An FFC terminal comprising a contact part consisting of the Ni-plated copper or copper alloy material according to claim 1 . 7. An FPC terminal comprising a contact part consisting of the Ni-plated copper or copper alloy material according to claim 1 . 8. An electronic component comprising an external connecting electrode consisting of the Ni-plated copper or copper alloy material according to claim 1 . 9. An electronic component comprising a mounting portion to be attached to a housing, wherein a female terminal connection portion and a board connection portion are provided respectively on one side and the other side of a mounting portion, and a push-in type terminal for fixing the board connection portion to a board by pushing the board connection portion into a through hole formed in the board, wherein the push-in type terminal consists of the Ni-plated copper or copper alloy material according to claim 1 .
Assignees
Inventors
Classifications
Pretreatment of metallic surfaces to be electroplated · CPC title
of nickel or cobalt · CPC title
all layers being exclusively metallic {(making layered metal workpieces by pressure cladding B23K20/22; making coatings with a metallic material characterised by its composition C23C30/00)} · CPC title
- H01R13/03Primary
characterised by the material, e.g. plating, or coating materials · CPC title
Terminals having a press fit or a compliant portion and a shank passing through a hole in the printed circuit board · CPC title
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Frequently asked questions
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- What does patent US10361501B2 cover?
- In the Ni-plated copper or copper alloy material having, an area ratio of a crystal having <001> plane orientation in a crystal plane parallel to a surface of a Ni plating, measured by an electron backscatter diffraction, is 15 to 35%.
- Who is the assignee on this patent?
- Jx Nippon Mining & Metals Corp
- What technology area does this patent fall under?
- Primary CPC classification H01R13/03. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jul 23 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).