Printing a chemical mechanical polishing pad

Patent metadata

Field	Value
Publication number	US-10029405-B2
Application number	US-201715688408-A
Country	US
Kind code	B2
Filing date	Aug 28, 2017
Priority date	Apr 25, 2012
Publication date	Jul 24, 2018
Grant date	Jul 24, 2018

Abstract

A method of fabricating a polishing layer of a polishing pad includes successively depositing a plurality of layers with a 3D printer, each layer of the plurality of polishing layers deposited by ejecting a pad material precursor from a nozzle and solidifying the pad material precursor to form a solidified pad material.

First claim

What is claimed is:

1. An apparatus for fabricating a polishing layer of a polishing pad, comprising:
a supply of liquid polishing pad material precursor, the liquid polishing pad material precursor comprising a polymer melt that becomes a polishing pad material upon cooling;
a droplet ejecting printer including a nozzle and configured to deliver the pad material precursor to successively to form a plurality of layers on a support, at least some of the plurality of layers providing the polishing layer;
a computer coupled to the droplet ejecting printer and configured to control the droplet ejecting printer to deposit a first layer of the plurality of layers by ejecting droplets of the pad material precursor from the nozzle onto the support and to deposit each subsequent layer of the plurality layers by ejecting droplets of the pad material precursor from the nozzle directly onto an underlying layer of solidified polishing pad material formed by cooling of the polymer melt.

2. The apparatus of claim 1 , wherein the computer is configured to control the droplet ejection printer such that a thickness of each layer of the plurality of layers is less than 50 % of a total thickness of the polishing layer.

3. The apparatus of claim 2 , wherein the thickness of each layer of the plurality of layers is less than 10 % of the total thickness of the polishing layer.

4. The apparatus of claim 3 , wherein the thickness of each layer of the plurality of layers is less than 1 % of the total thickness of the polishing layer.

5. The apparatus of claim 1 , wherein the computer includes a 3D drawing program configured to control the droplet ejection printer to form a pattern in at least some of the plurality of layers to form recesses in the polishing layer by controlling ejection of the pad material precursor.

6. The apparatus of claim 1 , wherein the nozzle is configured to translate across the support.

7. The apparatus of claim 1 , wherein the support is configured for the polishing pad material to be removed from the support to provide at least the polishing layer of the polishing pad.

8. The apparatus of claim 1 , wherein the apparatus is configured such at least some of the plurality of layers provide a backing layer of the polishing pad.

9. A method of forming a polishing layer of a chemical mechanical polishing pad, comprising:
ejecting a liquid polishing pad material precursor from a nozzle of a droplet ejecting printer onto a support to form a first layer of a plurality of layers, wherein the liquid polishing pad material precursor comprises a polymer melt that becomes a polishing pad material upon cooling;
cooling the polymer melt to form the first layer;
for each layer of a plurality of subsequent layers of the plurality of layers, ejecting the liquid polishing pad material precursor from the nozzle of the droplet ejecting printer directly onto an underlying layer of solidified polishing pad material formed by cooling of the polymer melt and cooling the polymer melt to form the layer of the plurality of subsequent layers, wherein at least some of the plurality of layers provide the polishing layer.

10. The method of claim 9 , comprising removing at least the polishing layer from the support.

11. The method of claim 9 comprising ejecting droplets from the droplet ejection printer to form a pattern in at least some of the plurality of layers to form recesses in the polishing layer.

12. The method of claim 9 , comprising translating the nozzle across the support during ejecting of the liquid polishing pad material precursor to form the layer of the plurality of layers.

13. The method of claim 9 , wherein at least some of the plurality of layers provide a backing layer of the polishing pad.

Assignees

• Applied Materials Inc

Inventors

• Bajaj Rajeev
• Chin Barry Lee
• Lee Terrance Y

Classifications

• B24B37/26 Primary

  characterised by the shape of the lapping pad surface, e.g. grooved · CPC title

• H10P50/00 Primary

  Etching of wafers, substrates or parts of devices · CPC title

• B24D18/00

  Manufacture of grinding tools {or other grinding devices}, e.g. wheels, not otherwise provided for · CPC title

• B29C35/0805

  using electromagnetic radiation · CPC title

• B29K2105/0002

  monomers or prepolymers · CPC title