Method of cutting liquid crystal display panel

Patent metadata

Field	Value
Publication number	US-2016018682-A1
Application number	US-201514742400-A
Country	US
Kind code	A1
Filing date	Jun 17, 2015
Priority date	Jul 21, 2014
Publication date	Jan 21, 2016
Grant date	—

Abstract

A mother substrate assembly according to an exemplary embodiment of the present invention includes: a first mother substrate and a second mother substrate formed with a plurality of unit liquid crystal panels; and a sealant formed between the first mother substrate and the second mother substrate and combining the mother substrates, wherein the sealant encloses a circumference of each unit liquid crystal panel, and includes a first irradiation line formed in the sealant, and a second irradiation line formed in the sealant of a side closer to the unit liquid crystal panel than the first irradiation line.

First claim

What is claimed is:

1 . A mother substrate assembly, comprising:
a first mother substrate and a second mother substrate formed with a plurality of unit liquid crystal panels; and a sealant formed between the first mother substrate and the second mother substrate and combining the mother substrates, wherein the sealant encloses a circumference of each unit liquid crystal panel, and includes a first irradiation line formed in the sealant, and a second irradiation line formed in the sealant of a side closer to the unit liquid crystal panel than the first irradiation line.

2 . The mother substrate assembly of claim 1 , wherein the first irradiation line and the second irradiation line are empty spaces in which the sealant is removed or spaces in which the sealant is partially removed or damaged such that adherence with the mother substrate is lost.

3 . The mother substrate assembly of claim 1 , wherein the first irradiation line and the second irradiation line are straight lines parallel to an edge of the unit liquid crystal panel.

4 . The mother substrate assembly of claim 3 , further comprising a third irradiation line formed in the sealant of the side closer to the unit liquid crystal panel than the first irradiation line and the second irradiation line.

5 . The mother substrate assembly of claim 1 , wherein
the second irradiation line is a straight line parallel to an edge of the unit liquid crystal panel, and the first irradiation line is perpendicular to the second irradiation line and includes a plurality of short lines formed in a direction from the center of the sealant toward the circumference of the sealant.

6 . The mother substrate assembly of claim 1 , wherein
the first irradiation line comprises a plurality of disconnected points formed along the edge of the sealant, and the second irradiation line is a straight line parallel to each edge of the unit liquid crystal panel.

7 . A mother substrate assembly, comprising:
a first mother substrate and a second mother substrate formed with a plurality of unit liquid crystal panels; and a sealant formed between the first mother substrate and the second mother substrate and combining the mother substrates, wherein the sealant encloses a circumference of each unit liquid crystal panel, and is completely removed or partially removed in an area from a center of the sealant to an edge farther from the unit liquid crystal panel such that adherence with the mother substrate is lost.

8 . A mother substrate assembly, comprising:
a first mother substrate and a second mother substrate formed with a plurality of unit liquid crystal panels; and a sealant formed between the first mother substrate and the second mother substrate and combining the mother substrates, wherein the sealant encloses a circumference of each unit liquid crystal panel, and includes a first irradiation line starting from an edge of the sealant, repeating with a zigzag pattern to a center of the sealant, and progressing along a formation direction of the sealant.

9 . The mother substrate assembly of claim 1 , wherein
a distance from the sealant to the second irradiation line is less than 0.3 mm.

10 . A method of cutting a liquid crystal panel, the method comprising:
combining a first mother substrate and a second mother substrate formed with a plurality of unit liquid crystal panels by a sealant; firstly irradiating a laser to the sealant; secondly irradiating the laser to a region closer to the unit liquid crystal panel than a position of the first laser irradiation of the sealant; and cutting the combined mother substrate along the second laser irradiation region.

11 . The method of claim 10 , wherein the sealant encloses each unit liquid crystal panel, and the mother substrate is divided into a display area inside the sealant and a dummy region outside the sealant.

12 . The method of claim 11 , wherein after the first laser irradiation, the sealant of the region irradiated by the laser is removed to form an empty space or is partially removed such that adherence between the sealant and the mother substrate is lost.

13 . The method of claim 12 , wherein the gas generated in the first laser irradiation is discharged to the dummy region.

14 . The method of claim 10 , wherein
the first laser irradiation is formed of a linear shape along a progressing direction of the sealant, and the direction of the first laser irradiation and the direction of the second laser irradiation are parallel to each other.

15 . The method of claim 14 , further comprising after the first laser irradiation and prior to the second laser irradiation, additionally irradiating the laser to the region closer to the unit liquid crystal panel than the position of the first laser irradiation of the sealant, the position of the second laser irradiation of the sealant being closer to the unit liquid crystal panel than the position of the additional laser irradiation.

16 . The method of claim 10 , wherein:
the first laser irradiation progresses in a direction from the center of the sealant toward the circumference of the sealant; the second laser irradiation is performed in a direction perpendicular to the first laser irradiation along the progressing direction of the sealant; and after the laser irradiation, a groove of a shape such as a comb is formed in a direction from the center of the sealant farther from the liquid crystal panel.

17 . The method of claim 10 , wherein:
the first laser irradiation is performed to produce an island shape along the progressing direction for the sealant; after the first laser irradiation, a circle groove of the island shape is continuously formed along the progressing direction of the sealant in the sealant; and the second laser irradiation is performed in the direction parallel to the progressing direction of the groove of the island shape formed through the first laser irradiation.

18 . The method of claim 10 , wherein a width of the sealant remained in the cut liquid crystal panel is less than 0.3 mm.

19 . A method of cutting a liquid crystal panel, comprising:
providing a first mother substrate and a second mother substrate formed with a plurality of unit liquid crystal panels; combining the first mother substrate and the second mother substrate by a sealant enclosing each unit liquid crystal panel and dividing the mother substrate into a display area inside the sealant and a dummy region outside the sealant; removing the sealant by a laser having a wider width than a width from a center of the sealant to the dummy region; and cutting the combined mother substrate along the removed sealant.

20 . The method of claim 19 , wherein
the laser irradiation uses the laser starting from the dummy region outside the sealant and repeating in a right and left pattern to the center of the sealant.

Assignees

• Samsung Display Co Ltd

Inventors

• Kim Min Su
• Kim Jang-Hyun
• Kang Tae Wook
• Cha Tae Woon

Classifications

• G02F1/1339 Primary

  Gaskets; Spacers; Sealing of cells · CPC title

• G02F1/133351

  Manufacturing of individual cells out of a plurality of cells, e.g. by dicing · CPC title

• G02F1/1333 Primary

  Constructional arrangements; {Manufacturing methods}(G02F1/135, G02F1/136 take precedence) · CPC title