SSD internal thermal transfer element

Patent metadata

Field	Value
Publication number	US-10085364-B2
Application number	US-201615295558-A
Country	US
Kind code	B2
Filing date	Oct 17, 2016
Priority date	Aug 11, 2016
Publication date	Sep 25, 2018
Grant date	Sep 25, 2018

Abstract

An assembly includes a drive housing and a first printed circuit board (PCB) with at least one solid-state memory component, the first PCB having a first surface, where the first PCB is located within the drive housing. The assembly also includes a second PCB with at least one solid-state memory component, where the second PCB is operatively electronically coupled to the first PCB, the second PCB having a second surface, and where the second PCB is located within the drive housing. The assembly also includes a first thermal transfer element configured for partial thermal communication between the first PCB and the second PCB through the first and second surfaces, where the first thermal transfer element is shaped to include a partially thermally insulating air gap located between the first and the second PCB, and where the first thermal transfer element is in thermal communication with the drive housing.

First claim

What is claimed is:

1. An assembly, comprising:
a drive housing;
a first printed circuit board (PCB) with a first solid-state memory component disposed thereon, the first PCB having a first surface, wherein the first PCB is located within the drive housing;
a second PCB with a second solid-state memory component disposed thereon, wherein the second PCB is operatively electronically coupled to the first PCB, the second PCB having a second surface, and wherein the second PCB is located within the drive housing; and
a first thermal transfer element configured for partial thermal communication between the first PCB and the second PCB through the first and second surfaces, wherein the first thermal transfer element is supported relative to the drive housing and is shaped to include a partially thermally insulating air gap located between the first and the second PCB, wherein a first thermal interface material is disposed between the first thermal transfer element and the first PCB, and wherein the first thermal transfer element is in thermal communication with the drive housing by way of its support relative to the drive housing.

2. The assembly of claim 1 , further comprising:
a frame located within the drive housing, wherein the frame is configured to support and guide placement of the first thermal transfer element within the drive housing.

3. The assembly of claim 2 , wherein the frame is also configured to support and guide placement of the first and second PCB within the drive housing.

4. The assembly of claim 1 , wherein the air gap is hermetically sealed.

5. The assembly of claim 1 , wherein the first thermal transfer element is configured to at least partially thermally insulate the first PCB from the second PCB.

6. The assembly of claim 1 , wherein the first and second PCBs are in a parallel and stacked arrangement.

7. The assembly of claim 1 , wherein the air gap is formed by the first thermal transfer element joined to a second thermal transfer element.

8. The assembly of claim 7 , wherein the first and second thermal transfer elements are formed by stamping.

9. The assembly of claim 1 , wherein a second thermal interface material is also disposed between the first thermal transfer element and the second PCB.

10. The assembly of claim 1 , wherein the first thermal transfer element is a plate.

11. A method of making a storage drive, comprising:
supporting a first thermal transfer element within and relative to a drive housing, wherein the first thermal transfer element is configured to communicate thermal energy to the drive housing by way of a manner of supporting the first thermal transfer element relative to the drive housing;
placing a first printed circuit board (PCB) within the drive housing, the first PCB having a first solid-state memory component disposed thereon, wherein the first PCB is in thermal communication with the first thermal transfer element using a first thermal interface material (TIM);
placing a second PCB within the drive housing, the second PCB having a second solid-state memory component disposed thereon, wherein the second PCB is in thermal communication with the first thermal transfer element using a second TIM, and is located opposite the first PCB; and
wherein the first thermal transfer element is configured to allow partial thermal communication between the first and second PCB, and wherein the first thermal transfer element includes a partially thermally insulating air gap located between the first and the second PCB.

12. The method of claim 11 , wherein the first thermal transfer element is placed within the drive housing using a frame configured to support and guide placement of the first thermal transfer element within the drive housing.

13. The method of claim 12 , wherein the frame is also configured to support and guide placement of the first and second PCB within the drive housing.

14. The method of claim 11 , wherein the first and second PCBs are placed in the drive housing in a parallel and stacked arrangement.

15. The method of claim 11 , wherein the air gap is formed by the first thermal transfer element joined to a second thermal transfer element.

16. The method of claim 15 , wherein the first and second thermal transfer elements are formed by stamping.

17. An assembly, comprising:
a drive housing;
a first printed circuit board (PCB) with a first solid-state memory component disposed thereon, the first PCB having a first surface, and wherein the first PCB is located within the drive housing;
a second PCB with a second solid-state memory component disposed thereon, wherein the second PCB is operatively electronically coupled to the first PCB, the second PCB having a second surface, and wherein the second PCB is located within the drive housing;
a first thermal transfer element configured for partial thermal communication with the first surface, wherein the first thermal transfer element includes a partially thermally insulating air gap located between the first PCB and the second PCB, wherein a first thermal interface material is disposed between the first thermal transfer element and the first PCB, and wherein the first thermal transfer element is in thermal communication with the drive housing; and
a frame located within the drive housing, wherein the frame is configured to support and guide placement of the first thermal transfer element within the drive housing.

18. The assembly of claim 17 , wherein the frame is also configured to support and guide placement of the first and second PCB within the drive housing.

19. The assembly of claim 17 , wherein the first thermal transfer element is configured to at least partially thermally insulate the first PCB from the second PCB.

20. The assembly of claim 17 , wherein a second thermal interface material is also disposed between the first thermal transfer element and the second PCB.

Assignees

• Seagate Technology Llc

Inventors

• Voss William Gunther

Classifications

• H05K1/144

  Stacked arrangements of planar printed circuit boards · CPC title

• H05K1/0203

  Cooling of mounted components (H05K1/0272 takes precedence) · CPC title

• H05K1/0201

  Thermal arrangements, e.g. for cooling, heating or preventing overheating · CPC title

• H05K7/20518

  Unevenly distributed heat load, e.g. different sectors at different temperatures, localised cooling, hot spots · CPC title

• H05K7/20436 Primary

  Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing · CPC title