Highly compact metal-CNT composites and manufacture thereof
US-12366005-B2 · Jul 22, 2025 · US
Electroplating using ultrasonic waves
Electroplating using ultrasonic waves · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C25D5/20 |
| Official title | Electroplating using ultrasonic waves |
| Display label | Electroplating using ultrasonic waves |
| Total patents | 48 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 4 |
| 2016 | 2 |
| 2017 | 8 |
| 2018 | 2 |
| 2019 | 4 |
| 2020 | 3 |
| 2021 | 6 |
| 2022 | 3 |
| 2023 | 6 |
| 2024 | 5 |
| 2025 | 5 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Plating device and plating formation method
US-2025223718-A1 · Jul 10, 2025 · US
Electrolytic copper foil and preparation method therefor, negative electrode plate, secondary battery, battery module, battery pack and power consuming device
US-12327862-B2 · Jun 10, 2025 · US
Coating system and method for e-coating and degasification of e-coat fluid during e-coat
US-12305308-B2 · May 20, 2025 · US
Anodizing method and manufacturing method for an anisotropic conductive member
US-12227863-B2 · Feb 18, 2025 · US
Film forming apparatus for metal film
US-2024344224-A1 · Oct 17, 2024 · US
Mechanically-driven oscillating flow agitation
US-12104269-B2 · Oct 1, 2024 · US
Highly compact metal-cnt composites and manufacture thereof
US-2024309535-A1 · Sep 19, 2024 · US
Electroforming method and system
US-2024309534-A1 · Sep 19, 2024 · US
Systems and methods for shielding features of a workpiece during electrochemical deposition
US-11987897-B2 · May 21, 2024 · US
Electrolytic copper foil and preparation method therefor, negative electrode plate, secondary battery, battery module, battery pack and power consuming device
US-2023323556-A1 · Oct 12, 2023 · US
Coating system and method for e-coating and degasification of e-coat fluid during e-coat
US-2023287592-A1 · Sep 14, 2023 · US
Coating system and method for e-coating and degasification of e-coat fluid during e-coat
US-11692278-B2 · Jul 4, 2023 · US
Mechanically-driven oscillating flow agitation
US-2023193504-A1 · Jun 22, 2023 · US
Method and apparatus for uniformly metallization on substrate
US-11629425-B2 · Apr 18, 2023 · US
Mechanically-driven oscillating flow agitation
US-11585009-B2 · Feb 21, 2023 · US
Systems and methods for electroplating sources for alpha spectroscopy
US-11421336-B2 · Aug 23, 2022 · US
Mechanically-driven oscillating flow agitation
US-2022145485-A1 · May 12, 2022 · US
Mechanically-driven oscillating flow agitation
US-11230793-B2 · Jan 25, 2022 · US
Anodizing method and manufacturing method for an anisotropic conductive member
US-2021363653-A1 · Nov 25, 2021 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C25D5/20?
- CPC C25D5/20 is the Cooperative Patent Classification code for “Electroplating using ultrasonic waves.”
- How many patents are filed under CPC C25D5/20 (Electroplating using ultrasonic waves)?
- Our database includes 48 publications tagged with this CPC code.
- Is patent activity under CPC C25D5/20 growing?
- Publication counts under this code: 5 in 2024 vs 5 in 2025 (latest complete years).