Package substrate and semiconductor package including the same
US-2024429153-A1 · Dec 26, 2024 · US
Intermetallic compound filled vias
US2016218056A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2016218056-A1 |
| Application number | US-201615089572-A |
| Country | US |
| Kind code | A1 |
| Filing date | Apr 3, 2016 |
| Priority date | Feb 25, 2014 |
| Publication date | Jul 28, 2016 |
| Grant date | — |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
Electronic devices including intermetallic columns within vias are provided. Vias are filled with one or more pastes containing metal particles. Thermal treatment of the pastes within the vias converts the particles within the pastes to one or more intermetallic compounds that do not melt during next level packaging.
First claim
Opening claim text (preview).
What is claimed is: 1 . An electronic device comprising: a wafer; a plurality of vias within the wafer, and a plurality of electrically conductive columns filling the vias, each of the columns consisting essentially of one or more intermetallic compounds, the intermetallic compounds comprising at least one of tin and indium. 2 . The electronic device of claim 1 , wherein the columns consist essentially of Cu 6 Sn 5 . 3 . The electronic device of claim 2 , wherein the wafer comprises silicon or glass and the vias have aspect ratios between three and thirty. 4 . The electronic device of claim 2 , wherein each intermetallic column has a diameter between 2-100 μm. 5 . The electronic device of claim 1 , wherein the intermetallic columns comprise tin and at least one of copper and nickel. 6 . The electronic device of claim 5 , wherein the vias have aspect ratios between three and thirty and each column has a diameter between 5-50 μm. 7 . The electronic device of claim 1 , wherein the vias extend through the wafer.
Assignees
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Classifications
Soldering or alloying · CPC title
comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu · CPC title
Applying pastes or inks, e.g. screen printing (H10W70/095 takes precedence) · CPC title
Insulating materials thereof · CPC title
Conductive materials thereof · CPC title
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Frequently asked questions
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- What does patent US2016218056A1 cover?
- Electronic devices including intermetallic columns within vias are provided. Vias are filled with one or more pastes containing metal particles. Thermal treatment of the pastes within the vias converts the particles within the pastes to one or more intermetallic compounds that do not melt during next level packaging.
- Who is the assignee on this patent?
- IBM
- What technology area does this patent fall under?
- Primary CPC classification H10W70/635. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu Jul 28 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).