Solid state drive device and computer server system including the same

Patent metadata

Field	Value
Publication number	US-11272640-B2
Application number	US-202016740593-A
Country	US
Kind code	B2
Filing date	Jan 13, 2020
Priority date	Nov 5, 2018
Publication date	Mar 8, 2022
Grant date	Mar 8, 2022

Abstract

A solid-state drive device includes a first module including a first region containing a volatile main memory device and a controller device and a second region containing a first nonvolatile memory device, a second module disposed on the first module and having a third region containing a second nonvolatile memory device, the second module being connected to the first module, and a heat dissipating member disposed on the second module as vertically juxtaposed with the first and second modules. The heat dissipating member has a protruding portion protruding toward the first module and in direct thermal contact with the first region, and a plate-shaped portion having a main surface in direct thermal contact with the third region.

First claim

What is claimed is:

1. A solid-state drive device comprising:
a first module including a volatile main memory device, a controller and a first nonvolatile memory device, the first module having a first region containing the volatile main memory device and the controller and a second region containing the first nonvolatile memory device;
a second module disposed on the first module, the second module overlapping the second region of the first module as viewed in a plan view of the solid-state drive device, the second module including a second nonvolatile memory device and having a third region containing the second nonvolatile memory device; and
a heat dissipating member disposed on the second module such that the second module is interposed between the heat dissipating member and the first module, the heat dissipating member having a first surface disposed toward the first module and a second surface opposite the first surface,
wherein the heat dissipating member has a plate-shaped portion and a protruding portion disposed at the first surface,
the protruding portion protrudes toward the first module relative to the plate-shaped portion and is in direct thermal contact with the first region of the first module, and
the plate-shaped portion is in direct thermal contact with the third region of the second module.

2. The solid-state drive device of claim 1 , wherein the protruding portion has a first protruding section and a second protruding section,
the first protruding section is vertically juxtaposed with the first region, and
the second protruding section is vertically juxtaposed with a portion of the second region.

3. The solid-state drive device of claim 2 , wherein the second module has an open region in the plane of the second module, and
the open region has a first part overlying the second region and a second part overlying the first region.

4. The solid-state drive device of claim 3 , wherein the third region is divided into two parts by the second part.

5. The solid-state drive device of claim 1 , wherein the protruding portion has a first protruding section and a second protruding section,
the first protruding section is vertically juxtaposed with the first region, and
the second protruding section is vertically juxtaposed with the second region.

6. The solid-state drive device of claim 1 , wherein the heat dissipating member is elongated in one direction, and
the heat dissipating member has at least one groove extending disposed along the one direction on the first surface.

7. The solid-state drive device of claim 1 , wherein the heat dissipating member is elongated in one direction,
the protruding portion has at least one air passageway extending therethrough in the one direction, and
the at least one air passageway is open at the second surface.

8. The solid-state drive device of claim 1 , wherein the heat dissipating member is elongated in one direction, and
the heat dissipating member has at least one groove extending disposed along the one direction on the second surface.

9. A solid-state drive device comprising:
a heat dissipating member having a first surface and a protrusion protruding from a main part of the first surface, whereby a distal end of the protrusion and the main part of the first surface are disposed at a different levels in the solid-state drive device;
a first module having a plurality of first semiconductor chips comprise a volatile main memory device, a controller and a first nonvolatile memory device, at least a portion of the plurality of first semiconductor chips being in direct thermal contact with the distal end of the protrusion of the heat dissipating member; and
a second module spaced apart from and interposed between the heat dissipating member and the first module, the second module having a plurality of second semiconductor chips comprise a second nonvolatile memory device, at least a portion of the plurality of second semiconductor chips being in direct thermal contact with the main part of the first surface of the heat dissipating member,
wherein the protrusion is elongated in one direction, and
a width of the protrusion is smaller than a width of the first module.

10. The solid-state drive device of claim 9 , wherein the controller comprises at least one interface of a peripheral component interconnect express (PCIe), a remote direct memory access (RDMA) via Ethernet, a Serial Advanced Technology Attachment (SATA), Fibre Channel, Serial Attached SCSI (SAS), Nonvolatile Memory Express (NVMe), and a standard protocol such as Ethernet or Universal Serial Bus (USB).

11. The solid-state drive device of claim 9 , wherein a length of the protrusion is substantially the same with a length of the first module.

12. A computer server system comprising:
an enclosure having opposite ends and provided with a bay at one of the opposite ends;
a card adapter disposed in the bay; and
a solid-state drive device mounted on the card adapter,
wherein the solid-state drive device includes a first module, a second module and a heat dissipating member juxtaposed with and physically connected to each other,
the first module including a volatile main memory device, a controller and a first nonvolatile memory device, and the first module having a first region containing the volatile main memory device and the controller and a second region containing the first nonvolatile memory device,
the second module being interposed between the heat dissipating member and the first module, the second module overlapping the second region of the first module when viewed in a direction in which the first module, the second module and the heat dissipating member are juxtaposed, and the second module including a second nonvolatile memory device and having a third region containing the second nonvolatile memory device, and
the heat dissipating member having a plate-shaped portion and a protruding portion, the protruding portion protruding toward the first module relative to the plate-shaped portion and in thermal contact with the first region of the first module, and the plate-shaped portion juxtaposed with respective portions of the first and second modules and in thermal contact with the third region of the second module.

13. The computer server system of claim 12 , further comprising a cooling fan disposed at the other of the opposite ends of the enclosure and oriented to blow air in a first direction from said other of the opposite ends of the closure to said one of the opposite ends of the enclosure.

14. The computer server system of claim 13 , wherein the protruding portion of the heat dissipating member of the solid-state drive device has at least one air passageway extending therethrough in the first direction.

15. The computer server system of claim 14 , wherein the at least one air passageway is open toward two edges of the second module which face each other.

16. The computer server system of claim 12 , wherein the bay is an add-in card (AIC) form factor bay, and
the card adapter is an AIC form factor card adapter.

17. The computer server system of claim 12 , wherein the heat dissipating member is in direct thermal contact with the second nonvolatile memory device.

18. The computer server system of claim 17 , comprising thermal interface material (TIM) interposed between the heat dissipating member and the second nonvolatile memory device to provide the thermal contact of the heat dissipating member with the second nonvolatile memory device.

19. The computer server system of claim 12 ,

Assignees

• Samsung Electronics Co Ltd

Inventors

• Hur Sung Chul
• Kong Do Il

Classifications

• H10W40/226

  characterised by projecting parts, e.g. fins to increase surface area (leadframes for cooling H10W70/461) · CPC title

• H05K5/30

  Side-by-side or stacked arrangements · CPC title

• H05K7/2039

  characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00) · CPC title

• H05K7/20727 Primary

  within server blades for removing heat from heat source · CPC title

• H05K7/20472

  Sheet interfaces · CPC title