Apparatus for printing a chemical mechanical polishing pad

Patent metadata

Field	Value
Publication number	US-9457520-B2
Application number	US-201514737356-A
Country	US
Kind code	B2
Filing date	Jun 11, 2015
Priority date	Apr 25, 2012
Publication date	Oct 4, 2016
Grant date	Oct 4, 2016

Abstract

A method of fabricating a polishing layer of a polishing pad includes successively depositing a plurality of layers with a 3D printer, each layer of the plurality of polishing layers deposited by ejecting a pad material precursor from a nozzle and solidifying the pad material precursor to form a solidified pad material.

First claim

What is claimed is:

1. An apparatus for fabricating a polishing layer of a polishing pad, comprising:
a supply of liquid polishing pad material precursor that becomes a polishing pad material upon curing;
a 3D printer including a nozzle and configured to successively deposit a plurality of layers to form the polishing layer on a support by ejecting droplets of the pad material precursor without a powder;
a computer coupled to the 3D printer and configured to control the 3D printer to deposit a first layer of the plurality of layers by ejecting droplets of the pad material precursor from the nozzle onto the support and to deposit each subsequent layer of the plurality layers by ejecting droplets of the pad material precursor from the nozzle directly onto an underlying layer of solidified polishing pad material without a layer of powder; and
a UV radiation source to cure the pad material precursor to solidify the liquid polishing pad material precursor so as to form the polishing pad material.

2. The apparatus of claim 1 , wherein the computer is configured to control the 3D printer such that a thickness of each layer of the plurality of layers is less than 50% of a total thickness of the polishing layer.

3. The apparatus of claim 2 , wherein the thickness of each layer of the plurality of layers is less than 1% of the total thickness of the polishing layer.

4. The apparatus of claim 1 , wherein the computer includes a 3D drawing program configured to control the 3D printer to form a pattern in at least some of the plurality of layers to form recesses in the polishing layer by controlling ejection of the pad material precursor.

5. The apparatus of claim 1 , wherein the nozzle is configured to translate across the support.

6. The apparatus of claim 1 , wherein the pad material precursor comprises a monomer.

7. The apparatus of claim 1 , wherein the support is a structure of the apparatus.

8. The apparatus of claim 1 , wherein the 3D printer is configured to eject droplets onto a support that forms a portion of the polishing pad.

9. The apparatus of claim 1 , wherein the UV radiation source is configured to cure the pad material precursor immediately upon deposition.

10. The apparatus of claim 1 , wherein the UV radiation source is configured to cure an entire layer of pad material precursor simultaneously after deposition of the layer.

11. The apparatus of claim 6 , wherein the pad material precursor comprises a urethane monomer.

12. An apparatus for fabricating a polishing pad, comprising:
a support to hold a plurality of layers of the polishing pad;
a 3D printer including a nozzle and configured to successively deposit the plurality of layers over the support to form the polishing pad by ejecting droplets of a pad material precursor;
a computer coupled to the 3D printer and configured to control the 3D printer to cause the 3D printer to form a backing layer of the polishing pad by successively depositing a first plurality of layers by ejecting droplets of a backing layer precursor from the nozzle and to form a polishing layer of the polishing pad by successively depositing a second plurality of layers with the 3D printer over the first plurality of layers by ejecting droplets of a polishing layer precursor from the nozzle, the wherein the backing layer precursor is a same precursor as the polishing layer precursor; and
means for curing configured to cure the backing layer precursor by a different degree than the polishing layer precursor such that the backing layer is softer than the polishing layer.

13. The apparatus of claim 12 , wherein the means for curing is configured to cure the polishing layer precursor such that solidified polishing material has a hardness between about 40 to 80 Shore D.

14. The apparatus of claim 12 , comprising a supply of the backing layer precursor, wherein the backing layer precursor comprises a urethane monomer.

15. The apparatus of claim 12 , wherein the means for curing comprises a UV radiation source.

16. The apparatus of claim 15 , wherein the means for curing is configured to cure the backing layer precursor by a different degree than the polishing layer precursor by using a different intensity of UV radiation.

Assignees

• Applied Materials Inc

Inventors

• Bajaj Rajeev
• Chin Barry Lee
• Lee Terrance Y

Classifications

• B24B37/26 Primary

  characterised by the shape of the lapping pad surface, e.g. grooved · CPC title

• B24D18/009

  Tools not otherwise provided for · CPC title

• B24D18/00

  Manufacture of grinding tools {or other grinding devices}, e.g. wheels, not otherwise provided for · CPC title

• B24B37/04 Primary

  designed for working plane surfaces · CPC title

• B33Y30/00

  Apparatus for additive manufacturing; Details thereof or accessories therefor · CPC title