Bonding method of semiconductor chip and bonding apparatus of semiconductor chip

Patent metadata

Field	Value
Publication number	US-10847497-B2
Application number	US-201715643623-A
Country	US
Kind code	B2
Filing date	Jul 7, 2017
Priority date	Oct 30, 2014
Publication date	Nov 24, 2020
Grant date	Nov 24, 2020

Abstract

A mounting apparatus of a chip including a mechanism configured to arrange a front surface of a chip and a front surface of a substrate to face each other such that a back surface of the chip is attached to a sheet, the sheet having a first portion corresponding to the selected chip and a the second portion arranged at a periphery of the first portion corresponding to the selected chip in the sheet when seen in a direction perpendicular to the front surface of the substrate; a holding mechanism moving in a direction that is not perpendicular to the front surface of the substrate and arranged to hold the second portion of the sheet; and a pushing mechanism for pushing the back surface of the chip through the first portion of the sheet so that the front surface of the chip is brought close to the front surface of the substrate with the first portion deformed in a state where the second portion is held by the holding mechanism, and configured to release the pushing mechanism from the first portion of the sheet to strip the sheet from the back surface of the chip.

First claim

What is claimed is:

1. A mounting apparatus for a chip comprising:
an arrangement mechanism comprising a sheet stage and a substrate stage, wherein the sheet stage immovably fixes a sheet where a chip is disposed, the substrate stage is disposed on a first side of the sheet, and the substrate stage holds a substrate;
a pushing mechanism disposed on a second side of the sheet, the second side being opposite to the first side, the pushing mechanism being capable of pushing a first region of the sheet immovably fixed by the sheet stage in a direction of the first side, and the first region being a region corresponding to the chip; and
a holding mechanism disposed on the second side of the sheet, the holding mechanism being disposed at a periphery of the pushing mechanism, the holding mechanism being capable of holding a second region of the sheet immovably fixed by the sheet stage, and the second region being a region at a periphery of the first region when seen in a direction perpendicular to a front surface of the substrate,
wherein the pushing mechanism pushes the first region toward the second side to attach the chip to the substrate in a first period, lowers an adhesion force of the first region to a back surface of the chip in a second period later than the first period, further lowers an adhesion force of the first region to the back surface of the chip in a third period later than the second period, releases an adhesion force of the first region to the back surface of the chip in a fourth period later than the third period, and strips the sheet from the back surface of the chip.

2. The mounting apparatus according to claim 1 , wherein:
the arrangement mechanism is configured to arrange a front surface of the chip and the front surface of the substrate such that the front surface of the chip and the front surface of the substrate face each other in a state where the back surface of the chip is attached to the sheet,
the holding mechanism is capable of moving relative to the sheet stage in a direction that is not perpendicular to the front surface of the substrate so as to hold the second region of the sheet, and
the pushing mechanism is configured to push the back surface of the chip through the first region of the sheet so that the front surface of the chip is brought close to the front surface of the substrate.

3. The mounting apparatus according to claim 2 , wherein the pushing mechanism is configured to release itself from the first region of the sheet so as to strip the sheet from the back surface of the chip.

4. The mounting apparatus according to claim 2 , wherein the pushing mechanism comprises:
a pushing head comprising a pushing surface corresponding to the back surface of the chip, and
a pin configured to retract from the pushing surface and to project from the pushing surface.

5. The mounting apparatus according to claim 4 , wherein the pushing head further comprises a buffer member on the pushing surface.

6. The mounting apparatus according to claim 4 , wherein the pushing mechanism further comprises a driving unit which causes the pin to retract from the pushing surface and to project from the pushing surface.

7. The mounting apparatus according to claim 1 , further comprising:
a recognition mechanism configured to recognize the substrate and the chip; and
an alignment mechanism configured to align relative positions of the chip and the substrate based on a recognition result of the recognition mechanism,
wherein the pushing mechanism pushes the back surface of the chip through the first region of the sheet with the relative positions of the chip and the substrate aligned.

8. The mounting apparatus according to claim 1 , wherein the holding mechanism comprises a suctioning structure which suctions the second region of the sheet.

9. The mounting apparatus according to claim 1 , wherein the substrate stage and the sheet stage are driven independently from each other.

10. The mounting apparatus according to claim 9 , wherein the sheet stage is configured to hold a flat ring which can immovably fix, relative to the sheet stage, the sheet where the chip is attached.

11. The mounting apparatus according to claim 2 , wherein the chip is arranged face down above the substrate by the arrangement mechanism.

12. The mounting apparatus according to claim 7 , wherein the recognition mechanism comprises an illumination device and a camera.

13. The mounting apparatus according to claim 12 , wherein the illumination device is arranged on an opposite side of the pushing mechanism across the substrate stage.

14. The mounting apparatus according to claim 12 , wherein the illumination device is an infrared (IR) illumination device.

15. The mounting apparatus according to claim 1 , wherein:
the sheet stage is capable of immovably fixing an outer region of the sheet, and
the holding mechanism is capable of holding the second region which is on an inner side of the sheet stage.

16. The mounting apparatus according to claim 1 , further comprising:
a controller which controls a drive of the pushing mechanism and a drive of the holding mechanism independently from each other.

17. The mounting apparatus according to claim 16 , wherein the controller controls a height of the holding mechanism from the substrate stage to be lower than a height of the pushing mechanism from the substrate stage.

18. The mounting apparatus according to claim 16 , wherein the controller controls, after the sheet is held by the holding mechanism, the pushing mechanism to touch the sheet so that the first region is pushed.

19. The mounting apparatus according to claim 1 , wherein the pushing mechanism pushes the first region which includes a point position, the point position corresponding to a center of a pushing portion of the pushing mechanism.

20. The mounting apparatus according to claim 1 , wherein the mounting apparatus shifts respective positions of the pushing mechanism and the holding mechanism relative to the sheet stage along a plane that intersects a pushing direction of the pushing mechanism, before or after the pushing mechanism pushes the sheet.

Assignees

• Toshiba Kk

Inventors

• Kurita Yoichiro

Classifications

• H10W72/0198

  batch processes · CPC title

• H10P70/30

  Cleaning after the substrates have been singulated · CPC title

• H10W72/07331

  Connecting techniques · CPC title

• H10W72/07183

  Means for monitoring · CPC title

• H10W72/07178

  Means for aligning · CPC title