Peeling bar for peeling polarizing film from panel, peeling apparatus and peeling method using the same
US-9914290-B2 · Mar 13, 2018 · US
US11958206B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11958206-B2 |
| Application number | US-201916427498-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 31, 2019 |
| Priority date | Aug 7, 2018 |
| Publication date | Apr 16, 2024 |
| Grant date | Apr 16, 2024 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
A cutting apparatus includes: a stage on which is disposed a preliminary stacked body from which a cut stacked body having an edge is formed; a cutting unit movable along a first direction corresponding to an extension direction of the edge of the cut stacked body and with which the preliminary stacked body is cut to form the cut stacked body; a first detaching unit movable in a direction forming an acute angle with the first direction and including a first detaching tool which contacts the cut stacked body in detaching of the cut stacked body from the carrier substrate; and a second detaching unit movable in a direction parallel to the first direction and including a second detaching tool which is inserted between the cut stacked body and the carrier substrate in the detaching of the cut stacked body from the carrier substrate.
Opening claim text (preview).
What is claimed is: 1. A cutting apparatus comprising: a stage configured to receive a carrier substrate and a stacked body which is on the carrier substrate, the stage including a corner and an edge which extends from the corner along a first direction; a first detaching tool which is adjacent to the stage and includes an adhesive roller; a second detaching tool which is adjacent to the stage and includes a knife protruding in a second direction intersecting the first direction; a first guide rail which is positioned adjacent to the stage and lengthwise extending along the first direction; a first horizontal connector which is movably connected to the first guide rail along the first direction; a second guide rail which is positioned adjacent to the stage, the first detaching tool being movably connected to the second guide rail along the second guide rail; a lengthwise extending direction of the first guide rail and a lengthwise extending direction of the second guide rail forming an acute angle with each other, a cutter which is adjacent to the stage and cuts the stacked body both vertically and along the first direction into a cut stacked body, the cutter being movably connected to the first horizontal connector along the second direction; and the first detaching tool configured to perform a first initial detaching of the cut stacked body with respect to the carrier substrate from the corner when the second detaching tool performs a second initial detaching of the cut stacked body with respect to the carrier substrate from the edge, wherein the first initial detaching includes the adhesive roller of the first detaching tool moved in the lengthwise extending direction of the second guide rail at a same time the adhesive roller contacts with an upper surface of the cut stacked body which is at the corner, and the second initial detaching includes the knife of the second detaching tool moved in the first direction at a same time the knife is inserted between the carrier substrate and the cut stacked body. 2. The cutting apparatus of claim 1 , wherein the stage has a planar shape and is rotatable with respect to a center of the planar shape. 3. The cutting apparatus of claim 1 , wherein the first detaching tool is arranged adjacent to the corner of the stage. 4. The cutting apparatus of claim 3 , wherein the first initial detaching further includes the adhesive roller moved along a virtual line inclined with respect to both the first and second directions, from the corner of the stage, together with being contactable with the cut stacked body. 5. The cutting apparatus of claim 1 , wherein the second initial detaching further includes the knife moved in the first direction along the edge of the stage, from the corner of the stage, together with being insertable between the carrier substrate and the cut stacked body. 6. The cutting apparatus of claim 1 , wherein the cutter comprises a scribing wheel. 7. The cutting apparatus of claim 1 , further comprising a cutter connector which connects the first horizontal connector and the cutter to each other and which adjusts a height of the cutter relative to the stacked body in cutting of the stacked body. 8. The cutting apparatus of claim 1 , further comprising a second horizontal connector movably connected to the first guide rail along the first direction, wherein the second detaching tool protrudes in the second direction and is movably connected to the second horizontal connector along the first direction. 9. A cutting apparatus comprising: a stage configured to receive a carrier substrate and a stacked body which is on the carrier substrate, the stage including a corner and an edge which extends from the corner along a first direction; a cutter which is adjacent to the stage and cuts the stacked body both vertically and along the first direction into a cut stacked body; the stage including: a central portion configured to receive the stacked body and having a flat surface, an inclined portion extended from the central portion and configured to receive a cut portion of the stacked body which is adjacent to the cut stacked body, and a plurality of vacuum holes defined in the stage, the plurality of vacuum holes configured to maintain the carrier substrate and the stacked body on the stage; a first detaching tool which is adjacent to the stage, is movable in a direction forming an acute angle with the first direction, and includes an adhesive roller, the first detaching tool configured to perform a first initial detaching of the cut stacked body with respect to the carrier substrate from the corner; and a second detaching tool which is adjacent to the stage, is movable along the first direction, and includes a knife protruding in a second direction intersecting the first direction, the second detaching tool configured to perform a second initial detaching of the cut stacked body with respect to the carrier substrate from the edge, wherein among the plurality of vacuum holes of the stage, a suction force generated by vacuum holes at the inclined portion is greater than a suction force generated by vacuum holes at the central portion and the first initial detaching includes the adhesive roller of the first detaching tool moved in the acute angle with the first direction together with being contactable with an upper surface of the cut stacked body which is at the corner, together with the second initial detaching including the knife of the second detaching tool moved in the first direction together with being insertable between the carrier substrate and the cut stacked body.
for supporting or gripping · CPC title
Handling or holding of wafers, substrates or devices during manufacture or treatment thereof · CPC title
Precutting and tensioning or breaking · CPC title
by suction · CPC title
Removing layers, or parts of layers, mechanically or chemically · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.