Method, apparatus, and system for dynamically controlling an electrostatic chuck during an inspection of wafer

Patent metadata

Field	Value
Publication number	US-12368067-B2
Application number	US-202117913149-A
Country	US
Kind code	B2
Filing date	Mar 18, 2021
Priority date	Mar 20, 2020
Publication date	Jul 22, 2025
Grant date	Jul 22, 2025

Abstract

An electrostatic chuck control system configured to be utilized during an inspection process of a wafer, the electrostatic chuck control system comprising an electrostatic chuck of a stage configured to be undocked during the inspection process, wherein the electrostatic chuck comprises a plurality of components configured to influence an interaction between the wafer and the electrostatic chuck during the inspection process, a first sensor configured to generate measurement data between at least some of the plurality of components and the wafer, and a controller including circuitry configured to receive the measurement data to determine characteristics of the wafer relative to the electrostatic chuck and to generate adjustment data to enable adjusting, while the stage is undocked, at least some of the plurality of components based on the determined characteristics.

First claim

The invention claimed is:

1. An electrostatic chuck control system configured to be utilized during an inspection process of a wafer, the electrostatic chuck control system comprising:
an electrostatic chuck of a stage configured to be undocked during the inspection process, wherein the electrostatic chuck comprises a plurality of components configured to influence an interaction between the wafer and the electrostatic chuck during the inspection process;
a first sensor configured to generate measurement data between at least some of the plurality of components and the wafer; and
a controller including circuitry configured to receive the measurement data to determine characteristics of the wafer relative to the electrostatic chuck and to generate adjustment data to enable adjusting, while the stage is undocked, at least some of the plurality of components based on the determined characteristics.

2. The electrostatic chuck control system of claim 1 , further comprising a driver communicatively coupled to the controller and configured to apply control signals to the plurality of components to enable adjusting the plurality of components.

3. The electrostatic chuck control system of claim 1 , wherein the stage is configured to be moved to a predetermined location during the inspection process after the stage is undocked.

4. The electrostatic chuck control system of claim 3 , wherein the stage is configured to be moved to the predetermined location to enable a charged particle system to scan the wafer during the inspection process.

5. The electrostatic chuck control system of claim 2 , further comprising a power supply providing power to the driver and the controller.

6. The electrostatic chuck control system of claim 2 , further comprising an optical fiber connecting the driver and the controller and configured to transfer data between the driver and the controller.

7. The electrostatic chuck control system of claim 1 , wherein the controller comprises a real-time controller.

8. The electrostatic chuck control system of claim 1 , wherein the plurality of components includes a plurality of electrodes configured to influence the interaction between the wafer and the electrostatic chuck by producing an electric field.

9. The electrostatic chuck control system of claim 8 , wherein the measurement data generated by the first sensor comprises a capacitance measurement data between the plurality of electrodes and the wafer.

10. The electrostatic chuck control system of claim 8 , wherein the plurality of electrodes comprises a first set of electrodes and a second set of electrodes, wherein the first and second sets of electrodes are configured to provide data to determine whether the wafer is bowed during the inspection process.

11. The electrostatic chuck control system of claim 1 , wherein the plurality of components includes a plurality of pins configured to influence the interaction between the wafer and the electrostatic chuck by transmitting pulses to the wafer.

12. The electrostatic chuck control system of claim 11 , further comprising: a second sensor configured to generate resistance measurement data corresponding to resistances of connections between the plurality of pins and the wafer, wherein the controller is further configured to receive the resistance measurement data to determine whether to generate adjustment data for adjusting the resistances of the connections.

13. The electrostatic chuck control system of claim 11 , further comprising a grounding pulse generator configured to generate the pulses to the wafer and to receive adjustment data from the controller to enable adjusting at least some of the plurality of pins based on the determination,
wherein the pulses are high voltage pulses.

14. The electrostatic chuck control system of claim 1 , wherein the controller is further configured to report an error to an external system based on the received measurements.

15. A non-transitory computer-readable medium storing a set of instructions that are executable by a controller of an apparatus to cause the apparatus to perform a method to dynamically adjust parameters of an electrostatic chuck control system while a stage coupled to an electrostatic chuck is undocked, the method comprising:
receiving measurement data, while the stage is undocked for wafer inspection, to determine characteristics of the wafer relative to the electrostatic chuck, wherein the measurement data is generated based on interactions between a plurality of first components implemented in the electrostatic chuck and the wafer; and
adjusting, while the stage is undocked, at least some of the plurality of first components based on the determined characteristics.

16. The non-transitory computer-readable medium of claim 15 , wherein the set of instructions that are executable by the controller of the apparatus to cause the apparatus to further perform:
receiving resistance measurement data to determine whether to generate adjustment data for adjusting resistances of connections between a plurality of second components and the wafer, wherein the resistance measurement data is generated based on interactions between the plurality of second components and the wafer; and
adjusting at least some of the plurality of second components based on the determination whether to generate the adjustment data.

17. A method comprising:
undocking a stage comprising an electrostatic chuck to enable an inspection process of a wafer;
generating measurement data based on interactions between the wafer and a plurality of first components implemented at the electrostatic chuck;
determining, based on the generated measurement data, characteristics of the wafer relative to the electrostatic chuck; and
providing, to an electrostatic chuck control system, based on the determined characteristics, and by a controller, first signals to enable adjusting at least some of the plurality of first components while the stage is undocked.

18. The method of claim 17 , wherein the characteristics of the wafer relative to the electrostatic chuck comprises a bow of the wafer.

19. The method of claim 17 , wherein the plurality of first components include a plurality of electrodes that produce an electric field to adjust the interaction between the wafer and the electrostatic chuck.

20. The method of claim 17 , wherein the undocking the stage comprises moving the stage to a predetermined coordination to inspect the wafer using an electron beam.

Assignees

• Asml Netherlands Bv

Inventors

• Wang Yixiang
• Liu Shibing
• Luo Ying

Classifications

• H10P72/722 Primary

  Details of electrostatic chucks · CPC title

• H10P72/0616

  Monitoring of warpages, curvatures, damages, defects or the like · CPC title

• H10P72/0604

  Process monitoring, e.g. flow or thickness monitoring · CPC title

• H01J2237/2817

  Pattern inspection · CPC title

• H01J2237/24592

  Inspection and quality control of devices · CPC title