System and methods for wafer drying

Patent metadata

Field	Value
Publication number	US-12002687-B2
Application number	US-202217993721-A
Country	US
Kind code	B2
Filing date	Nov 23, 2022
Priority date	Mar 16, 2020
Publication date	Jun 4, 2024
Grant date	Jun 4, 2024

Abstract

In one example, a method for wafer drying includes providing a surface of a first wafer, the surface of the first wafer including a liquid to be removed with a drying process. The method further includes replacing the liquid with a first solid film in a first processing chamber, the first solid film covering the surface of the first wafer. The method further includes transferring the first wafer from the first processing chamber to a second processing chamber. The method further includes processing the first wafer in the second processing chamber by flowing a supercritical fluid through the second processing chamber, where the supercritical fluid removes the first solid film.

First claim

What is claimed is:

1. A process equipment for supercritical drying comprising:
a processing chamber;
a fluid inlet system into the processing chamber;
a fluid outlet system out of the processing chamber;
a support for holding a wafer with a plurality of high aspect ratio features at a surface of the wafer to be dried;
a wafer transport system configured to transport and hold the wafer within the processing chamber;
a control circuit configured to apply a pressurization cycle to pressurize a fluid in the processing chamber to become a supercritical fluid;
wherein the processing chamber is configured to replace a liquid to be removed from the wafer with a solid film, and wherein the control circuit is configured to remove the solid film by applying the pressurization cycle and flowing the supercritical fluid for the supercritical drying; and
wherein the control circuit is configured to depressurize the processing chamber and stop the flow of the supercritical fluid into the processing chamber and remove the wafer from the processing chamber.

2. The process equipment of claim 1 , wherein the control circuit comprises:
a temperature controller configured to monitor and control the temperature of the fluid;
a pressure controller configured to monitor and control the pressure of the fluid; and
a timing controller configured to control time spent by the wafer within the processing chamber.

3. The process equipment of claim 2 , wherein the temperature controller, the timing controller, and the pressure controller are integrated in a single chip.

4. The process equipment of claim 1 , wherein the support is configured to simultaneously hold a plurality of wafers, wherein the control circuit is configured to provide an identical process environment to each of the plurality of wafers during the pressurization cycle.

5. The process equipment of claim 1 , further comprising a vent fan configured to evacuate gases from the processing chamber and regulate the temperature within the processing chamber.

6. The process equipment of claim 5 , wherein the vent fan is located at the bottom of the processing chamber.

7. The process equipment of claim 1 , further comprising:
the fluid inlet system comprising a fluid supply source configured to supply the fluid at a pressure higher than atmospheric pressure into the processing chamber; and
a fluid supply path connecting the fluid supply source to the processing chamber, wherein the fluid inlet system comprises a flow control unit with an on-off valve disposed in the fluid supply path.

8. The process equipment of claim 7 , wherein the fluid inlet system comprises heaters configured to heat the fluid being dispensed through the fluid supply path.

9. The process equipment of claim 7 , wherein the fluid inlet system comprises a plurality of sensors configured to sense temperature and pressure of the fluid being dispensed through the fluid supply path.

10. The process equipment of claim 7 , wherein the fluid inlet system comprises an orifice configured to regulate the pressure of the fluid being supplied from the fluid supply source, wherein the fluid inlet system comprises a filter to remove foreign matter contained in the fluid being sent from the orifice.

11. The process equipment of claim 7 , further comprising:
the fluid outlet system for discharging the fluid from the processing chamber; and
a downstream discharge path connecting the processing chamber to downstream components, wherein the fluid outlet system comprises a discharge control valve configured to adjust the on and off of the discharge of the fluid from the processing chamber.

12. The process equipment of claim 11 , wherein the fluid outlet system comprises a plurality of sensors configured to sense temperature and pressure of the fluid being discharged from the processing chamber through the downstream discharge path.

13. The process equipment of claim 11 , wherein the fluid outlet system comprises a pressure reducing valve configured to regulate the pressure of the fluid being discharged from the processing chamber.

14. The process equipment of claim 1 , further comprising:
a vent fan to evacuate gases from the processing chamber and regulate a temperature within the processing chamber;
wherein the control circuit comprises a temperature controller configured to monitor and control the temperature of the fluid, a pressure controller configured to monitor and control the pressure of the fluid, a timing controller configured to control time spent by the wafer within the processing chamber, and a power controller configured to supply power to the wafer transport system.

15. A system comprising:
a first processing chamber;
a nozzle to dispense a polymeric material onto a center location of a wafer with a plurality of high aspect ratio features at a surface of the wafer;
a wafer holding mechanism configured to rotate the wafer while dispensing the polymeric material, the first processing chamber being configured to perform a soft baking or curing process to convert the polymeric material to a solid film;
a second processing chamber;
a transport system configured to robotically transport the wafer from the first processing chamber to the second processing chamber;
a mechanical handling system configured to support the wafer within the second processing chamber;
a fluid inlet into the second processing chamber;
a fluid outlet out of the second processing chamber; and
an interface circuit configured to apply a pressurization cycle, the pressurization cycle configured to pressurize a fluid in the second processing chamber to become a supercritical fluid, remove the solid film by the supercritical fluid;
purge the supercritical fluid completely from the second processing chamber, and
remove the wafer from the second processing chamber after depressurizing the second processing chamber and stopping the flow of the supercritical fluid to the second processing chamber.

16. The system of claim 15 , wherein the first processing chamber is configured to perform wet cleaning of a surface of the wafer prior to dispensing the polymeric material.

Assignees

• Tokyo Electron Ltd

Inventors

• Hurd Trace
• Rotondaro Antonio Luis Pacheco
• Bassett Derek William
• Kosugi Hitoshi

Classifications

• H10P72/0461

  characterised by the presence of two or more transfer chambers · CPC title

• H10P72/0411

  for wet cleaning or washing · CPC title

• H10P72/0408 Primary

  for drying · CPC title

• H10P70/80 Primary

  Cleaning only by supercritical fluids · CPC title

• H10P70/20

  Cleaning during device manufacture · CPC title