Lithographic apparatus having a chuck with a visco-elastic damping layer

Patent metadata

Field	Value
Publication number	US-8928860-B2
Application number	US-37074109-A
Country	US
Kind code	B2
Filing date	Feb 13, 2009
Priority date	Feb 21, 2008
Publication date	Jan 6, 2015
Grant date	Jan 6, 2015

Abstract

A lithographic apparatus includes an illumination system configured to condition a radiation beam, a support constructed to support a patterning device, the patterning device being capable of imparting the radiation beam with a pattern in its cross-section to form a patterned radiation beam, a substrate table constructed to hold a substrate, a projection system configured to project the patterned radiation beam onto a target portion of the substrate, a chuck configured to hold and position an object, for example, the patterning device onto the support or the substrate onto the substrate table, the chuck including a base and a constraining layer. A damping layer including a viscoelastic material is provided between the base and the constraining layer.

First claim

What is claimed is:

1. A lithographic apparatus comprising:
a patterning device support constructed to support a patterning device, the patterning device being capable of imparting a radiation beam with a pattern in a cross-section of the radiation beam to form a patterned radiation beam;
a substrate table constructed to hold a substrate;
a projection system configured to project the patterned radiation beam onto a target portion of the substrate;
a chuck configured to hold and position an object, the chuck comprising a base and a constraining layer, and
a damping layer comprising a viscoelastic material and provided between the base and the constraining layer, wherein at least one of the damping layer and constraining layer is segmented in a plane thereof to form at least two detached segments in said at least one of the damping layer and the constraining layer,
wherein an elasticity modulus of the constraining layer is at least 10 times greater than an elasticity modulus of the damping layer, and
wherein a thickness of the damping layer is between about 100 μm and 1000 μm.

2. A lithographic apparatus according to claim 1 , wherein the viscoelastic material is a viscoelastic polymer layer at least partially extending between the base and the constraining layer and connected thereto with an adhesive.

3. A lithographic apparatus according to claim 2 , wherein an elasticity modulus of the adhesive is greater than an elasticity modulus of the damping layer.

4. A lithographic apparatus according to claim 1 , wherein the viscoelastic material is a viscoelastic adhesive connecting the base with the constraining layer.

5. A lithographic apparatus according to claim 1 , wherein the base is covered by the damping layer, or the constraining layer, or both the damping layer and the constraining layer.

6. A lithographic apparatus according to claim 1 , wherein the base, or the constraining layer, or both the base and the constraining layer are made from glass or ceramic.

7. A lithographic apparatus according to claim 1 , wherein the constraining layer includes cuts arranged in a periphery of the constraining layer.

8. A lithographic apparatus according to claim 1 , wherein both the damping layer and the constraining layer are segmented.

9. A lithographic apparatus according to claim 1 , wherein the damping layer, or the constraining layer, or both the damping layer and the constraining layer cover more than half of the area of the chuck that shows high strain at a mode shape to be damped.

10. A lithographic apparatus according to claim 1 , wherein the base is constructed as a box with internal ribs.

11. A lithographic apparatus according to claim 1 , wherein the object is the patterning device and the chuck is configured to hold and position the patterning device onto the patterning device support.

12. A lithographic apparatus according to claim 1 , wherein the object is the substrate and the chuck is configured to hold and position the substrate onto the substrate table.

13. A lithographic apparatus according to claim 1 , wherein a thickness of the constraining layer is between about 0.5 mm and 5 mm.

14. A lithographic apparatus according to claim 1 , wherein the at least two detached segments include a first, second and third segments, and wherein the first segment is separated from the second segment along a first direction and the first segment is separated from the third segment along a second direction that is different from the first direction.

15. A lithographic apparatus according to claim 1 , wherein the damping layer is arranged between two separate constraining layers.

16. A chuck configured to hold and position an object, the chuck comprising:
a base and a constraining layer, and
a damping layer comprising a viscoelastic material and provided between the base and the constraining layer, wherein at least one of the damping layer and constraining layer is segmented in a plane thereof to form at least two detached segments in said at least one of the damping layer and the constraining layer,
wherein an elasticity modulus of the constraining layer is at least 10 times greater than an elasticity modulus of the damping layer, and
wherein a thickness of the damping layer is between about 100 μm and 1000 μm.

17. A chuck according to claim 16 , wherein the object is a patterning device configured to pattern a radiation beam.

18. A chuck according to claim 16 , wherein the object is a substrate configured to be exposed by a radiation beam.

19. A chuck according to claim 16 , wherein the viscoelastic material is a viscoelastic polymer layer at least partially extending between the base and the constraining layer and connected thereto with an adhesive.

20. A chuck according to claim 16 , wherein the viscoelastic material is a viscoelastic adhesive connecting the base with the constraining layer.

21. A chuck according to claim 16 , wherein the base is covered by the damping layer, or the constraining layer, or both the damping layer and the constraining layer.

22. A chuck according to claim 16 , wherein both the base and the constraining layer are made from glass or ceramic.

23. A chuck according to claim 16 , wherein the at least two detached segments include a first, second and third segments, and wherein the first segment is separated from the second segment along a first direction and the first segment is separated from the third segment along a second direction that is different from the first direction.

24. A lithographic apparatus comprising:
a patterning device support constructed to support a patterning device, the patterning device being capable of imparting a radiation beam with a pattern in a cross-section of the radiation beam to form a patterned radiation beam;
a substrate table constructed to hold a substrate;
a projection system configured to project the patterned radiation beam onto a target portion of the substrate;
a chuck configured to hold and position an object, the chuck comprising a base and a constraining layer, and
a damping layer comprising a viscoelastic material and provided between the base and the constraining layer, wherein the damping layer is constructed and arranged to damp global bending modes or local bending modes of the chuck, or both the global bending modes and the local bending modes of the chuck, and
wherein a thickness of the damping layer is between about 100 μm and 1000 μm.

25. A lithographic apparatus according to claim 24 , wherein a thickness of the constraining layer is between about 0.5 mm and 5 mm.

Assignees

• Hempenius Peter Paul
• Bijvoet Dirk-Jan
• De Vos Youssef Karel Maria
• Kamidi Ramidin Izair
• Asml Netherlands Bv

Inventors

• Hempenius Peter Paul
• Bijvoet Dirk-Jan
• De Vos Youssef Karel Maria
• Kamidi Ramidin Izair

Classifications

• H10P72/70 Primary

  for supporting or gripping · CPC title

• G03F7/707

  Chucks, e.g. chucking or un-chucking operations or structural details · CPC title

• G03F7/7095 Primary

  Materials, e.g. materials for housing, stage or other support having particular properties, e.g. weight, strength, conductivity, thermal expansion coefficient · CPC title

• G03F7/70783

  Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight · CPC title