MEMS device including coil structure with corrugated polymer film

Patent metadata

Field	Value
Publication number	US-12441606-B2
Application number	US-202218075882-A
Country	US
Kind code	B2
Filing date	Dec 6, 2022
Priority date	Nov 11, 2022
Publication date	Oct 14, 2025
Grant date	Oct 14, 2025

Abstract

A micro electro mechanical system (MEMS) device and a method for manufacturing the same are provided. The MEMS device includes a substrate, a polymer film on the substrate and having a lower surface facing toward the substrate, a cavity passing through the substrate, and coil structures on the substrate and in the polymer film. The polymer film includes a corrugation pattern on the lower surface of the polymer film. A portion of the polymer film is exposed in the cavity.

First claim

What is claimed is:

1. A micro electro mechanical system (MEMS) device, comprising:
a substrate;
a polymer film on the substrate and having a lower surface facing toward the substrate, wherein the polymer film comprises a corrugation pattern on the lower surface of the polymer film;
a cavity passing through the substrate, wherein a portion of the polymer film is exposed in the cavity;
coil structures on the substrate and in the polymer film;
a dielectric layer between the substrate and the polymer film, wherein the cavity passes through the dielectric layer; and
an oxide layer between the dielectric layer and the substrate.

2. The MEMS device according to claim 1 , wherein the corrugation pattern of the polymer film is exposed in the cavity.

3. The MEMS device according to claim 1 , wherein the corrugation pattern of the polymer film comprises convex portions separated from each other, the convex portions protrude toward the cavity.

4. The MEMS device according to claim 1 , wherein the polymer film has an upper surface opposite to the lower surface, the upper surface of the polymer film comprises a flat surface portion, and the flat surface portion overlaps the corrugation pattern along a longitudinal direction.

5. The MEMS device according to claim 1 , wherein the dielectric layer has a lower surface facing toward the substrate, a portion of the lower surface of the dielectric layer is exposed in the cavity.

6. The MEMS device according to claim 1 , wherein the oxide layer and the dielectric layer comprise different materials.

7. The MEMS device according to claim 1 , wherein the cavity passes through the oxide layer.

8. The MEMS device according to claim 1 , further comprising a metal layer between the substrate and the polymer film, a portion of the metal layer is exposed in the cavity.

Assignees

• United Microelectronics Corp

Inventors

• Chang Jung-Hao
• Chen Weng-Yi

Classifications

• B81B2203/0353

  Holes · CPC title

• B81C2201/014

  by depositing an etch stop layer, e.g. silicon nitride, silicon oxide, metal · CPC title

• B81C2201/0133

  Wet etching · CPC title

• B81C2201/0132

  Dry etching, i.e. plasma etching, barrel etching, reactive ion etching [RIE], sputter etching or ion milling · CPC title

• B81C2201/0108

  Sacrificial polymer, ashing of organics · CPC title