Planarization process, apparatus and method of manufacturing an article

US2021050245A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2021050245-A1
Application numberUS-201916542062-A
CountryUS
Kind codeA1
Filing dateAug 15, 2019
Priority dateAug 15, 2019
Publication dateFeb 18, 2021
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A chuck is provided. The chuck comprises a plurality of lands protruding from a surface of the chuck, the lands defining a series of zones; and a trenched recessed from the surface of the chuck in at least one of the zones.

First claim

Opening claim text (preview).

What is claimed is: 1 . A chuck, comprising: a plurality of lands protruding from a surface of the chuck, the lands defining a series of zones; and a trench recessed from the surface of the chuck in at least one of the zones. 2 . The chuck of claim 1 , wherein series of zones includes a peripheral zone immediately adjacent to an outermost land of the plurality of lands and a plurality of inner zones surrounded by the peripheral zone, and the trench is formed in at least one of the inner zones at an area distal to a center of the chuck. 3 . The chuck of claim 2 , wherein the peripheral zone has a width smaller than a width of each of the inner ring zones. 4 . The chuck of claim 2 , wherein the trench in the at least one inner zones has a width less than a half width of the inner zones. 5 . The chuck of claim 2 , wherein a trench is formed in the peripheral zone at an area proximal to the center of the chuck. 6 . The chuck of claim 1 , wherein the series of zones includes a peripheral zone immediately adjacent to an outermost land of the plurality of lands and a plurality of inner zones surrounded by the peripheral zone, and the lands defining the series of inner zones are equally distant from each other. 7 . The chuck of claim 1 , wherein the series of zones include a peripheral zone immediately adjacent to an outermost land of the plurality of lands and a plurality of inner zones surrounded by the peripheral zone, and the outermost land has a height less than a height of the lands defining the inner zones. 8 . The chuck of claim 1 , wherein the trench of each of the zones has a depth at least ten times larger than a height of each of the lands. 9 . The chuck of claim 1 , further comprising a fluid port in fluid communication with the trench. 10 . The chuck of claim 1 , wherein the series of zones are arranged concentrically about a center zone of the chuck. 11 . The chuck of claim 1 , wherein the chuck is configured to retain a substrate, a superstrate, or a wafer to the surface thereof. 12 . The chuck of claim 1 , wherein the chuck is configured to hold a substrate, a superstrate, or a wafer by applying a negative pressure to a zone surrounded by the lands. 13 . A method of using a chuck, comprising: providing a chuck having a series of zones defined by a plurality of lands protruding from a surface of the chuck and a trenched recessed from the surface of the chuck in at least one of the series of zones; retaining a superstrate on the surface of the chuck; advancing the superstrate to be in contact with a formable material dispensed the substrate; curing the formable material with a curing source; and separating the superstrate from the cured formable material. 14 . The method of claim 12 , wherein the series of zones includes a peripheral zone immediately adjacent to an outermost land of the plurality of lands and a plurality of inner zones surrounded by the peripheral zone, and the trench is formed in each of the inner zones at an area distal to a center of the chuck. 15 . The method of claim 13 , wherein the trench is formed in each of the inner zone with a width less than a half width of each of the inner zone. 16 . The method of claim 13 , wherein the trench is formed in the peripheral zone in an area proximal to the center of the chuck. 17 . The method of claim 13 , wherein the trench is formed in each of the zones with a depth at least ten times larger than a height of each of the lands. 18 . The method of claim 12 , wherein the chuck further includes a vacuum port in fluid communication with each of the trenches. 19 . The method of claim 12 , wherein the series of zones includes a peripheral zone immediately adjacent to an outermost land of the plurality of lands and a plurality of inner zones surrounded by the peripheral zone, wherein the lands defining the series of inner zones are equally distant from each other. 20 . A method of manufacturing an article, comprising: dispensing a formable material on a substrate; retaining a superstrate with a superstrate chuck, wherein: the superstrate chuck being defined with a series of zones by a plurality of lands protruding from a surface of thereof; and a trench recessed from the surface of the superstrate chuck is formed in at least one of the series of zones; advancing the superstrate to be in contact with a formable material dispensed on the substrate; curing the formable material with a curing source; and separating the superstrate from the cured formable material.

Assignees

Inventors

Classifications

  • Planarisation of inorganic insulating materials · CPC title

  • using mechanical means, e.g. clamps or pinches · CPC title

  • characterised by the mechanical construction of the susceptor, stage or support · CPC title

  • Apparatus for placing on an insulating substrate, e.g. tape · CPC title

  • H10P72/78Primary

    using vacuum or suction, e.g. Bernoulli chucks · CPC title

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Frequently asked questions

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What does patent US2021050245A1 cover?
A chuck is provided. The chuck comprises a plurality of lands protruding from a surface of the chuck, the lands defining a series of zones; and a trenched recessed from the surface of the chuck in at least one of the zones.
Who is the assignee on this patent?
Canon Kk
What technology area does this patent fall under?
Primary CPC classification H10P72/7624. Mapped technology areas include Electricity.
When was this patent published?
Publication date Thu Feb 18 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).