Integrated circuit with backside structures to reduce substrate warp

Patent metadata

Field	Value
Publication number	US-9646938-B2
Application number	US-201514881365-A
Country	US
Kind code	B2
Filing date	Oct 13, 2015
Priority date	Jun 25, 2013
Publication date	May 9, 2017
Grant date	May 9, 2017

Abstract

Wafer bowing induced by deep trench capacitors is ameliorated by structures formed on the reverse side of the wafer. The structures on the reverse side include tensile films. The films can be formed within trenches on the back side of the wafer, which enhances their effect. In some embodiments, the wafers are used to form 3D-IC devices. In some embodiments, the 3D-IC device includes a high voltage or high power circuit.

First claim

The invention claimed is:

1. An integrated circuit, comprising:
a semiconductor substrate having a frontside and a backside;
frontside dielectric and conductive layers which are stacked over one another and configured to exert stress on the frontside of the semiconductor substrate; and
backside dielectric and conductive layers which correspond in a one-to-one manner to the frontside dielectric and conductive layers and which have material compositions corresponding to those of the frontside dielectric and conductive layers, respectively, wherein at least one of the backside dielectric and conductive layers is configured to exert stress on the backside of the semiconductor substrate; and
an additional backside layer exerting additional stress on the backside of the semiconductor substrate.

2. The integrated circuit of claim 1 , wherein the frontside dielectric and conductive layers are disposed in trenches extending into the frontside of the semiconductor substrate.

3. The integrated circuit of claim 2 , wherein the backside of the semiconductor substrate is a planar surface and wherein the backside dielectric and conductive layers are planar layers disposed on the planar surface of the backside of the semiconductor substrate.

4. The integrated circuit of claim 2 , wherein the frontside dielectric and conductive layers comprise:
a first frontside dielectric layer which directly abuts and lines sidewalls and bottom surfaces of the trenches and which extends continuously over the frontside of the semiconductor substrate between the trenches;
a first frontside conductive layer extending continuously over the first frontside dielectric layer, the first frontside conductive layer disposed in the trenches and over the frontside of the semiconductor substrate between the trenches.

5. The integrated circuit of claim 1 , wherein the frontside dielectric and conductive layers are stacked directly over one another and are configured to exert a first substrate-bowing stress on the frontside of the semiconductor substrate.

6. The integrated circuit of claim 5 , wherein the backside dielectric and conductive layers are configured to exert a second substrate-bowing stress on the backside of the semiconductor substrate, the second substrate-bowing stress differing from the first substrate-bowing stress.

7. The integrated circuit of claim 6 , wherein the additional backside layer is configured to exert an additional substrate-bowing stress on the backside of the semiconductor substrate to compensate for a difference between the first and second substrate-bowing stresses.

8. The integrated circuit of claim 1 , wherein there is no layer over the frontside of the semiconductor substrate which has the same thickness and material composition as the additional backside layer.

9. An integrated circuit, comprising:
a semiconductor substrate having a frontside and a backside;
frontside dielectric and conductive layers which are stacked over one another and configured to exert a first substrate-bowing stress on the frontside of the semiconductor substrate; and
backside dielectric and conductive layers which are configured to exert a second substrate-bowing stress on the backside of the semiconductor substrate, where a material composition of a backside conductive layer corresponds to a material composition of a frontside conductive layer; and
an additional layer configured to exert an additional substrate-bowing stress on the frontside or backside of the semiconductor substrate to compensate for a difference between the first and second substrate-bowing stresses.

10. The integrated circuit of claim 9 , wherein the first substrate-bowing stress tends to bow the frontside of the semiconductor substrate into a concave surface and tends to bow the backside of the semiconductor substrate into a convex surface.

11. The integrated circuit of claim 10 , wherein the second substrate-bowing stress tends to reduce an extent of convexity of the convex surface and tends to reduce an extent of concavity of the concave surface.

12. The integrated circuit of claim 11 , wherein the additional layer is disposed over the frontside dielectric and conductive layers and the additional substrate-bowing stress tends to further reduce the extent of convexity of the convex surface and tends to further reduce the extent of concavity of the concave surface.

13. The integrated circuit of claim 9 , wherein the backside dielectric and conductive layers correspond in a one-to-one manner to the frontside dielectric and conductive layers, respectively.

14. The integrated circuit of claim 13 , wherein the backside dielectric and conductive layers have material compositions corresponding to those of the frontside dielectric and conductive layers, respectively.

15. The integrated circuit of claim 9 , wherein the frontside dielectric and conductive layers are disposed in trenches extending into the frontside of the semiconductor substrate.

16. The integrated circuit of claim 15 , wherein the backside of the semiconductor substrate is a planar surface and wherein the backside dielectric and conductive layers are planar layers disposed on the planar surface of the backside of the semiconductor substrate.

17. An integrated circuit, comprising:
a semiconductor substrate having a frontside and a backside, wherein trenches extend into the frontside of the substrate but the backside of the substrate is substantially planar;
frontside dielectric and conductive layers which are stacked over one another and which are arranged in the trenches and are configured to exert a first substrate-bowing stress tending to make the frontside of the semiconductor substrate a concave surface; and
backside dielectric and conductive layers which are configured to exert a second substrate-bowing stress on the backside of the semiconductor substrate to reduce the concavity of the concave surface, the second substrate-bowing stress differing from the first substrate-bowing stress due to the trenches extending into the frontside of the substrate while the backside is substantially planar; and
an additional layer configured to exert an additional substrate-bowing stress on the frontside or backside of the semiconductor substrate to compensate for a difference between the first and second substrate-bowing stresses and further reduce the concavity of the concave surface.

18. The integrated circuit of claim 17 , wherein the frontside dielectric and conductive layers are disposed in trenches extending into the frontside of the semiconductor substrate.

19. The integrated circuit of claim 17 , wherein the backside of the semiconductor substrate is a planar surface and wherein the backside dielectric and conductive layers are planar layers disposed on the planar surface of the backside of the semiconductor substrate.

20. The integrated circuit of claim 17 :
wherein the frontside dielectric and conductive layers comprise:
a first frontside dielectric layer which directly abuts and lines sidewalls and bottom surfaces of the trenches and which extends continuously over the frontside of the semiconductor substrate between the trenches;
a first frontside conductive layer extending continuously over the first frontside dielectric layer, the first frontside conductive layer disposed in the trenches and over the frontside of the semiconductor substrate between the trenches; and

wherein the backside dielectric and conductive layers comprise:
a first backside dielectric layer which has a composition and thickness cor

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Chen Chih-Ming
• Wang Szu-Yu
• Yu Chung-Yi

Classifications

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W72/877

  Bump connectors and die-attach connectors · CPC title

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/732

  between stacked chips · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title