SiC wafer producing method
US-10155323-B2 · Dec 18, 2018 · US
Precutting and tensioning or breaking · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B26F3/002 |
| Official title | {Precutting and tensioning or breaking} |
| Display label | Precutting and tensioning or breaking |
| Total patents | 155 |
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 14 |
| 2016 | 20 |
| 2017 | 14 |
| 2018 | 16 |
| 2019 | 19 |
| 2020 | 15 |
| 2021 | 18 |
| 2022 | 6 |
| 2023 | 9 |
| 2024 | 16 |
| 2025 | 8 |
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
US-10155323-B2 · Dec 18, 2018 · US
US-10137591-B2 · Nov 27, 2018 · US
US-10131564-B2 · Nov 20, 2018 · US
US-2018323105-A1 · Nov 8, 2018 · US
US-2018272552-A1 · Sep 27, 2018 · US
US-2018259711-A1 · Sep 13, 2018 · US
US-10065759-B2 · Sep 4, 2018 · US
US-2018244026-A1 · Aug 30, 2018 · US
US-2018244031-A1 · Aug 30, 2018 · US
US-2018199975-A1 · Jul 19, 2018 · US
US-2018154542-A1 · Jun 7, 2018 · US
US-9907596-B2 · Mar 6, 2018 · US
US-9822029-B2 · Nov 21, 2017 · US
US-9796150-B2 · Oct 24, 2017 · US
US-2017297756-A1 · Oct 19, 2017 · US
US-2017259547-A1 · Sep 14, 2017 · US
US-2017251678-A1 · Sep 7, 2017 · US
US-9754719-B2 · Sep 5, 2017 · US
US-9726217-B2 · Aug 8, 2017 · US
US-2017144215-A1 · May 25, 2017 · US
Answers are generated from the same data shown on this page.