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US-12087886-B2 · Sep 10, 2024 · US
US2015340265A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2015340265-A1 |
| Application number | US-201314408890-A |
| Country | US |
| Kind code | A1 |
| Filing date | Jun 28, 2013 |
| Priority date | Jul 3, 2012 |
| Publication date | Nov 26, 2015 |
| Grant date | — |
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Techniques are described for holding a wafer or wafer sub-stack to facilitate further processing of the wafer of sub-stack. In some implementations, a wafer or wafer sub-stack is held by a vacuum chuck in a manner that can help reduce bending of the wafer or wafer sub-stack.
Opening claim text (preview).
1 . A method of forming features on a wafer using a replication process, the method comprising: placing a wafer on a vacuum chuck, wherein a first surface of the wafer that faces the vacuum chuck includes features that project toward the vacuum chuck, and wherein the vacuum chuck includes a central recessed surface on which a silicone mat is disposed; applying pressure to a second surface of the wafer on a side of the wafer opposite its first surface such that the features of the wafer on its…
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