Electrically conductive vias and methods for producing same

Patent metadata

Field	Value
Publication number	US-12009225-B2
Application number	US-201917043998-A
Country	US
Kind code	B2
Filing date	Mar 29, 2019
Priority date	Mar 30, 2018
Publication date	Jun 11, 2024
Grant date	Jun 11, 2024

Abstract

An electrical component is provided by metallizing holes that extend through a glass substrate. The electrical component can be fabricated by forcing a suspension of electrically conductive particles suspended in a liquid medium through the holes. The suspension can be forced into the holes under an air pressure differential such as a vacuum force, a centrifugal force, or an electrostatic force. The liquid medium in the holes can be dried, and the particles can be sintered. The particles can further be packed in the hole. Alternatively or additionally, the particles can be pressed against the outer surfaces of the substrate to produce buttons.

First claim

The invention claimed is:

1. An electrical component comprising:
a substrate defining a first surface and a second surface opposite the first surface, and a hole that extends from the first surface to the second surface; and
an electrically conductive metal fill that extends in the hole from the first surface to the second surface so as to define an electrically conductive via, wherein the electrically conductive fill defines an electrically conductive path from the first surface to the second surface,
wherein the metal fill comprises sintered metal particles, and a majority of the metal particles are substantially non-densification sintered, and
wherein respective geometric centers of adjacent substantially non-densification sintered metal particles are spaced apart a distance that defines a difference with respect a distance between the geometric centers prior to sintering, and the difference is no more than 30% of the distance between the geometric centers prior to sintering.

2. The electrical component as recited in claim 1 , wherein the substrate is a glass substrate.

3. The electrical component as recited in claim 1 , wherein the fill defines bumps that extend out with respect to the first and second surfaces, respectively.

4. The electrical component as recited in claim 3 , wherein the bumps are defined by pressed overfill of electrically conductive particles.

5. The electrical component as recited in claim 1 , wherein the particles are forced into the hole under a force that is defined by one of a pressure differential, a centrifugal force, and an electrostatic force.

6. The electrical component as recited in claim 5 , wherein the sintered particles have an average particle size between approximately 1 micron and approximately 10 microns prior to sintering.

7. The electrical component as recited in claim 6 , wherein the sintered particles define a plurality of first particles having the average particle size, and the sintered particles define a plurality of second particles having an average particle size between approximately 0.01 micron and approximately 1 micron.

8. The electrical component as recited in claim 7 , wherein the second particles extend from the first particles to the first and second surfaces of the substrate, respectively.

9. The electrical component as recited in claim 1 , wherein the hole has a cross sectional dimension that ranges from 10 μm to 25 μm.

10. The electrical component as recited in claim 9 , wherein the via has a hermeticity less than 10 −7 .

Assignees

• Samtec Inc

Inventors

• Nolet Alan
• Goia Daniel
• Hardikar Vishwas
• Kumar Ajeet
• Long Daniel
• Liotta Andrew

Classifications

• H10W70/692 Primary

  Ceramics or glasses · CPC title

• H10W70/635

  Through-vias · CPC title

• H10W70/095 Primary

  of vias therein · CPC title

• H01L21/486 Primary

  Electricity · mapped topic

• H01L23/49827

  Electricity · mapped topic