Planarization process, apparatus and method of manufacturing an article
US-2021050246-A1 · Feb 18, 2021 · US
Planarization process, apparatus and method of manufacturing an article
US12138747B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12138747-B2 |
| Application number | US-202217748859-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 19, 2022 |
| Priority date | May 19, 2022 |
| Publication date | Nov 12, 2024 |
| Grant date | Nov 12, 2024 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
A planarization apparatus comprising a superstrate chuck is provided. The superstrate includes a plurality of inner lands protruding from a surface of the superstrate chuck and a peripheral land protruding from the surface of the superstrate chuck along a periphery of the superstrate chuck and encircling the inner lands therein. The peripheral land has a height smaller than a height of each of the inner lands. The peripheral land has a width sufficiently larger than a width of each of the inner lands such that a pressure leakage through the peripheral land is controlled to be less than a threshold.
First claim
Opening claim text (preview).
What is claimed is: 1. A planarization apparatus, comprising: a superstrate chuck, comprising: one or more inner lands protruding from a surface of the superstrate chuck; and a peripheral land protruding from the surface of the superstrate chuck along a periphery of the superstrate chuck and encircling the inner lands therein, wherein: the peripheral land has a height smaller than a height of each of the inner lands; and the peripheral land has a width larger than a width of each of the inner lands, wherein a surface of the peripheral land distal to the surface of the superstrate chuck has a multi-step structure, and wherein the peripheral land includes a highest step at an outer edge and a lowest step between the outer edge and an inner edge of the peripheral land. 2. The planarization apparatus of claim 1 , wherein the height of the peripheral land is smaller than the height of the one or more inner lands to create a positive curvature at an outer edge of a superstrate held by the superstrate chuck while spreading a formable material on a substrate. 3. The planarization apparatus of claim 1 , wherein the height of the peripheral land is smaller than the height of the inner lands to initiate and propagate a crack between a superstrate held by the superstrate chuck and a formable material. 4. The planarization apparatus of claim 1 , wherein the height of the peripheral land is 1 to 100 microns smaller than the height of the inner land. 5. The planarization apparatus of claim 1 , wherein the peripheral land has an outer diameter greater than a diameter of the superstrate. 6. The planarization apparatus of claim 1 , wherein the width of the inner land is 0.1 mm to 1.0 mm, and the width of the peripheral land is 2.0 mm to 10.0 mm. 7. The planarization apparatus of claim 1 , wherein the width of the peripheral land is at least five times larger than the width of the one or more inner lands.
Assignees
Inventors
Classifications
Vacuum chucks · CPC title
- B25B11/005Primary
Vacuum work holders · CPC title
using vacuum or suction, e.g. Bernoulli chucks · CPC title
Planarisation of inorganic insulating materials · CPC title
- H10P72/0428Primary
Apparatus for mechanical treatment or grinding or cutting · CPC title
Patent family
Related publications grouped by family.
External sources
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US12138747B2 cover?
- A planarization apparatus comprising a superstrate chuck is provided. The superstrate includes a plurality of inner lands protruding from a surface of the superstrate chuck and a peripheral land protruding from the surface of the superstrate chuck along a periphery of the superstrate chuck and encircling the inner lands therein. The peripheral land has a height smaller than a height of each of …
- Who is the assignee on this patent?
- Canon Kk
- What technology area does this patent fall under?
- Primary CPC classification B25B11/005. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Nov 12 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).