Device for forming separation starting point, stack manufacturing apparatus, and method for forming separation starting point

Patent metadata

Field	Value
Publication number	US-2015059986-A1
Application number	US-201414468801-A
Country	US
Kind code	A1
Filing date	Aug 26, 2014
Priority date	Aug 30, 2013
Publication date	Mar 5, 2015
Grant date	—

Abstract

A device for forming a separation starting point that allows separation of a surface layer of a processed member to form a remaining portion is provided. A manufacturing device of a stack including a support and a remaining portion of a processed member whose surface layer is separated is provided. The device for forming the separation starting point includes a stage that supports the processed member, a cutter that faces the stage, a head portion that supports the cutter, an arm portion that supports the head portion, and a moving mechanism that relatively moves the cutter to the stage.

First claim

What is claimed is:

1 . A device for forming a separation starting point comprising:
a stage configured to support a processed member to be provided with the separation starting point that allows separation of a surface layer of the processed member to form a remaining portion; a cutter that faces the stage; a head portion that supports the cutter; an arm portion that supports the head portion; and a moving mechanism configured to determine a relative position of the cutter to the stage, wherein the cutter is configured to cut the processed member while leaving part of the processed member, and wherein the moving mechanism relatively moves the cutter along the stage.

2 . The device for forming the separation starting point according to claim 1 ,
wherein the moving mechanism places the cutter so that the processed member is cut to a predetermined depth while leaving the part of the processed member.

3 . The device for forming the separation starting point according to claim 1 , further comprising:
a camera configured to take an image of a cut portion of the processed member; and an image processing portion configured to process the image taken by the camera, wherein the image processing portion is configured to deter nine whether the separation starting point is formed along the cut portion or not.

4 . The device for forming the separation starting point according to claim 1 , further comprising:
a camera configured to take an image of a cut portion of the processed member; and an image processing portion configured to process the image taken by, the camera, wherein the stage is configured to support processed member in which a marker is formed near the cut portion, and wherein the image processing portion is configured to detect a change in an image of the marker and determine whether the separation starting point is formed along the cut portion or not.

5 . A stack manufacturing apparatus comprising:
a loader unit configured to feed the processed member to be provided with the separation starting point that allows the separation of one surface layer of the processing member to form the remaining portion; a starting point forming unit configured to form the separation starting point by cutting the processed member while leaving the part of the processed member; a separating unit configured to separate the one surface layer of the processed member to form the remaining portion; an attaching unit to which a support is fed and which is configured to attach the support to the remaining portion with an adhesive layer; a support feeding unit configured to feed the support; and an unloader unit configured to transport a stack including the remaining portion and the support attached to each other with the adhesive layer, wherein the starting point forming unit comprises the device for forming the separation starting point according to claim 1 .

6 . A stack manufacturing apparatus comprising:
a first loader unit configured to feed the processed member provided with a separation starting point that allows separation of one surface layer of the processed member to form a first remaining portion and allows separation of the other surface layer which is cut while leaving the part of the other surface layer to form a second remaining portion; a first separating unit configured to separate the one surface layer of the processed member to form the first remaining portion; a first attaching unit to which a first support is fed and which is configured to attach the first support to the first remaining portion with a first adhesive layer; a support feeding unit configured to feed the first support and a second support; a first unloader unit configured to transport a first stack including the first remaining portion and the first support attached to each other with the first adhesive layer; a second loader unit configured to feed the first stack; a starting point forming unit configured to form the separation starting point by cutting the first stack while leaving part of the first stack; a second separating unit configured to separate one surface layer of the first stack to form the second remaining portion; a second attaching unit to which the second support is fed and which is configured to attach the second support to the second remaining portion with a second adhesive layer; a second unloader unit configured to transport a second stack including the second remaining portion and the second support attached to each other with the second adhesive layer, wherein the starting point forming unit comprises the device for forming the separation starting point according to claim 1 .

7 . A device for forming a separation starting point comprising:
a stage configured to support a first stack; a cutter that faces the stage; a first head portion that holds the cutter; a first arm portion that holds the first head portion; a pressing tool that faces the stage; a second head portion that holds the pressing tool; a second arm portion that holds the second head portion; and a moving mechanism that is configured to determine a relative position of the cutter and a position of the pressing tool to the stage, wherein the moving mechanism is configured to determine relative position of the cutter and the cutter is configured to cut the first stack while leaving part of the first stack so that a cut portion is peeled from a remaining part, and wherein the moving mechanism is configured to determine the relative position of the pressing tool so that a vicinity of the cut portion of the first stack is pressed onto the stage.

8 . The device for forming the separation starting point according to claim 7 , wherein the stage supports the first stack in which a substrate, a separation layer, a layer to be separated, a first support, and a protective film are placed in this order.

9 . A method for forming a separation starting point comprising the steps of:
cutting a first stack comprising a substrate, a separation layer, a layer to be separated, a first support, and a protective film in this order while leaving the substrate so that an end portion in the layer to be separated is formed; peeling the end portion from the substrate; and pressing a vicinity of the end portion onto the substrate.

10 . The method for forming the separation starting point according to claim 9 , wherein in pressing the vicinity of the end portion, the vicinity of the end portion is pressed onto the substrate while a position where the vicinity of the end portion is pressed is shifted in a direction opposite to a direction in which the end portion is peeled from the substrate and the separation is carried on.

11 . The method for forming the separation starting point according to claim 9 , wherein a liquid is supplied to the end portion in cutting the first stack and peeling the end portion.

12 . The method for forming the separation starting point according to claim 9 , wherein a liquid is supplied to the end portion in cutting the first stack or peeling the end portion.

13 . The method for forming the separation starting point according to claim 11 , wherein the liquid is water or a polar solvent.

14 . The method for forming the separation starting point according to claim 12 , in the liquid is water or a polar solvent.

15 . The method for forming the separation starting point according to claim wherein the substrate comprises one selected from the group of glass, a ceramic, a metal, an inorganic material, and a resin.

16 . A stack manufacturing apparatus comprising:

Assignees

• Semiconductor Energy Lab

Inventors

• Komatsu Ryu
• Yokoyama Kohei
• Ohno Masakatsu
• Idojiri Satoru
• Ikeda Hisao
• Jinbo Yasuhiro
• Adachi Hiroki
• Hirakata Yoshiharu
• Eguchi Shingo
• Nakamura Daiki

Classifications

• C03B33/027

  Scoring tool holders; Driving mechanisms therefor · CPC title

• C03B33/07

  Cutting armoured, {multi-layered, coated} or laminated, glass products · CPC title

• Y10T156/1082

  Partial cutting bonded sandwich [e.g., grooving or incising] · CPC title

• Y10T156/1051

  by folding · CPC title

• Y10T156/1126

  Using direct fluid current against work during delaminating · CPC title