Use of Vacuum Chucks to Hold a Wafer or Wafer Sub-Stack

US2015340265A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2015340265-A1
Application numberUS-201314408890-A
CountryUS
Kind codeA1
Filing dateJun 28, 2013
Priority dateJul 3, 2012
Publication dateNov 26, 2015
Grant date

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Abstract

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Techniques are described for holding a wafer or wafer sub-stack to facilitate further processing of the wafer of sub-stack. In some implementations, a wafer or wafer sub-stack is held by a vacuum chuck in a manner that can help reduce bending of the wafer or wafer sub-stack.

First claim

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1 . A method of forming features on a wafer using a replication process, the method comprising: placing a wafer on a vacuum chuck, wherein a first surface of the wafer that faces the vacuum chuck includes features that project toward the vacuum chuck, and wherein the vacuum chuck includes a central recessed surface on which a silicone mat is disposed; applying pressure to a second surface of the wafer on a side of the wafer opposite its first surface such that the features of the wafer on its…

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What does patent US2015340265A1 cover?
Techniques are described for holding a wafer or wafer sub-stack to facilitate further processing of the wafer of sub-stack. In some implementations, a wafer or wafer sub-stack is held by a vacuum chuck in a manner that can help reduce bending of the wafer or wafer sub-stack.
Who is the assignee on this patent?
Heptagon Micro Optics Pte Ltd
What technology area does this patent fall under?
Primary CPC classification H10P72/78. Mapped technology areas include Electricity.
When was this patent published?
Publication date Thu Nov 26 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).