Catalyst layer forming method, catalyst layer forming system, and recording medium

Patent metadata

Field	Value
Publication number	US-2016013102-A1
Application number	US-201514796227-A
Country	US
Kind code	A1
Filing date	Jul 10, 2015
Priority date	Jul 14, 2014
Publication date	Jan 14, 2016
Grant date	—

Abstract

A catalyst layer can be uniformly formed on an entire surface of a substrate and an entire inner surface of a recess. A catalyst layer forming method of forming the catalyst layer on the substrate includes a first supply processing of forming a substrate surface catalyst layer 22 A by supplying a catalyst liquid on the entire surface of the substrate 2 ; and a second supply processing of forming a recess inner surface catalyst layer 22 B by supplying the catalyst liquid to a central portion of the substrate 2 while rotating the substrate 2.

First claim

We claim:

1 . A catalyst layer forming method of forming a catalyst layer on a substrate, comprising:
a preparation processing of preparing the substrate including a recess; a first supply processing of forming a substrate surface catalyst layer by supplying a catalyst liquid including a catalyst on the substrate such that the catalyst liquid is widely diffused to an entire surface of the substrate and by uniformly adsorbing the catalyst to the entire surface of the substrate; and a second supply processing of forming a recess inner surface catalyst layer by supplying the catalyst liquid to a central portion of the substrate while rotating the substrate and by adsorbing the catalyst to an entire inner surface of the recess.

2 . The catalyst layer forming method of claim 1 ,
wherein in the first supply processing, the catalyst liquid is supplied through a nozzle while the substrate is rotated, and the nozzle is moved back and forth between above the central portion of the substrate and above a peripheral portion thereof.

3 . The catalyst layer forming method of claim 1 ,
wherein in the first supply processing, the catalyst liquid is supplied through a spray nozzle to the entire surface of the substrate in a spray form.

4 . The catalyst layer forming method of claim 1 ,
wherein in the second supply processing, the catalyst liquid is supplied through a nozzle, and the nozzle is slightly moved back and forth near above the central portion of the substrate.

5 . The catalyst layer forming method of claim 1 ,
wherein in the second supply processing, the catalyst liquid is supplied through a nozzle, and the nozzle is stopped above the central portion of the substrate.

6 . The catalyst layer forming method of claim 1 ,
wherein in the second supply processing, the catalyst liquid is supplied through a spray nozzle to the central portion of the substrate in a spray form.

7 . A catalyst layer forming system of forming a catalyst layer on a substrate, comprising:
a substrate holding/rotating device configured to rotatably hold the substrate including a recess; a first supply unit configured to form a substrate surface catalyst layer by supplying a catalyst liquid including a catalyst on the substrate such that the catalyst liquid is widely diffused to an entire surface of the substrate and by uniformly adsorbing the catalyst to the entire surface of the substrate; and a second supply unit configured to form a recess inner surface catalyst layer by supplying the catalyst liquid to a central portion of the substrate while the substrate is rotated by the substrate holding/rotating device and by adsorbing the catalyst to an entire inner surface of the recess.

8 . The catalyst layer forming system of claim 7 ,
wherein the first supply unit includes a nozzle configured to supply the catalyst liquid while the substrate is rotated by the substrate holding/rotating device, and the nozzle is moved back and forth between above the central portion of the substrate and above a peripheral portion thereof.

9 . The catalyst layer forming system of claim 7 ,
wherein the first supply unit includes a spray nozzle configured to supply the catalyst liquid to the entire surface of the substrate in a spray form.

10 . The catalyst layer forming system of claim 7 ,
wherein the second supply unit is configured to stop a nozzle, which is configured to supply the catalyst liquid, above the central portion of the substrate while the substrate is rotated by the substrate holding/rotating device.

11 . A computer-readable recording medium having stored thereon computer-executable instructions that, in response to execution, cause a catalyst layer forming system to perform a catalyst layer forming method of forming a catalyst layer on a substrate,
wherein the catalyst layer forming method includes: a preparation processing of preparing the substrate including a recess; a first supply processing of forming a substrate surface catalyst layer by supplying a catalyst liquid including a catalyst on the substrate such that the catalyst liquid is widely diffused to an entire surface of the substrate and by uniformly adsorbing the catalyst to the entire surface of the substrate; and a second supply processing of forming a recess inner surface catalyst layer by supplying the catalyst liquid to a central portion of the substrate while rotating the substrate and by adsorbing the catalyst to an entire inner surface of the recess.

Assignees

• Tokyo Electron Ltd

Inventors

• Inatomi Yuichiro
• Tanaka Takashi

Classifications

• H10W20/0245

  comprising use of blind vias during the manufacture · CPC title

• H10W20/0261

  characterised by the filling method or the material of the conductive fill · CPC title

• H10P14/46

  using a liquid · CPC title

• H10W20/043

  for electroplating · CPC title

• H10W20/033

  in openings in dielectrics · CPC title