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Apparatus for manufacturing semiconductor devices
US9138980B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9138980-B2 |
| Application number | US-201213624470-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 21, 2012 |
| Priority date | Jun 22, 2010 |
| Publication date | Sep 22, 2015 |
| Grant date | Sep 22, 2015 |
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- Title
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Abstract
Official abstract text for this publication.
The present invention relates to an apparatus for the manufacture of semiconductor devices wherein the apparatus includes a bonding module that has a vacuum chamber to provide bonding of wafers under pressure below atmospheric pressure; and a loadlock module connected to the bonding module and configured for wafer transfer to the bonding module. The loadlock module is also connected to a first vacuum pumping device configured to reduce the pressure in the loadlock module to below atmospheric pressure. The bonding and loadlock modules remain at a pressure below atmospheric pressure while the wafer is transferred from the loadlock module into the bonding module.
First claim
Opening claim text (preview).
What is claimed is: 1. An apparatus for the molecular bonding of semiconductor devices, the apparatus comprising: a bonding module comprising a vacuum chamber to provide bonding of a first wafer and a second wafer under a pressure below atmospheric pressure, and at least a first bonding chuck and a second bonding chuck configured to hold the first wafer and the second wafer, respectively, with the main surfaces of the first and second wafers arranged face-to-face in vertical orien…
Assignees
Inventors
Classifications
- H10P72/0428Primary
Electricity · mapped topic
- H10W90/00Primary
Electricity · mapped topic
Operations & Transport · mapped topic
Operations & Transport · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9138980B2 cover?
- The present invention relates to an apparatus for the manufacture of semiconductor devices wherein the apparatus includes a bonding module that has a vacuum chamber to provide bonding of wafers under pressure below atmospheric pressure; and a loadlock module connected to the bonding module and configured for wafer transfer to the bonding module. The loadlock module is also connected to a first …
- Who is the assignee on this patent?
- Soitec Silicon On Insulator
- What technology area does this patent fall under?
- Primary CPC classification H10P72/0428. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Sep 22 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).