Back-side wafer modification

Patent metadata

Field	Value
Publication number	US-11830778-B2
Application number	US-202017095931-A
Country	US
Kind code	B2
Filing date	Nov 12, 2020
Priority date	Nov 12, 2020
Publication date	Nov 28, 2023
Grant date	Nov 28, 2023

Abstract

A method can include obtaining characteristic data for a wafer. The characteristic data can correspond to the wafer in a processed state and can include a set of stress values of the wafer. The wafer can include a front side, a back side opposite the front side, and a set of regions. The set of stress values can include a first stress value corresponding to a first region. In the processed state, one or more front-side processes can be completed on the front side of the wafer. The method can include determining that the first stress value exceeds a stress threshold and generating a compensation map. The compensation map can identify one or more regions for forming one or more trenches. The method can include initiating, based on the compensation map, a formation of a first trench on the back side of the wafer in the first region.

First claim

What is claimed is:

1. A device comprising:
a wafer having a front side and a back side, the front side configured to receive front-side processing features that form one or more electronic circuits including a set of deep trenches, the back side opposite to the front side;
the back side comprising a back-side surface and a first set of trenches, the first set of trenches comprising a first trench and a second trench in a region of the wafer selected based on a potential for bowing of the wafer in the region,
wherein the region of the wafer is selected by: obtaining characteristic data for the region of the wafer that includes stress values of the region of the wafer, comparing the characteristic data to a threshold corresponding to the potential for bowing in the region of the wafer, and
selecting the region of the wafer based on the characteristic data exceeding the threshold,
wherein the first trench is substantially parallel to the second trench, and
wherein the first trench and the second trench extend substantially perpendicularly from the back-side surface toward the front side and beneath the set of deep trenches to compensate the bowing of the wafer in the region.

2. The device of claim 1 , wherein the first trench and the second trench include a material that substantially fills the first trench and the second trench, the material selected from the group consisting of gold, lead, an aerogel, or carbon.

3. The device of claim 1 , wherein the back side further comprises a second set of trenches, the second set of trenches comprising a third trench and a fourth trench,
wherein the third trench is substantially parallel to the fourth trench,
wherein the third trench and the fourth trench extend substantially perpendicularly from the back-side surface toward the front side,
wherein the third trench and the fourth trench include a material that substantially fills the third trench and the fourth trench, and
wherein neither the first trench nor the second trench includes the material.

4. The device of claim 3 , wherein the material is selected from the group consisting of copper and aluminum.

5. The device of claim 1 , wherein the set of deep trenches include a first set of deep trenches and a second set of deep trenches.

6. The device of claim 5 , wherein a gap is disposed between the first set of deep trenches and the second set of deep trenches,
wherein no deep trenches are present in the gap, and
wherein the first set of trenches is disposed beneath the gap and between the first set of deep trenches and the second set of deep trenches.

7. The device of claim 5 , wherein a structural support region is disposed beneath the first set of deep trenches and the second set of deep trenches,
wherein the structural support region is disposed above the back-side surface, and
wherein neither the first set of deep trenches, the second set of deep trenches, nor the first set of trenches extends into the structural support region.

8. The device of claim 1 , wherein the first set of trenches further comprises a third trench,
wherein the third trench is substantially parallel to the second trench,
wherein the third trench extends substantially perpendicularly from the back-side surface toward the front side,
wherein a first space having a first width horizontally separates the first trench from the second trench,
wherein a second space having a second width horizontally separates the second trench from the third trench, and
wherein the first width and the second width are substantially equal.

9. A device comprising:
a wafer having a front side and a back side opposite to the front side,
wherein the front side comprises front-side processing features that form one or more electronic circuits, the front-side processing features including a first set of deep trenches and a second set of deep trenches,
wherein a gap is disposed between the first set of deep trenches and the second set of deep trenches,
wherein no deep trenches are present in the gap;
the back side comprising a back-side surface and a first set of trenches, the first set of trenches comprising a first trench and a second trench in a region of the wafer selected based on a potential for bowing of the wafer in the region,
wherein the region of the wafer is selected by: obtaining characteristic data for the region of the wafer that includes stress values of the region of the wafer, comparing the characteristic data to a threshold corresponding to the potential for bowing in the region of the wafer, and
selecting the region of the wafer based on the characteristic data exceeding the threshold,
wherein the first trench is substantially parallel to the second trench, wherein the first trench and the second trench extend substantially perpendicularly from the back-side surface toward the front side, and
wherein the first set of trenches is disposed beneath the gap and between the first set of deep trenches and the second set of deep trenches to compensate the bowing of the wafer in the region.

10. The device of claim 9 , wherein the first trench and the second trench include a material that substantially fills the first trench and the second trench, the material selected from the group consisting of gold, lead, carbon, and an aerogel.

Assignees

• IBM

Inventors

• Wolpert David
• Dechene Daniel James
• Clevenger Lawrence A
• Romain Michael
• Ghosh Somnath

Classifications

• H10P72/0616 Primary

  Monitoring of warpages, curvatures, damages, defects or the like · CPC title

• H10P72/0602

  Temperature monitoring · CPC title

• H10W70/69

  Insulating materials thereof · CPC title

• H10W70/68

  Shapes or dispositions thereof · CPC title

• H10P74/23 Primary

  characterised by multiple measurements, corrections, marking or sorting processes · CPC title