Add-in module

Patent metadata

Field	Value
Publication number	US-11632878-B2
Application number	US-202117468911-A
Country	US
Kind code	B2
Filing date	Sep 8, 2021
Priority date	May 14, 2021
Publication date	Apr 18, 2023
Grant date	Apr 18, 2023

Abstract

An add-in module is provided. The add-in module includes a substrate, a plurality of first heat sources, a plurality of second heat sources, a heat sink and a heat-dissipation plate. The substrate includes a first substrate surface and a second substrate surface. The first substrate surface is opposite the second substrate surface. The first heat sources are disposed on the first substrate surface. The second heat sources are disposed on the second substrate surface. The heat sink corresponds to the first substrate surface and is thermally connected to the first heat sources, wherein the heat sink includes a heat-sink base and a plurality of heat-dissipation fins, and the heat-dissipation fins are connected to the heat-sink sink base. The heat-dissipation plate corresponds to the second substrate surface and is thermally connected to the second heat sources.

First claim

What is claimed is:

1. An add-in module, comprising:
a substrate, comprising a first substrate surface and a second substrate surface, wherein the first substrate surface is opposite the second substrate surface;
a plurality of first heat sources, disposed on the first substrate surface;
a plurality of second heat sources, disposed on the second substrate surface;
a heat sink, corresponding to the first substrate surface and thermally connected to the first heat sources, wherein the heat sink comprises a heat-sink base and a plurality of heat-dissipation fins, and the heat-dissipation fins are connected to the heat-sink base;
a heat-dissipation plate, corresponding to the second substrate surface and thermally connected to the second heat sources, wherein the first heat sources comprise a central processor chip and a plurality of first memory chips, and the second heat sources comprise a plurality second memory chips;
a plurality of first heat-conductive elements, each of the first heat-conductive elements is disposed between each of the first heat sources and the heat-sink base, and each of the first heat-conductive elements is thermally connected to a respective one of the first heat sources and the heat-sink base;
a plurality of second heat-conductive elements, each of the second heat-conductive elements is disposed between each of the second heat sources and the heat-dissipation plate, and each of the second heat-conductive elements is thermally connected to a respective one of the second heat sources and the heat-dissipation plate;
a plurality of fasteners, wherein the fasteners are affixed to the substrate, the heat sink and the heat-dissipation plate, wherein the heat-dissipation plate comprises a plurality of protruding portions, the fasteners pass through the protruding portions, each of the protruding portions has a top surface, and the top surface abuts the second substrate surface, wherein the heat sink comprises a plurality of posts, each of the posts comprises a fastening hole, the posts correspond to the protruding portions, and each of the fasteners passes through a corresponding one of the protruding portions and is affixed to the fastening hole of a corresponding one of the posts; and
a bracket, wherein the protruding portions comprises a plurality of first protruding portions, the bracket comprises a plurality of bracket fastening portions, the fasteners comprise a plurality of first fasteners, the posts comprise a plurality of first posts, the first fasteners pass through a corresponding one of the first protruding portions, the substrate, and the bracket fastening portions and are affixed to the first posts.

2. The add-in module as claimed in claim 1 , wherein the fasteners further comprise a plurality of second fasteners, the protruding portions further comprise a plurality of second protruding portions, the posts comprise a plurality of second posts, the second fasteners pass through a corresponding one of the second protruding portions and the substrate and are affixed to the second posts, the first posts abut the bracket fastening portions, and the second posts abut the substrate.

3. The add-in module as claimed in claim 1 , further comprising a capacitor, wherein the capacitor is disposed on the first substrate surface, a base notch is formed on the heat-sink base, and the capacitor passes through the base notch.

Assignees

• Shannon Systems Ltd

Inventors

• Li Jiangshan

Classifications

• H10W40/242

  comprising thermal conductors between chips and the and the arrangements for cooling, e.g. compliant heat-spreaders · CPC title

• H10W40/611

  Bolts or screws · CPC title

• G06F1/20 Primary

  Cooling means · CPC title

• H05K7/20472

  Sheet interfaces · CPC title

• G06F1/187

  Mounting of fixed or removable disk drives · CPC title