Systems and methods for processing semiconductor wafers using front-end processed wafer edge geometry metrics

Patent metadata

Field	Value
Publication number	US-12487185-B2
Application number	US-202217818131-A
Country	US
Kind code	B2
Filing date	Aug 8, 2022
Priority date	Aug 16, 2021
Publication date	Dec 2, 2025
Grant date	Dec 2, 2025

Abstract

A method for processing semiconductor wafers includes obtaining measurement data of an edge profile of a semiconductor wafer processed by a front-end process tool. The method includes determining an edge profile center point based on the measurement data, generating a raw height profile, and generating an ideal edge profile. The method further includes generating a Gapi edge profile of the semiconductor wafer based on the raw height profile and the ideal edge profile and calculating a Gapi edge value of the semiconductor wafer based on the Gapi edge profile. The generated Gapi edge profile and/or the calculated Gapi edge value may be used to tune the front-end process tool and/or sort the semiconductor wafer for polishing. Systems include at least a front-end process tool, a flatness measurement tool, and a computing device.

First claim

What is claimed is:

1 . A method for processing semiconductor wafers, the method comprising:
providing a first semiconductor wafer processed by a front-end process tool; obtaining measurement data of an edge profile of the first semiconductor wafer; determining an edge profile center point based on the measurement data; generating a raw height profile based on the measurement data and the edge profile center point; generating an ideal edge profile based on polynomial regression of the raw height profile; generating a Gapi edge profile of the first semiconductor wafer based on the raw height profile and the ideal edge profile; calculating a Gapi edge value of the first semiconductor wafer based on the Gapi edge profile; determining whether the Gapi edge value of the first semiconductor wafer is within a predetermined threshold; if the Gapi edge value of the first semiconductor wafer is not within the predetermined threshold:
tuning the front-end process tool based on the Gapi edge profile of the first semiconductor wafer; and
processing a second semiconductor wafer with the tuned front-end process tool; and
if the Gapi edge value of the first semiconductor wafer is within the predetermined threshold, sorting the first semiconductor wafer for polishing.

2 . The method of claim 1 , wherein the determining the edge profile center point includes applying a simplification algorithm to convert the edge profile measurement data into a simplified curve that includes three points, wherein the edge profile center point is a middle point of the three points.

3 . The method of claim 2 , wherein the simplification algorithm is an iterative end-point fit algorithm.

4 . The method of claim 1 , wherein the generating the raw height profile includes extracting an equal number of raw height points on either side of the edge profile center point.

5 . The method of claim 1 , wherein the generating the ideal height profile is based on third-order polynomial fitting of the raw height profile.

6 . The method of claim 1 , further comprising:
generating a delta edge profile by comparing the raw height profile and the ideal height profile; and generating a weighting profile based on variations in the delta edge profile along a direction of the edge profile; wherein the Gapi edge profile is generated based on the delta edge profile and the weighting profile.

7 . The method of claim 6 , wherein the weighting profile is generated based on at least one of a shape variation and a slope change of the delta edge profile, each of the shape variation and the slope change being determined within defined moving windows along the direction of the edge profile.

8 . The method of claim 1 , wherein the front-end process tool is selected from the group consisting of a wire saw, a lapping tool, and a grinding tool.

9 . The method of claim 1 , wherein the Gapi edge value of the first semiconductor wafer is calculated based on a root-mean-square value of the Gapi edge profile.

10 . The method of claim 9 , wherein the predetermined threshold for the Gapi edge root-mean-square value is less than or equal to 10.

11 . The method of claim 1 , wherein the Gapi edge value of the first semiconductor wafer is calculated based on a maximum value of the Gapi edge profile.

12 . The method of claim 11 , wherein the predetermined threshold for the Gapi edge maximum value is less than or equal to 90.

13 . The method of claim 1 , wherein the second semiconductor wafer is the same wafer as the first semiconductor wafer.

14 . A system for processing semiconductor wafers, the system comprising:
a front-end process tool for front-end processing of a semiconductor wafer; a flatness inspection tool for obtaining measurement data of an edge profile of the front-end processed wafer; and a computing device connected to the flatness inspection tool and the front-end process tool, the computing device configured to:
receive the measurement data from the flatness inspection tool;
determine an edge profile center point based on the measurement data;
generate a raw height profile based on the measurement data and the edge profile center point;
generate an ideal edge profile based on polynomial regression of the raw height profile;
generate a Gapi edge profile of the front-end processed wafer based on the raw height profile and the ideal edge profile;
calculate a Gapi edge value of the front-end processed wafer based on the Gapi edge profile;
determine whether the Gapi edge value of the front-end processed wafer is within a predetermined threshold;
if the Gapi edge value of the front-end processed wafer is not within the predetermined threshold, modify the front-end process tool based on the Gapi edge profile of the front-end processed wafer.

15 . The system of claim 14 , wherein the computing device is configured to determine the edge profile center point by applying an iterative end-point fit algorithm to convert the edge profile measurement data into a simplified curve that includes three points, wherein the edge profile center point is a middle point of the three points.

16 . The system of claim 14 , wherein the computing device is configured to generate the raw height profile by extracting an equal number of raw height points on either side of the edge profile center point.

17 . The system of claim 14 , wherein the computing device is configured to generate the ideal height profile based on third-order polynomial fitting of the raw height profile.

18 . The system of claim 14 , wherein the computing device is further configured to:
generate a delta edge profile by comparing the raw height profile and the ideal height profile; and generate a weighting profile based on at least one of a shape variation and a slope change of the delta edge profile along a direction of the edge profile, each of the shape variation and the slope change being determined within defined moving windows along the direction of the edge profile; wherein the Gapi edge profile is generated based on the delta edge profile and the weighting profile.

19 . The system of claim 14 , wherein the computing device is further configured to calculate the Gapi edge value of the front-end processed wafer based on a root-mean-square value of the Gapi edge profile, and wherein the predetermined threshold for the Gapi edge root-mean-square value is less than or equal to 10.

20 . The system of claim 14 , wherein the computing device is further configured to calculate the Gapi edge value of the front-end processed wafer based on a maximum value of the Gapi edge profile, and wherein the predetermined threshold for the Gapi edge maximum value is less than or equal to 90.

Assignees

• Globalwafers Co Ltd

Inventors

• Chu Yung Hsing
• Chou Yen-Chun
• Yang Yau-Ching
• Hong Jing Ru
• Lin shan-hui

Classifications

• H10P74/203 Primary

  Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects · CPC title

• H10P72/0616

  Monitoring of warpages, curvatures, damages, defects or the like · CPC title

• H10P72/0428

  Apparatus for mechanical treatment or grinding or cutting · CPC title

• H10P52/00 Primary

  Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title

• H10P74/23

  characterised by multiple measurements, corrections, marking or sorting processes · CPC title