Methods and apparatus for a hybrid capacitively-coupled and an inductively-coupled plasma processing system

US9287096B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9287096-B2
Application numberUS-23717908-A
CountryUS
Kind codeB2
Filing dateSep 24, 2008
Priority dateSep 27, 2007
Publication dateMar 15, 2016
Grant dateMar 15, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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Abstract

Official abstract text for this publication.

A capacitively-coupled plasma (CCP) processing system having a plasma processing chamber for processing a substrate is provided. The capacitively-coupled Plasma (CCP) processing system includes an upper electrode and a lower electrode for processing the substrate, which is disposed on the lower electrode during plasma processing. The capacitively-coupled Plasma (CCP) processing system also includes an array of inductor coils arrangement configured to inductively sustain plasma in a gap between the upper electrode and the lower electrode.

First claim

Opening claim text (preview).

What is claimed is: 1. A capacitively-coupled plasma (CCP) processing system having a plasma processing chamber capable of both CCP processing and inductively coupled plasma processing for processing a substrate, comprising: at least an upper electrode and a lower electrode for processing said substrate, said substrate being disposed on said lower electrode during plasma processing, wherein the upper electrode has at least one slit extending through the upper electrode; and an array of inductor coils arrangement having a plurality of inductor coils, said array of inductor coils arrangement being disposed above and in contact with said upper electrode, said array of inductor coils arrangement configured to inductively sustain plasma in a gap between said upper electrode and said lower electrode, wherein individual ones of at least a subset of said plurality of inductor coils are independently controllable with respect to and between phase and RF power, wherein said array of inductor coils arrangement includes at least a set of magnetic cores, wherein each magnetic core is a single unitary magnetic core, and a set of coils, each single unitary magnetic core is wound with a coil of said set of coils, wherein a first magnetic core in said set of magnetic cores is separated from an adjacent magnetic core by a distance of about 25 percent to 100 percent of said gap between said upper electrode and said lower electrode. 2. The CCP processing system of claim 1 further comprising at least one radio frequency (RF) power source, said RF power source being configured to capacitively ignite and sustain plasma between said upper electrode and said lower electrode. 3. The CCP processing system of claim 2 , wherein said RF power source has an RF frequency of at least one of about 2 MHz, about 27 MHz, and about 60 MHz. 4. The CCP processing system of claim 1 , wherein said each magnetic core of said set of magnetic cores is a bobbin, said bobbin in a set of bobbins is magnetically coupled by a set of magnetic connectors so that a magnetic field of each said bobbin in said set of bobbins couples with any opposing magnetic pole of adjacent ones of said set of bobbins. 5. The CCP processing system of claim 4 , wherein said set of magnetic connectors is disposed on said set of magnetic cores to complete magnetic circuits for adjacent pairs of bobbins. 6. The CCP processing system of claim 4 , wherein a first bobbin in said set of bobbins is arranged in alternating, opposing magnetic pole to an adjacent bobbin. 7. The CCP processing system of claim 4 , wherein said set of connectors is at least one of a set of magnetic straps and a magnetic plate. 8. The CCP processing system of claim 7 , wherein said set of magnetic connectors includes at least said set of magnetic straps formed of at least one of ferrite and powder iron. 9. The CCP processing system of claim 4 , wherein each magnetic connector of said set of magnetic connectors is a magnetic material, said magnetic material is made of at least one of ferrite and powder iron. 10. The CCP processing system of claim 1 , wherein said each magnetic core of said set of magnetic cores is a horseshoe magnet. 11. The CCP processing system of claim 1 , wherein each magnetic core of said set of magnetic cores is a magnetic material, said magnetic material is made of at least one of ferrite and powder iron. 12. The CCP processing system of claim 1 , wherein said upper electrode is configured with an electrostatic shield having slits all the way through the surface of the upper electrode generally radial to said inductor coils. 13. The CCP processing system of claim 1 , wherein inductor coils in said array of inductor coils arrangement are arranged in a self-similar pattern. 14. The CCP processing system of claim 1 , wherein said inductor coils in said array of inductor coils arrangement are arranged in a predetermined pattern. 15. The CCP processing system of claim 1 , wherein said upper electrode is counter-bored to at least partially bury said individual ones of at least a subset of said plurality of inductor coils in said upper electrode. 16. The CCP processing system of claim 1 , wherein inductor coils in said array of inductor coils arrangement are arranged in an alternating concentric ring pattern. 17. A plasma processing system having a plasma processing chamber capable of both CCP processing and inductively-coupled plasma processing for processing a substrate, comprising: at least an upper electrode and a lower electrode for processing said substrate, said substrate being disposed on said lower electrode during plasma processing wherein the upper electrode has at least one slit extending through the upper electrode; and an array of inductor coils arrangement having a plurality of inductor coils, said array of inductor coils arrangement being disposed above and in contact with said upper electrode, each inductor coil of said array of inductor coils arrangement employing a single unitary magnetic core of magnetic material and configured to inductively sustain plasma in a gap between said upper electrode and said lower electrode, wherein individual ones of at least a subset of said plurality of inductor coils are independently controllable with respect to and between phase and RF power and wherein magnetic cores of adjacent ones of said a subset of said plurality of inductor coils are arranged in an alternating pole configuration, wherein a first magnetic core in said magnetic cores is separated from an adjacent magnetic core of said magnetic cores that is adjacent to said first magnetic core by a distance of about 25 percent to 100 percent of said gap between said upper electrode and said lower electrode. 18. The plasma processing system of claim 17 wherein said magnetic core material is formed from ferrite. 19. The plasma processing system of claim 17 , wherein said magnetic core material is formed from powder iron.

Assignees

Inventors

Classifications

  • Magnetic control means · CPC title

  • the radio frequency energy being inductively coupled to the plasma · CPC title

  • the radio frequency energy being capacitively coupled to the plasma · CPC title

  • Particular magnets or magnet arrangements for controlling the discharge · CPC title

  • Antennas, e.g. particular shapes of coils · CPC title

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What does patent US9287096B2 cover?
A capacitively-coupled plasma (CCP) processing system having a plasma processing chamber for processing a substrate is provided. The capacitively-coupled Plasma (CCP) processing system includes an upper electrode and a lower electrode for processing the substrate, which is disposed on the lower electrode during plasma processing. The capacitively-coupled Plasma (CCP) processing system also incl…
Who is the assignee on this patent?
Marakhtanov Alexei, Hudson Eric, Dhindsa Rajinder, and 2 more
What technology area does this patent fall under?
Primary CPC classification H01J37/32091. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Mar 15 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).