Method of manufacturing a semiconductor device and apparatus for manufacturing the semiconductor device

Patent metadata

Field	Value
Publication number	US-12235589-B2
Application number	US-202318206970-A
Country	US
Kind code	B2
Filing date	Jun 7, 2023
Priority date	Jul 31, 2018
Publication date	Feb 25, 2025
Grant date	Feb 25, 2025

Abstract

A method of manufacturing a semiconductor device includes dividing a number of dies along an x axis in a die matrix in each exposure field in an exposure field matrix delineated on the semiconductor substrate, wherein the x axis is parallel to one edge of a smallest rectangle enclosing the exposure field matrix. A number of dies is divided along a y axis in the die matrix, wherein the y axis is perpendicular to the x axis. Sequences SNx0, SNx1, SNx, SNxr, SNy0, SNy1, SNy, and SNyr are formed. p*(Nbx+1)−2 stepping operations are performed in a third direction and first sequence exposure/stepping/exposure operations and second sequence exposure/stepping/exposure operations are performed alternately between any two adjacent stepping operations as well as before a first stepping operation and after a last stepping operation. A distance of each stepping operation in order follows the sequence SNx.

First claim

What is claimed is:

1. A method of manufacturing a semiconductor device, comprising:
exposing a first portion of a photoresist layer disposed on a substrate to a first exposure dose of extreme ultraviolet radiation at a first focus position using a first portion of an extreme ultraviolet mask;
a first moving of the substrate relative to the extreme ultraviolet mask; and
exposing the first portion of the photoresist layer to a second exposure dose of extreme ultraviolet radiation using a second portion of the extreme ultraviolet mask at a second focus position, and simultaneously exposing a second portion of the photoresist layer to the second exposure dose at the second focus position using the first portion of the extreme ultraviolet mask.

2. The method according to claim 1 , further comprising:
a second moving of the substrate relative to the extreme ultraviolet mask; and
exposing the first portion of the photoresist layer to a third exposure dose of extreme ultraviolet radiation using a third portion of the extreme ultraviolet mask at a third focus position, exposing the second portion of the photoresist layer to the third exposure dose of extreme ultraviolet radiation using the second portion of the extreme ultraviolet mask at the third focus position, and exposing a third portion of the photoresist layer to the third exposure dose of extreme ultraviolet radiation using the first portion of the extreme ultraviolet mask at the third focus position.

3. The method according to claim 2 , further comprising:
a third moving of the substrate relative to the extreme ultraviolet mask; and
exposing the first portion of the photoresist layer to a fourth exposure dose of extreme ultraviolet radiation using a fourth portion of the extreme ultraviolet mask at a fourth focus position, exposing the second portion of the photoresist layer to the fourth exposure dose of extreme ultraviolet radiation using the third portion of the extreme ultraviolet mask at the fourth focus position, exposing the third portion of the photoresist layer to the fourth exposure dose of extreme ultraviolet radiation using the second portion of the extreme ultraviolet mask at the fourth focus position, and exposing a fourth portion of the photoresist layer to the fourth exposure dose of extreme ultraviolet radiation using the first portion of the extreme ultraviolet mask at the fourth focus position.

4. The method according to claim 3 , wherein the first portion of the extreme ultraviolet mask, the second portion of the extreme ultraviolet mask, the third portion of the extreme ultraviolet mask, and the fourth portion of the extreme ultraviolet mask each have a same pattern.

5. The method according to claim 3 , wherein a total of all the exposure doses of extreme ultraviolet radiation received by each portion of the photoresist layer is equal to a target exposure dose.

6. The method according to claim 1 , wherein the first moving of the substrate relative to the extreme ultraviolet mask includes laterally moving the substrate relative to the extreme ultraviolet mask.

7. The method according to claim 1 , wherein the first moving of the substrate relative to the extreme ultraviolet mask includes moving the substrate closer to or further away from the extreme ultraviolet mask.

8. The method according to claim 1 , wherein the first moving of the substrate relative to the extreme ultraviolet mask includes tilting the substrate relative to the extreme ultraviolet mask.

9. A method of manufacturing a semiconductor device, comprising:
exposing a first portion of a photoresist layer disposed on a substrate to a first exposure dose of extreme ultraviolet radiation using a first portion of an extreme ultraviolet mask, wherein the photoresist layer and the extreme ultraviolet mask are separated by a first distance;
a first lateral stepping of the substrate relative to the extreme ultraviolet mask;
changing a distance between the substrate and the extreme ultraviolet mask so that the photoresist layer and the extreme ultraviolet mask are separated by a second distance; and
exposing the first portion of the photoresist layer to a second exposure dose of extreme ultraviolet radiation using a second portion of the extreme ultraviolet mask, and simultaneously exposing a second portion of the photoresist layer to the second exposure dose using the first portion of the extreme ultraviolet mask.

10. The method according to claim 9 , further comprising:
a second lateral stepping of the substrate relative to the extreme ultraviolet mask;
changing the distance between the substrate and the extreme ultraviolet mask so that the photoresist layer and the extreme ultraviolet mask are separated by a third distance; and
exposing the first portion of the photoresist layer to a third exposure dose of extreme ultraviolet radiation using a third portion of the extreme ultraviolet mask, exposing the second portion of the photoresist layer to the third exposure dose of extreme ultraviolet radiation using the second portion of the extreme ultraviolet mask, and exposing a third portion of the photoresist layer to the third exposure dose using the first portion of the extreme ultraviolet mask.

11. The method according to claim 10 , further comprising:
a third lateral stepping of the substrate relative to the extreme ultraviolet mask;
changing the distance between the substrate and the extreme ultraviolet mask so that the photoresist layer and the extreme ultraviolet mask are separated by a fourth distance; and
exposing the first portion of the photoresist layer to a fourth exposure dose of extreme ultraviolet radiation using a fourth portion of the extreme ultraviolet mask, exposing the second portion of the photoresist layer to the fourth exposure dose of extreme ultraviolet radiation using the third portion of the extreme ultraviolet mask, exposing a third portion of the photoresist layer to the fourth exposure dose using the second portion of the extreme ultraviolet mask, and exposing a fourth portion of the photoresist layer to the fourth exposure dose of extreme ultraviolet radiation using the first portion of the extreme ultraviolet mask.

12. The method according to claim 11 , wherein the first portion of the extreme ultraviolet mask, the second portion of the extreme ultraviolet mask, the third portion of the extreme ultraviolet mask, and the fourth portion of the extreme ultraviolet mask each have a same pattern.

13. The method according to claim 11 , wherein the second distance is less than the first distance, the third distance is greater than the second distance, and the fourth distance is less than the third distance.

14. The method according to claim 11 , wherein the distance between the photoresist layer and the extreme ultraviolet mask is changed by raising or lowering a wafer stage for the substrate.

15. A photolithography apparatus, comprising:
a photomask;
a wafer stage configured to support a substrate; and
a controller,
wherein the controller is configured to:
control an exposure of a first portion of a photoresist layer disposed on the substrate to a first exposure dose of radiation at a first distance separating the photoresist layer and the photomask;
control laterally moving of the substrate relative to the photomask;
control changing the first distance separating the photoresist layer and the photomask; and
control an exposure of the first portion of the photoresist layer to a second exposure dose of radiation using a second portion of the photomask at a second distance separating the photoresist layer and the photomask, and simultaneously an e

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Yu Shinn-Sheng
• Liu Ru-Gun
• Huang Hsu-Ting
• Yamazoe Kenji
• Chen Minfeng
• Chou Shuo-Yen
• Lin Chin-Hsiang

Classifications

• G03F7/2004

  characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light · CPC title

• G03F7/2022

  Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure · CPC title

• G03F7/70558

  Dose control, i.e. achievement of a desired dose · CPC title

• G03F7/203

  comprising an imagewise exposure to electromagnetic radiation or corpuscular radiation · CPC title

• G03F7/70491

  Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes · CPC title