Conductive pad structure and method of fabricating the same

Patent metadata

Field	Value
Publication number	US-9761791-B2
Application number	US-201414325386-A
Country	US
Kind code	B2
Filing date	Jul 8, 2014
Priority date	May 27, 2014
Publication date	Sep 12, 2017
Grant date	Sep 12, 2017

Abstract

A structure of a conductive pad is provided. The structure includes a first conductive layer. A first dielectric layer covers the first conductive layer. A first contact hole is disposed within the first dielectric layer. A second conductive layer fills in the first conductive hole and extends from the first conductive hole to a top surface of the first dielectric layer so that the second conductive layer forms a step profile. A second dielectric layer covers the first dielectric layer and the second conductive layer. A third conductive layer contacts and covers the step profile.

First claim

What is claimed is:

1. A conductive pad structure, comprising:
a first conductive layer;
a first dielectric layer covering the first conductive layer;
a first contact hole disposed within the first dielectric layer;
a second conductive layer filling in the first contact hole, the second conductive layer extending from the first contact hole to a top surface of the first dielectric layer so that the second conductive layer forms a step profile, wherein the second conductive layer is thicker than the first conductive layer and the first conductive layer intersects the second conductive layer;
a second dielectric layer covering the first dielectric layer and the second conductive layer;
a third conductive layer contacting and covering the step profile, wherein the third conductive layer is disposed on the second dielectric layer,
a hall sensor electrically connecting to the first conductive layer and the second conductive layer; and
a protective layer disposed on the second dielectric layer and covering the hall sensor.

2. The conductive pad structure of claim 1 , further comprising:
a second contact hole disposed within the second dielectric layer, wherein an opening of the second contact hole is greater than an opening of the first contact hole.

3. The conductive pad structure of claim 2 , wherein the third conductive layer fills in the second contact hole conformally, and the third conductive layer extends to a top surface of the second dielectric layer.

4. The conductive pad structure of claim 1 , wherein the second conductive layer comprises a first surface and a second surface, the first surface is parallel to the top surface of the first dielectric layer, and the second surface is parallel to the top surface of the first dielectric layer.

5. The conductive pad structure of claim 4 , wherein the second conductive layer comprises a sloping surface connecting the first surface to the second surface.

6. The conductive pad structure of claim 5 , wherein the third conductive layer contacts the sloping surface and covers the sloping surface continuously.

7. The conductive pad structure of claim 1 , wherein the second conductive layer within the first contact hole contacts the first conductive layer.

8. The conductive pad structure of claim 1 , further comprising a wire bonding contacting the third conductive layer.

9. A method of fabricating a conductive pad structure, comprising:
forming a first conductive layer electrically connecting to a hall sensor;
forming a first dielectric layer covering the first conductive layer;
forming a first contact hole within the first dielectric layer;
forming a second conductive layer filling the first contact hole, the second conductive layer extending from the first contact hole to a top surface of the first dielectric layer so that the second conductive layer forms a step profile;
forming a second dielectric layer covering the first dielectric layer and the second conductive layer;
removing part of the second dielectric layer to expose part of the step profile;
forming a preliminary third conductive layer contacting and covering the step profile; and
patterning the preliminary third conductive layer to form a third conductive layer and a protective layer, wherein the third conductive layer contacts the step profile and the protective layer covers the hall sensor.

10. The method of fabricating a conductive pad structure of claim 9 , further comprising:
after removing part of the second dielectric layer, forming a second contact hole within the second dielectric layer above the second conductive layer.

11. The method of fabricating a conductive pad structure of claim 10 , wherein an opening of the second contact hole is greater than an opening of the first contact hole.

12. The method of fabricating a conductive pad structure of claim 10 , wherein the third conductive layer fills in the second contact hole conformally, and the third conductive layer extends from the second contact hole to a top surface of the second dielectric layer.

13. The method of fabricating a conductive pad structure of claim 9 , wherein the second conductive layer fills in the first contact hole comformally, and the second conductive layer extends to the top surface of the first dielectric layer.

14. The method of fabricating a conductive pad structure of claim 9 , wherein the second conductive layer comprises a first surface and a second surface, the first surface is parallel to the top surface of the first dielectric layer, and the second surface is parallel to the top surface of the first dielectric layer.

15. The method of fabricating a conductive pad structure of claim 14 , wherein the second conductive layer comprises a sloping surface connecting the first surface to the second surface.

16. The method of fabricating a conductive pad structure of claim 15 , wherein the third conductive layer contacts the sloping surface and covers the sloping surface continuously.

17. The method of fabricating a conductive pad structure of claim 9 , wherein the second conductive layer within the first contact hole contacts the first conductive layer.

Assignees

• United Microelectronics Corp

Inventors

• Shiu Jian-Bin
• Lee Tung-Sheng

Classifications

• H10W72/9445

  Top-view layouts, e.g. mirror arrays · CPC title

• H10W72/932

  Plan-view shape, i.e. in top view · CPC title

• H10W72/934

  Cross-sectional shape, i.e. in side view · CPC title

• H10W72/59

  Bond pads specially adapted therefor · CPC title

• H10W72/9415

  relative to the surface, e.g. recessed, protruding · CPC title