Showerhead assembly and components

Patent metadata

Field	Value
Publication number	US-12467140-B2
Application number	US-202117149023-A
Country	US
Kind code	B2
Filing date	Jan 14, 2021
Priority date	Jan 15, 2020
Publication date	Nov 11, 2025
Grant date	Nov 11, 2025

Abstract

The present disclosure pertains to embodiments of a showerhead assembly which can be used to deposit semiconductor layers using processes such as atomic layer deposition (ALD). The showerhead assembly has a showerhead which has an increased thickness which advantageously decreases reactor chamber size and decreases cycling time. Decreased cycling time can improve throughput and decrease costs.

First claim

What is claimed is:

1 . A showerhead plate for distributing a vapor to a reaction chamber, the showerhead plate comprising:
a first surface; a second surface opposite to the first surface; and a plurality of apertures extending from the first surface to the second surface, wherein a thickness of the showerhead plate between the first and second surfaces is in a range of about 25 mm to about 35 mm, wherein at least one aperture of the plurality of apertures comprises:
a first axial inlet section extending from the first surface along a vertical axis of the showerhead plate, the first axial inlet section having a first maximum width;
a conduit portion oriented along the vertical axis of the showerhead plate;
a first tapered section extending from the first axial inlet section, the first tapered section comprising an inwardly-angled sidewall that angles inwardly from the first axial inlet section;
a second tapered section extending from the conduit portion to the second surface, the second tapered section comprising an outlet having a second maximum width;
wherein the conduit portion is longer along the vertical axis than the first axial inlet section,
wherein the conduit portion extends from the first tapered section and has a major lateral dimension less than a major lateral dimension of the first axial inlet section, and
wherein the first maximum width is greater than the second maximum width.

2 . The showerhead plate of claim 1 , wherein the second tapered section comprises a sidewall extending linearly and directly from the conduit portion to the outlet having the second maximum width.

3 . The showerhead plate of claim 1 , wherein the thickness of the showerhead plate between the first and second surfaces is in a range of about 29 mm to about 31 mm.

4 . The showerhead plate of claim 1 , wherein the reaction chamber is adapted to process a 200 mm diameter substrate, and wherein a width of the showerhead plate is in a range of about 210 mm to about 260 mm.

5 . The showerhead plate of claim 1 , wherein the reaction chamber is adapted to process a 300 mm diameter substrate, and wherein a width of the showerhead plate is in a range of about 310 mm to about 360 mm.

6 . The showerhead plate of claim 1 , wherein the reaction chamber is adapted to process a 450 mm diameter substrate, and wherein a width of the showerhead plate is in a range of about 460 mm to about 500 mm.

7 . The showerhead plate of claim 4 , wherein the plurality of apertures includes a number of apertures greater than 1,200 apertures.

8 . The showerhead plate of claim 5 , wherein the number of apertures is in a range of about 1,500 to 2,500 apertures.

9 . A reactor assembly comprising:
a showerhead assembly comprising a showerhead plenum and the showerhead plate of claim 1 , the showerhead plenum disposed over the showerhead plate; a substrate support adapted to support a substrate; and a reaction chamber defined at least in part by the substrate support and the showerhead plate, wherein a height of the reaction chamber between a top surface of the substrate support to a bottom surface of the showerhead plate is in a range of 3 mm to 7 mm.

10 . The reactor assembly of claim 9 , further comprising a vaporizer configured to vaporize a solid source precursor.

11 . A showerhead plate for distributing a vapor to a reaction chamber, the showerhead plate comprising:
a first surface; a second surface opposite to the first surface; a plurality of apertures extending from the first surface to the second surface, wherein multiple apertures of the plurality of apertures comprise:
a first axial inlet section extending from the first surface along a vertical axis of the showerhead plate, wherein the first axial inlet section has a first maximum width at the first surface;
a first tapered section extending from the first axial inlet section, the first tapered section comprising an inwardly-angled sidewall that angles inwardly from the first axial inlet section;
a conduit portion extending from the first tapered section and oriented along the vertical axis of the showerhead plate, the conduit portion having a smaller major lateral dimension than the first axial inlet section; and
a second tapered section comprising a linear sidewall extending directly from the conduit portion to the second surface, the second tapered section comprising an outlet configured to deliver the vapor to the reaction chamber, wherein the outlet has a second maximum width at the second surface,
wherein the conduit portion is longer along the vertical axis than the first axial inlet section, and
wherein the first maximum width is greater than the second maximum width.

12 . The showerhead plate of claim 11 , wherein a thickness of the showerhead plate between the first and second surfaces is in a range of about 27 mm to about 33 mm.

13 . The showerhead plate of claim 11 , wherein an angle of opposing sidewalls of the first tapered section is about 82°.

14 . The showerhead plate of claim 11 , wherein the conduit portion has a length in a range of about 15 mm to about 20 mm.

15 . The showerhead plate of claim 11 , wherein the first axial inlet section has a vertical height in a range of about 3.5 mm to about 4.5 mm.

16 . The showerhead plate of claim 11 , wherein the first tapered section has a vertical height in a range of about 3.5 mm to about 4.5 mm.

17 . The showerhead plate of claim 11 , wherein the second tapered section has a vertical height in a range of about 2.5 mm to about 3.5 mm.

18 . The showerhead plate of claim 11 , wherein an angle of opposing sidewalls of the first tapered section is in a range of about 60° to about 90°.

19 . The showerhead plate of claim 11 , wherein an angle of opposing sidewalls of the second tapered section is in a range of about 60° to about 90°.

20 . A showerhead plate for distributing a vapor to a reaction chamber, the showerhead plate comprising:
a first surface; a second surface opposite to the first surface; a plurality of apertures extending from the first surface to the second surface, the plurality of apertures comprising:
a plurality of outer apertures having aperture portions that extend along a vertical axis of the showerhead plate; and
one or more inner apertures, wherein each of the one or more inner apertures comprise a first opening on the first surface, a second opening on the second surface, and an aperture axis from a center of the first opening to a center of the second opening, wherein the aperture axis is angled inwardly towards a central region of the showerhead plate relative to the vertical axis:
wherein at least one aperture of the outer apertures comprises:
a first axial inlet section extending from the first surface along the vertical axis of the showerhead plate;
a first tapered section extending from the first axial inlet section, the first tapered section comprising an inwardly-angled sidewall that angles inwardly from the first axial inlet section;
a conduit portion extending from the first tapered section and oriented along the vertical axis of the showerhead plate, the conduit portion having a smaller major lateral dimension than the first axial inlet section; and

a second tapered section comprising a sidewall extending linearly and directly from the conduit portion to the second surface, the second tapered section comprising an outlet configured to deliver the vapor to the reaction chamber,
wherein the showerhead plate does not have an

Assignees

• Asm Ip Holding Bv

Inventors

• Nandwana Dinkar
• White Carl Louis
• Shero Eric James
• Petro William George
• Terhorst Herbert
• Trivedi Gnyanesh
• Olstad Mark
• Kimtee Ankit
• Fondurulia Kyle
• Schmotzer Michael
• Winkler Jereld Lee

Classifications

• C23C16/4583

  the substrate being supported substantially horizontally · CPC title

• C23C16/448

  characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials · CPC title

• C23C16/45548

  having arrangements for gas injection at different locations of the reactor for each ALD half-reaction · CPC title

• C23C16/45565 Primary

  Shower nozzles · CPC title