Solid-state drive device

Patent metadata

Field	Value
Publication number	US-10186471-B2
Application number	US-201715651106-A
Country	US
Kind code	B2
Filing date	Jul 17, 2017
Priority date	Nov 30, 2016
Publication date	Jan 22, 2019
Grant date	Jan 22, 2019

Abstract

A solid-state drive device is provided. The solid-state drive device includes a housing, a first circuit board, and a second circuit board. The housing includes a first side and a second side. The first side is opposite to the second side. At least one first ventilation hole is formed on the first side. At least one second ventilation hole is formed on the second side. The first circuit board is disposed in the housing. The second circuit board is disposed in the housing. The second circuit board is coupled to the first circuit board. A gap is formed between the first circuit board and the second circuit board. The first ventilation hole and the second ventilation hole correspond to the gap.

First claim

What is claimed is:

1. A solid-state drive device, comprising:
a housing, comprising a first side and a second side, wherein the first side is opposite to the second side, at least one first ventilation hole is formed on the first side, and at least one second ventilation hole is formed on the second side;
a first circuit board, disposed in the housing; and
a second circuit board, disposed in the housing, wherein the second circuit board is coupled to the first circuit board, a gap is formed between the first circuit board and the second circuit board, and the first ventilation hole and the second ventilation hole correspond to the gap; and
a controller, wherein the housing comprises a first member and a second member, the first member is combined with the second member, the controller is disposed on the first circuit board, the controller faces the first member, and the controller is thermally connected to the first member by solid conduction,
wherein there is no spacing metal plate formed between the first circuit board and the second circuit board,
wherein the first circuit board and the second circuit board are substantial the same size.

2. The solid-state drive device as claimed in claim 1 , further comprising a plurality of first memory chips and a plurality of second memory chips, the first memory chips are disposed on the first circuit board, the second memory chips are disposed on the second circuit board, and at least a portion of the first memory chips and at least a portion of the second memory chips are disposed in the gap.

3. The solid-state drive device as claimed in claim 2 , wherein at least a portion of the first memory chips face the first member, and at least a portion of the second memory chips face the second member.

4. The solid-state drive device as claimed in claim 3 , wherein at least a portion of the first memory chips and at least a portion of the second memory chips are located in the gap, and at least a portion of the first memory chips correspond to at least a portion of the second memory chips in the gap.

5. The solid-state drive device as claimed in claim 4 , wherein the second memory chips comprise a second memory chip array, and at least a second flow path is defined by the second memory chip array.

6. The solid-state drive device as claimed in claim 5 , wherein the first memory chips comprise a first memory chip array, at least a first flow path is defined by the first memory chip array, and the first flow path corresponds to the second flow path.

7. The solid-state drive device as claimed in claim 2 , further comprising a plurality of conversion head screws and a plurality of fastening screws, wherein each conversion head screw comprises a convex portion and a concave portion, the convex portion affixes the first circuit board to the first member, and each fastening screw affixes the second circuit board to the concave portion.

8. The solid-state drive device as claimed in claim 7 , further comprising a plurality of fixing screws, and the fixing screws directly affix the first member to the second member.

9. The solid-state drive device as claimed in claim 2 , wherein the first member comprises a recess and a heat dissipation structure, the recess is formed on an inner surface of the first member and faces the controller, and the heat dissipation structure is formed on an outer surface of the first member.

10. A solid-state drive device, comprising:
a housing, comprising a first side and a second side, wherein the first side is opposite to the second side, at least one first ventilation hole is formed on the first side, and at least one second ventilation hole is formed on the second side;
a first circuit board, disposed in the housing, wherein the first circuit board comprises a gold finger area; and
a second circuit board, disposed in the housing, wherein the second circuit board is coupled to the first circuit board, a gap is formed between the first circuit board and the second circuit board, and the first ventilation hole and the second ventilation hole correspond to the gap,
wherein the whole solid-state drive device is adapted to be coupled to a computer or a server merely via the gold finger area,
wherein there is no spacing metal plate formed between the first circuit board and the second circuit board.

11. The solid-state drive device as claimed in claim 10 , further comprising a controller, wherein the housing comprises a first member and a second member, the first member is combined with the second member, the controller is disposed on the first circuit board, the controller faces the first member, and the controller is thermally connected to the first member by conduction.

12. The solid-state drive device as claimed in claim 11 , further comprising a plurality of first memory chips and a plurality of second memory chips, the first memory chips are disposed on the first circuit board, the second memory chips are disposed on the second circuit board, and at least a portion of the first memory chips and at least a portion of the second memory chips are disposed in the gap.

13. The solid-state drive device as claimed in claim 12 , wherein at least a portion of the first memory chips face the first member, and at least a portion of the second memory chips face the second member.

14. The solid-state drive device as claimed in claim 13 , wherein at least a portion of the first memory chips and at least a portion of the second memory chips are located in the gap, and at least a portion of the first memory chips correspond to at least a portion of the second memory chips in the gap.

15. The solid-state drive device as claimed in claim 14 , wherein the second memory chips comprise a second memory chip array, and at least a second flow path is defined by the second memory chip array.

16. The solid-state drive device as claimed in claim 15 , wherein the first memory chips comprise a first memory chip array, at least a first flow path is defined by the first memory chip array, and the first flow path corresponds to the second flow path.

17. The solid-state drive device as claimed in claim 12 , further comprising a plurality of conversion head screws and a plurality of fastening screws, wherein each conversion head screw comprises a convex portion and a concave portion, the convex portion affixes the first circuit board to the first member, and each fastening screw affixes the second circuit board to the concave portion.

18. The solid-state drive device as claimed in claim 17 , further comprising a plurality of fixing screws, and the fixing screws directly affix the first member to the second member.

19. The solid-state drive device as claimed in claim 12 , wherein the first member comprises a recess and a heat dissipation structure, the recess is formed on an inner surface of the first member and faces the controller, and the heat dissipation structure is formed on an outer surface of the first member.

Assignees

• Shannon Systems Ltd

Inventors

• Chen Xiaoyan

Classifications

• H05K2201/10159

  Memory · CPC title

• H05K7/20727

  within server blades for removing heat from heat source · CPC title

• G06F1/20

  Cooling means · CPC title

• G11B33/142

  by air cooling · CPC title

• G11B33/121 Primary

  the apparatus comprising a single recording/reproducing device · CPC title