Single wafer processing environments with spatial separation

US11894257B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11894257-B2
Application numberUS-201816171785-A
CountryUS
Kind codeB2
Filing dateOct 26, 2018
Priority dateOct 27, 2017
Publication dateFeb 6, 2024
Grant dateFeb 6, 2024

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

Apparatus and methods to process one or more wafers are described. A plurality of process stations are arranged in a circular configuration around a rotational axis. A support assembly with a rotatable center base defining a rotational axis, at least two support arms extending from the center base and heaters on each of the support arms is positioned adjacent the processing stations so that the heaters can be moved amongst the various process stations to perform one or more process condition.

First claim

Opening claim text (preview).

What is claimed is: 1. A support assembly comprising: a rotatable center base defining a rotational axis; at least two support arms extending from the rotatable center base, each of the support arms having an inner end in contact with the center base and an outer end further from the rotational axis than the inner end; a plurality of heaters, each heater positioned on the outer end of each of the support arms, each of the plurality of heaters having a support surface with a center located a distance from the rotational axis so that upon rotation of the center base the heaters move in a circular path; and a channel formed in the rotatable center base and the support arms, the channel configured to route electrical connections to the plurality of heaters; wherein the support surfaces of the heaters are substantially coplanar. 2. The support assembly of claim 1 , wherein the support arms extend orthogonal to the rotational axis. 3. The support assembly of claim 1 , wherein there are three support arms and three heaters. 4. The support assembly of claim 1 , wherein there are four support arms and four heaters. 5. The support assembly of claim 1 , wherein the heaters comprise an electrostatic chuck. 6. The support assembly of claim 1 , further comprising at least one motor connected to the center base, the at least one motor configured to rotate the support assembly around the rotational axis. 7. The support assembly of claim 6 , wherein the at least one motor is configured to move the center base in a direction along the rotational axis. 8. The support assembly of claim 1 , further comprising at least one sealing platform around the plurality of heaters, at least one sealing platform having a top surface forming a major plane that is substantially parallel with a major plane formed by the support surface of the plurality of heater. 9. The support assembly of claim 8 , wherein there is a plurality of sealing platforms and each of the plurality of heaters has a sealing platform positioned around the heater, each of the sealing platforms forming a ring shaped top surface. 10. The support assembly of claim 8 , further comprising a support plate having a plurality of openings, each of the plurality of openings surrounding a support surface of one of the plurality of heaters. 11. A support assembly comprising: a rotatable center base defining a rotational axis; at least two support arms extending from the center base orthogonal to the rotational axis, each of the support arms having an inner end in contact with the center base and an outer end; a heater positioned on the outer end of each of the support arms, each of the heaters having a support surface configured to support a substrate during processing and each of the support surfaces are substantially coplanar, the heaters comprising an electrostatic chuck, each heater having a ring shaped sealing platform positioned around the heater, the sealing platforms having a top surface forming a plane that is substantially parallel with a plane formed by the support surface of the heaters; a channel formed in the rotatable center base and the support arms, the channel configured to route electrical connections to the plurality of heaters; a first motor connected to the rotatable center base to rotate the rotatable center base, support arms and heaters around the rotational axis; and a second motor connected to the rotatable center base to move the rotatable center base, support arms and heaters in a direction along the rotational axis. 12. A processing chamber comprising: a housing having walls, a bottom and a top defining an interior volume; a plurality of process stations in the interior volume of the housing, the process stations positioned in a circular arrangement around a rotational axis, each process station comprising a gas injector having a front face, the front face of each of the gas injectors being substantially coplanar; and a support assembly in the interior volume of the housing, the support assembly positioned below the plurality of process stations, the support assembly including a rotatable center base with a plurality of support arms extending from the center base, each support arm having an inner end in contact with the center base and an outer end, a heater is positioned on the outer end of each of the support arms so that upon rotation of the center base the heaters move in a circular path, the heaters having a support surface configured to support a substrate during processing, and a channel is formed in the rotatable center base and the support arms, the channel configured to route electrical connections to the heater; wherein the support surfaces of the heaters are substantially coplanar. 13. The processing chamber of claim 12 , wherein the support arms extend orthogonal to the rotational axis. 14. The processing chamber of claim 12 , wherein there are an equal number of heaters, support arms and process stations configured so that each of the support surfaces of the heaters can be located adjacent the front face of a different process station at the same time. 15. The processing chamber of claim 12 , wherein the heaters comprise an electrostatic chuck. 16. The processing chamber of claim 12 , further comprising at least one motor connected to the center base, the at least one motor configured to rotate the support assembly around the rotational axis. 17. The processing chamber of claim 12 , wherein each heater further comprises a sealing platform positioned around the heater, the sealing platform having a top surface forming a major plane that is substantially parallel with a major plane formed by the support surface of the heater.

Assignees

Inventors

Classifications

  • characterised by supporting two or more semiconductor substrates · CPC title

  • characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel · CPC title

  • Details of electrostatic chucks · CPC title

  • Temperature monitoring · CPC title

  • characterised by the construction of the processing chambers, e.g. modular processing chambers · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US11894257B2 cover?
Apparatus and methods to process one or more wafers are described. A plurality of process stations are arranged in a circular configuration around a rotational axis. A support assembly with a rotatable center base defining a rotational axis, at least two support arms extending from the center base and heaters on each of the support arms is positioned adjacent the processing stations so that the…
Who is the assignee on this patent?
Applied Materials Inc
What technology area does this patent fall under?
Primary CPC classification H10P72/7624. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Feb 06 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).