Novel adhesion promoting agents for metallisation of substrate surfaces

Patent metadata

Field	Value
Publication number	US-2016237571-A1
Application number	US-201415024043-A
Country	US
Kind code	A1
Filing date	Sep 22, 2014
Priority date	Sep 26, 2013
Publication date	Aug 18, 2016
Grant date	—

Abstract

A method is provided for metallisation of non-conductive substrates providing a high adhesion of the deposited metal to the substrate material and thereby forming a durable bond. The method applies a novel combination of a metal oxide compound to promote adhesion and a transition metal plating catalyst compound promoting the metal layer formation.

First claim

1 . Wet chemical method for plating a metal onto a non-conductive substrate comprising the steps of
i. depositing on at least a portion of the non-conductive substrate surface a metal oxide compound selected from the group consisting of zinc oxides, titanium oxides, zirconium oxides, aluminum oxides, silicon oxides, and tin oxides or mixtures of the aforementioned and a transition metal plating catalyst compound selected from the group consisting of copper oxides, nickel oxides, and cobalt oxides and mixtures of the aforementioned, wherein the non-conductive substrate is a ceramic, semiconductor or glass substrate and thereafter ii. heat treating the non-conductive substrate at a temperature of more than 400° C. and thereby forming an adhesive catalytic layer of the metal oxide compound and the transition metal plating catalyst compound on at least a portion of the substrate surface; and thereafter; iii. metal plating at least the substrate surface bearing the transition metal plating catalyst compound by applying a wet-chemical electroless plating method, wherein the composition for plating comprises a source of the metal ions to be plated and a reducing agent, and iv. heating of the metal plating layer to a temperature of between 150° and 500° C.

2 . Method according to claim 1 wherein the metal oxide compound is selected from the group consisting of ZnO, TiO 2 , ZrO 2 , Al 2 O 3 , SiO 2 , SnO 2 or mixtures of the aforementioned.

3 . Method according claim 1 wherein the transition metal plating catalyst compound is selected from the group consisting of CuO, Cu 2 O, NiO, Ni 2 O 3 , CoO, Co 2 O 3 or mixtures of the aforementioned.

4 . Method according claim 1 wherein the metal oxide compound and the transition metal plating catalyst compound are deposited onto the substrate surface simultaneously.

5 . Method according claim 1 wherein the metal oxide compound and the transition metal plating catalyst compound are deposited onto the substrate surface as a colloidal dispersion.

6 . (canceled)

7 . Method according claim 1 wherein the depositing on at least a portion of the non-conductive substrate surface a metal oxide compound and the transition metal plating catalyst compound comprises:
i. contacting the substrate with a metal oxide precursor compound and a transition metal plating catalyst precursor compound, suitable to form the metal oxide compound and the transition metal plating catalyst compound upon heat treatment and thereafter
ii. heat treating the non-conductive substrate at a temperature in the range from 350° C. to 1200° C. and thereby forming an adhesive catalytic layer of the metal oxide compound from the metal oxide precursor compound and the transition metal plating catalyst compound from the transition the metal plating catalyst precursor compound on at least a portion of the substrate surface.

8 . Method according to claim 7 wherein the metal oxide precursor compound and the transition metal plating catalyst precursor compound is selected from the group consisting of metal methoxylate, ethoxylate, propoxylate, butoxylate, acetate, acetyl-acetonates nitrate, chloride, bromide and iodide.

9 . Method according claim 1 wherein a further method step is performed after method step ii.
iia. contacting the substrate with an aqueous acidic or aqueous alkaline solution.

10 . Method according claim 1 wherein the substrate is a non-conductive or semiconductor substrate and the step
iii. metal plating the substrate applying a wet-chemical plating method;
comprises:
iiib. contacting the substrate with an aqueous electroless metal plating solution which comprises a source of the metal ions to be plated and a reducing agent; and
iiic. contacting the substrate with an electrolytic metal plating solution.

11 . Method according claim 1 wherein the electroless metal plating solution is a nickel or copper plating solution.

12 . Method according to claim 10 wherein the electrolytic metal plating solution is a nickel or copper plating solution.

13 . (canceled)

14 . (canceled)

Assignees

• Atotech Deutschland Gmbh

Inventors

• Liu Zhiming
• Fu Hailuo
• Hunegnaw Sara
• Brandt Lutz
• Magaya Tafadzwa

Classifications

• H10P14/47

  Electrolytic deposition, i.e. electroplating; Electroless plating · CPC title

• C23C18/1882

  Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers · CPC title

• C23C28/3225

  with at least one zinc-based layer · CPC title

• H01L21/2885

  Electricity · mapped topic

• C23C18/405

  Formaldehyde · CPC title